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(Click for frequent words.) 75 Ball Grid Array 71 Wafer Level 69 Chip Scale 69 Leadless 69 WLCSP 69 Inductors 68 Industry Smallest 68 Metallization 68 Fine Pitch 68 TVS Diodes 68 Cable Assemblies 68 Multilayer Ceramic 67 leadframe 67 #nm CMOS [002] 67 Ultra Miniature 67 #nm Process 67 CMOS Image Sensors 66 EMI Filters 66 Reflow 66 NAND Flash Memory 66 UMC #.#um 66 Laser Diode 66 RF Tuner 66 Wafer Bonding 66 Metrology System 66 Land Grid Array 66 Leadframe 66 wirebond 66 Tunable 66 Backplane 66 #.#mm x [003] 66 Demodulator 66 Silicon Carbide 66 Tantalum Capacitors 66 Agilent Technologies Introduces 66 International Rectifier Introduces 65 #.#x#.#mm 65 Varistors 65 Highly Integrated 65 Nanometer 65 advanced leadframe 65 Block Copolymer 65 ESD Protection 65 hydride vapor phase 65 Wafer Scale 65 Epitaxial 65 Boron Nitride 65 pHEMT 65 QFN 65 Timing Belts 65 Substrate 65 epiwafers 65 Photolithography 65 Gallium Arsenide 65 #.# micron CMOS 65 Inductor 65 nm CMOS process 65 Laser Modules 65 eWLB 65 Silicon Germanium 65 monolithically integrated 65 Highly Flexible 65 PWBs 65 Embedded NVM MEMS 65 Flexible CIGS 65 interposers 65 Samsung Develops 64 solder bumps 64 Op Amps 64 Load Cells 64 Gallium Nitride 64 PHEMT 64 Single Wafer 64 Conduction Cooled 64 Mask Aligner 64 Silicon Wafer 64 InGaP 64 Wafer Level Packaging 64 Interposer 64 Linear Actuator 64 Microdisplay 64 Industry Highest Density 64 TECHSPEC 64 RF Microwave 64 Power Amplifiers 64 Stepper Motor 64 interposer 64 TOSA ROSA 64 Optical Transceiver 64 Backplanes 64 Extended Temperature 64 wafer bumping 64 Signal Conditioning 64 Optical Switch 64 Aluminum Nitride 64 Solar Wafer 64 BGA CSP 64 Application Specific 64 5V CMOS 64 Photovoltaic Module 64 Solder Paste 64 Silicon Via 64 #.#mm x #.#mm [003] 64 Field Effect Transistors 64 Voltage Regulator 64 BGA packages 64 Surface Mount 64 PIN photodiodes 64 Thermally Conductive 63 Pluggable 63 High Linearity 63 Z Foil 63 Wafer Level Chip 63 Wire Bonding 63 Microchip Technology Introduces 63 Fusion Splicer 63 Field Effect Transistor 63 pin SOIC 63 #pin [001] 63 leadless 63 SiP System 63 Camera Module 63 Surface Mounted 63 Digitizers 63 copper metallization 63 Optical Modulator 63 PBGA 63 IXYS Introduces 63 PV Cells 63 Tunable Laser 63 surface mountable 63 Carbon Nanotube 63 Epoxy Resin 63 QMEMS 63 Dual Voltage 63 through silicon vias 63 Toshiba Develops 63 #.#um CMOS 63 austriamicrosystems Introduces 63 Polycrystalline 63 PQFP 63 High Concentration Photovoltaic 63 Injection Molded 63 #.#um [001] 63 SFP SFP + 63 FCBGA 63 Reference Designs 63 Package PoP 63 Polyester Film 63 PowerPAK 63 SOI CMOS 63 QSFP + 63 Optical Interconnects 63 MicroFET 63 Gallium Nitride GaN 63 Austriamicrosystems 63 Nitride 63 Serial EEPROM 63 BGA packaging 63 Mbit SRAMs 63 package SiP 63 Optical Profiler 63 DirectFET 63 8mm x 8mm 63 Wafer Level Optics 63 X7R 63 TGA# SM 63 high voltage BCDMOS 62 5mm x 6mm 62 Ferrite 62 PICDEM 62 SiP 62 leadless package 62 SiPs 62 Chip Resistors 62 Flex OneNAND 62 wafer dicing 62 Photoresist 62 Substrates 62 #.# micron node 62 QFNs 62 x 3mm 62 Packet Processor 62 High Brightness LED 62 #nm CMOS [001] 62 Linear Actuators 62 WL CSP 62 SOI Silicon 62 Explosion Proof 62 Texas Instruments OMAP# 62 NanoScope 62 Multimode 62 Input Voltage 62 TQFP packages 62 Self Assembled 62 RoHS Compliant 62 Bipolar Transistor 62 Color Filter 62 TrueStore 62 Schottky diode 62 Serial EEPROMs 62 Bipolar CMOS DMOS BCD 62 GaAs InP 62 monolithic CMOS 62 Automated Optical 62 Embedded Array 62 STMicroelectronics Introduces 62 Processor Cores 62 MTS #A 62 Veeco Introduces 62 EDXRF 62 Flex Rigid 62 Nanowires 62 NOR Flash Memory 62 Diodes Incorporated Announces 62 MEMS Sensor 62 Plasmonic 62 Nanoimprint Lithography 62 Differential Pressure 62 pin LQFP 62 Signal Conditioners 62 SMARTMOS 62 Nonvolatile 62 ARM Processors 62 ATMEL 62 Low Leakage 62 InGaP HBT 62 Solar Module 62 Evaluation Kits 62 multilayer ceramic capacitors MLCC 62 ISSI Announces 62 Monocrystalline 62 Laser Diodes 62 ZMD# 62 Embedded DRAM 62 DrMOS 62 overmolding 62 TQFP 62 underfill 62 Optical Fibers 62 Optocoupler 62 GaAs MESFET 62 8 pin TDFN 62 IGBT Insulated Gate 62 Physical Verification 62 Altera Stratix II 62 Advanced Packaging 61 millisecond annealing 61 CMOS Image Sensor 61 Aspheric Lenses 61 QSOP 61 RF Transceiver 61 Pressure Sensors 61 Conformal Coating 61 Fiberglass Reinforced 61 Attenuator 61 Peregrine UltraCMOS 61 Integrated Passive 61 radial leaded 61 LiNbO3 61 Wafer Fab 61 pin 3mm x 61 Rotary Encoder 61 Superconducting 61 Bonders 61 triplexer 61 4mm x 4mm QFN 61 #mb PowerBook G4 61 Photovoltaic Cells 61 leadframes 61 Zener diodes 61 Oxide Silicon 61 Thin Film Photovoltaics 61 Thin Film Transistors 61 PV Module 61 Silicon Tuner 61 SoC Designs 61 fxP 61 Wear Resistant 61 5mm x 61 epi wafers 61 Quantum Dots 61 Thin Film Solar 61 GaAs MMIC 61 Nanocrystals 61 Thin Film 61 Electron Beam Lithography 61 Dual Interface 61 ARM#EJ processor 61 laser diode modules 61 Power MOSFETs 61 Nanoporous 61 monolithic microwave integrated 61 RFID Inlay 61 Wafer Processing 61 Encapsulant 61 Differential Quadrature Phase 61 CONNECTORS 61 bonder 61 LCD Panels 61 pin TQFP 61 conductive epoxy 61 LCD Displays 61 TOSAs 61 NiSi 61 Corrosion Resistant 61 CdTe Si 61 Sensor Interface 61 CMOS Silicon 61 tiny 3mm x 61 pin 5mm x 61 Signal Processor 61 Crystal Oscillator 61 Mini ITX Motherboard 61 solderable 61 Water Cooled 61 HCS# 61 Silicon Oxide Nitride 61 #GBASE KR 61 Highly Efficient 61 Scanning Probe Microscopes 61 STMicroelectronics Unveils 61 Spintronic 61 MICRO FOOT 61 RFCMOS 61 #nm DRAM 61 ARM#EJ 61 Computational Lithography 61 pin PDIP 61 High Brightness LEDs 61 Bulk Metal 61 Embedded Processor 61 Aluminum Oxide 61 indium phosphide InP 61 overmolded 61 Temperature Sensors 61 Altera Stratix III 61 Polymeric 61 Micromachining 61 Indium Phosphide InP 61 5mm x 5mm QFN 61 DFN# 61 3mm x 61 Immersion Lithography 61 subminiature 61 TECHSPEC ® 61 #GBASE SR# 61 Laser Diode Driver 61 Load Cell 61 AlSiC 61 Chemical Vapor Deposition 61 UMC #nm 61 Position Sensors 61 Heat Dissipation 61 Gallium Arsenide GaAs 61 TQFN 61 Schottky Diode 61 laterally diffused metal 61 Conductive Polymer 61 ISL#M 61 Silicon Via TSV 61 dsPIC#F# 61 TrenchFET 61 Pressure Sensor 61 Elastomeric 61 Highest Efficiency 61 #x#mm [002] 61 Curon Control 61 AMCC QT# 61 C BiCMOS 61 QSFP 61 SO8 61 Vishay Releases 60 Physical Layer PHY 60 mux demux 60 Micrometer 60 Sequans SQN# 60 ARM#EJ S 60 Thin Film Photovoltaic 60 Embedded Module 60 Unidirectional 60 iSPAN 60 DPAK 60 Amorphous Silicon 60 Thin Films 60 Inserter 60 Multi Layer 60 QFN packages 60 RoHs compliant 60 millimeter wave integrated circuits 60 Power MOSFET 60 indium gallium phosphide InGaP 60 2mm x 2mm 60 PQFN 60 dsPIC 60 #G OTN [002] 60 Epson Develops 60 HVIC 60 Multi Gigabit 60 GaAs pHEMT 60 Sensors Transducers 60 VCXO 60 Injection Molding 60 Memory Controllers 60 Printed Circuit Boards 60 Printhead 60 mount SMT 60 pMOS 60 GPON ONT 60 multichip 60 Quad Flat 60 Nanoelectronic 60 Wafer Level Camera 60 TDFN packages 60 amorphous silicon Si 60 Nanofiber 60 Polyacetal 60 ARM#E 60 #.#μm CMOS process 60 Plasma Displays 60 Non Volatile Memory 60 Tessera Licenses 60 Rigid Flex 60 Waterjet Cutting 60 Fujitsu Develops 60 fused quartz 60 ATmega#P [001] 60 Universal Asynchronous Receiver 60 Nanowire 60 aluminum nitride 60 Frequency Synthesizer 60 #nm NAND Flash 60 DDR3 Memory 60 InfiniBand QDR 60 Photonic Integrated Circuit 60 #.#u 60 Inapac 60 cermet 60 Potentiometer 60 Quik Pak 60 IDT Introduces 60 8 pin SOIC 60 Indium Phosphide 60 5mm x 5mm 60 Analog Devices Introduces 60 Multicrystalline 60 SiT# 60 Laser Marking 60 Satellite Terrestrial 60 Positive Temperature Coefficient 60 Driver IC DDI 60 Altera FPGAs 60 Polysilicon Production 60 Transmitter UART 60 Strained Silicon 60 Composite Material 60 QFN# 60 Double Sided 60 Uncooled 60 Picosecond 60 Schottky Diodes 60 Avago Technologies Announces 60 Silicon Nitride 60 ARM#T 60 Mixed Signal IC 60 6mm x 6mm 60 Polyimide 60 Fanless 60 Altera Ships 60 Printed Circuit Board 60 Coater 60 Frequency Control 60 SAC# 60 Wafer Manufacturing 60 AEL# 60 XWAY ARX# 60 Accelerate Commercialization 60 DIN rail mountable 60 CIGS Solar 60 SOIC 8 60 germanium substrates 60 Hemodiafiltration 60 LX#T 60 3D Interconnect 60 GLOBALFOUNDRIES #nm 60 Vishay Siliconix 60 Vapor Phase 60 Fiber Optic Transceiver 60 Imprint Lithography 60 Serial Interface 60 Softransceiver 60 flexible screw conveyors 60 Optical Transceivers 60 pin MLF 60 Multi Core Processor 60 nm CMOS 60 Flat Panel Displays 60 bipolar CMOS DMOS 60 Adopts Cadence 60 Cree GaN 60 Powerful debug 60 Solar Concentrator 60 Serial Analyzer 60 x 9mm 60 TFT LCD module 60 circuit MMIC 60 varactors 60 BrightLase 60 OP# [003] 60 DQPSK 60 DFN packages 60 GNSS Receiver 60 NanoBridge 60 Nanostructure 60 customizable dataplane processor 60 Add Drop Multiplexer 60 MESFET 60 SMT LEDs 60 Atmel Introduces 60 Configurable Logic 60 Indium Tin Oxide 60 DC Converters 60 Tunable XFP 60 Radiation Hardened 60 tiny 2mm x 60 #nm #nm [002] 60 VCSELs 60 Fiber Optic Connectors 60 CMOS wafer 60 solution processible 60 MTP MPO 60 Application Specific Integrated Circuits 60 DIN Rail 60 Cervical Plate 60 Wave Soldering 60 daughtercards 60 MB#K# 60 4mm x 60 Rad Hard 60 TI MSP# 60 pin TSOP 60 VR#.# 60 Brushless DC Motor 60 SuperFlash 59 Potentiometers 59 #.#um [002] 59 Highest Density 59 absolute rotary encoders 59 Schottky diodes 59 Memory Module 59 Ductile Iron 59 SiGe BiCMOS SiGe 59 #HT [003] 59 HEMT 59 PowerDI TM 59 #.#μm CMOS 59 TGA# SL 59 Ultra Low Power 59 Thermocouple 59 CameraChip 59 Palletizing 59 Motion SPM 59 millisecond anneal 59 Solar Inverter 59 Low Noise Amplifier 59 Nanorods 59 Thin Film Batteries 59 HDP CVD 59 BEOL 59 OSTAR ® 59 low capacitance ESD 59 CMOS MEMS 59 Intel #GME 59 Multiprocessor 59 Mixed Signal Design 59 Mach Zehnder 59 mTouch 59 Bump Adapters 59 subrack 59 Tunable Laser Assembly 59 4 x 4mm 59 module TWR 59 MOEMS 59 Photomasks 59 solder bumping 59 AirMax VS 59 Tessera OptiML 59 Expansion Joints 59 XMD MSA 59 SFP transceivers 59 Organic Photovoltaic 59 Coprocessor 59 multilayer ceramic capacitors 59 Surface Acoustic Wave 59 measuring #.#mm x [001] 59 RFID inlay 59 TDK EPC 59 Packet Processing 59 Devices PTCs 59 pin TSSOP 59 Solido Variation Designer 59 1Gbit DDR2 59 Rugged COTS 59 SiGe bipolar 59 diplexers 59 FusionQuad 59 FPGAView software 59 CY#C# 59 8 pin MSOP 59 rigid flex 59 #.#G EPON 59 Arria GX FPGAs 59 Silicon Proven 59 X5R 59 Injection Moulding 59 TSMC #nm process 59 CompactPCI ® 59 TDA# [001] 59 3 x 3mm 59 Brazing 59 Non Volatile 59 #x#mm QFN 59 GDM# 59 Diode Laser 59 CoolMOS 59 TDFN package 59 DDR NAND 59 Hastelloy C 59 die bonder 59 REC ASA 59 Passive Components 59 Physical Synthesis 59 Solar Wafers 59 Compact PCI 59 coaxial connectors 59 Resistive 59 reflow solder 59 Shift Keying 59 oxide semiconductor 59 port #GBASE T 59 DM# [004] 59 Pressure Transmitters 59 PIN photodiode 59 CorEdge 59 TDFN 59 Pseudo SRAM 59 Silterra Malaysia Sdn 59 JDSU Adds 59 pin LQFP package 59 Blow Molding 59 #nm/#nm 59 imprint lithography 59 PoE PD 59 Double Patterning 59 DIN rail mount 59 wafer metrology 59 FinFET 59 heat shrinkable tubing 59 wirebonding 59 UV Curable 59 Structured ASICs 59 2μm 59 Reflow Soldering 59 Cadmium Telluride 59 ON Semiconductor Introduces 59 C0G 59 Complementary Metal Oxide Semiconductor 59 QFPs 59 Robot Arm 59 6U VPX 59 Encapsulation 59 Turbo EPON 59 chipscale 59 Dielectrics 59 CMOS circuits 59 SFP transceiver 59 micromachined 59 DongbuAnam 59 insulator SOI technology 59 IR#S 59 LQFP 59 μTCA 59 CMOS silicon 59 ARM# MPCore 59 Viking InterWorks 59 MoSys 1T SRAM 59 TSSOP 59 Non Woven 59 Insulated Gate Bipolar Transistor 59 Provide Unmatched 59 Capillary Electrophoresis 59 Package SiP 59 Samsung Electronics Develops 59 Lithium Ion Battery 59 optical transceiver modules 59 Metamaterial 59 Temperature Measurement 59 #.#μm [002] 59 #x#G [001] 59 MMICs 59 MirrorBit NOR 59 XT #i 59 VeloceRF 59 Transmissive 59 Miniaturized 59 TJA# 59 XBee PRO ZB 59 Patterning 59 Fully Automatic 59 integrated passives 59 On Insulator SOI 59 pseudo SRAM 59 VME#x 59 capacitive touch sensor 59 Reciprocating Saw 59 Jointly Developed 59 @ Tweaktown 59 CMOS logic 59 Power Amplifier 59 Dual Frequency 59 customizable dataplane processors 59 Vibratory Feeders 59 Ion Trap 59 #nm immersion lithography 59 CPU Coolers 59 FPCs 59 Ultracapacitor 59 3Xnm 59 8GB DDR2 59 BiCMOS 59 #μm thick [002] 59 MLCCs 59 3mm x 3mm DFN 59 SSOP packages 59 InGaN 59 MSOP packages 59 logic LSIs 59 Microfluidic 59 phototransistors 58 Insulator 58 Xilinx Virtex 5 58 Embedded Memory 58 Transmit Receive 58 Infrared Thermometers 58 AT#C# [002] 58 WinPath 58 Image Sensor 58 SPiDCOM 58 TiN 58 lot codes T# 58 Stratix III FPGAs 58 Passive Optical Networks 58 spiral inductors 58 #G DQPSK 58 Liquid Cooled 58 SpectralWave 58 #G/#G Ethernet 58 3mm x 3mm 58 Waveguides 58 6mm x 58 MSA transponders 58 TQFP# 58 Force Microscopy 58 GORE ™ 58 Resistor 58 2Xnm 58 Multi Threading 58 MoSys Bandwidth Engine 58 parasitic extraction 58 Tamper Resistant 58 LQFP# [001] 58 Ultra Wide Angle 58 ARM#JZF S 58 pin BGA 58 gigabit Gb NAND flash 58 First Fully Integrated 58 Application Processor 58 Microplate 58 DDR3 Memory Modules 58 Selective Laser Sintering SLS 58 interchangeable modules 58 low k dielectrics 58 Thinlam 58 SO8 package 58 Structured eASIC 58 nm DRAM 58 HMC#LP#E 58 5mm QFN package 58 SOIC packages 58 CESoP 58 Organic Chemical Vapor 58 Ultrathin 58 ANADIGICS Announces 58 laser annealing 58 iDP 58 Lithium Battery 58 Dual Function 58 S#C# 58 7mm x 7mm 58 #P# #P# #P# 58 Liquid Crystal Polymer 58 Harsh Environments 58 RF Module 58 Pad Printing 58 #mm Wafer 58 MIPS# #KE 58 LQFP package 58 ON Semiconductor Expands 58 LTPS LCD 58 SDRAMs 58 Deep Reactive Ion Etching 58 Hazardous Locations 58 Microchip PIC 58 Biocomposite 58 Low Noise Amplifiers 58 UV Visible 58 Flexfet 58 Arsenide 58 nano patterning 58 BiFET 58 transistor HEMT 58 Multilayer 58 Nanophotonic 58 KODAK FLEXCEL 58 conductively cooled 58 #x# mm [004] 58 RFX# 58 Wafer Inspection 58 #Base FX 58 pin SSOP 58 MB#Q# 58 Aluminum Alloy 58 Encapsulation Technology 58 Blackmagic Design Announces 58 3G Femtocell 58 #um [002] 58 LED Backlighting 58 Copolymer 58 multilayer ceramic 58 ARM#JF S 58 crystal resonator 58 Injection molded 58 Audio Amplifier 58 wire bondable 58 CS# [002] 58 nitride semiconductor 58 Fiber Laser 58 4mm x 4mm 58 Organometallic 58 CMOS RF CMOS 58 filament winding 58 Panasonic Develops 58 Exlar 58 LFCSP 58 Programmable Optical 58 FPGAs ASICs 58 TSMC #nm [001] 58 Reticle 58 LQFP# [002] 58 pin BGA packages 58 Octeon 58 Design Kits 58 Heatsink 58 Thermoforming 58 pin #x#mm 58 BGA package 58 OmniReach 58 Oscilloscopes 58 CdSe 58 Zinc Oxide 58 3mm DFN 58 MOSFETS 58 STB# [002] 58 MEMS microphone 58 Portable Fuel Cell 58 Broadens Portfolio 58 Micromorph 58 Graphical OS 58 Edge QAM 58 CMOS RF transceiver 58 Praetorian TM 58 Poly Silicon 58 Extruded 58 Mach Zehnder modulator 58 STV# 58 Kilopass XPM 58 Transceivers 58 AVR microcontroller 58 Pulse Width Modulation PWM 58 FiberExpress 58 MicroLens 58 #.#mm x #.#mm x [002] 58 Dual Core Processors 58 Vor ink 58 FPF# 58 Crystalline Silicon 58 6 FPGA DSP 58 dsPIC R 58 VGA TFT LCD 58 Ultra Compact 58 ML#Q# 58 ASIP TM 58 Evaluation Module 58 tunable filters 58 RF SiP 58 Integrated Circuits ICs 58 6Gb s SAS RAID 58 Sinumerik 58 Electron Devices 58 optical subassemblies 58 ATtiny# 58 thermo compression 58 Diodes Incorporated Introduces 58 Optocouplers 58 programmable SoC 58 Atmel AVR 58 epitaxy HVPE 58 CSM# 58 MB#R# 58 Luminus PhlatLight LEDs 58 Glove Boxes 58 PCI Express Gen2 58 APTIV film 58 MMA#L 58 Avago Technologies Introduces 58 Actel Fusion 58 Digital Converter 58 IntelliMAX 58 Bit Microcontrollers 58 SiWare 58 singlemode 58 tunable RF 58 Infrared IR 58 Cadence Encounter 58 Audio Power Amplifier 58 Baseband Processor 58 InP HBT 58 Electroluminescent 58 DDR2 Memory 58 Meritec 58 Servo Motor 58 JEDEC compliant 58 Active Optical 58 COTS FPGA 58 Wire Harness 58 optically coupled 58 nanometer CMOS 58 ArF immersion lithography 58 ARM#E S 58 Single Chip 58 poly crystalline 58 embedded FRAM 58 Multicore Processors 58 1mm x 1mm 58 wafer thinning 58 Mezzanine Card 58 Zener Diode 58 #G QSFP 58 TI TMS#C# 58 CIGS Copper Indium 58 OLED Displays 58 pin 4mm x 58 Reflow Oven 58 mosfets 58 Ramtron Announces 58 SiR#DP 58 ARM Processor 58 #LP [002] 58 linewidths 58 3 mm DFN 58 BPSK QPSK 58 Marvell #DE# 58 solder bump 58 cadmium sulphide 58 Piezoelectric 58 Titanium Alloy 58 Crosspoint Switch 58 Laminator 58 Nanocomposites 58 Nanometer Process 58 #G OTN [001] 58 #KEc 58 PolarPro II 58 Magnetic Sensors 58 Video Scaler 58 CSR BlueCore5 Multimedia 58 FlexUPD 58 Horizontal Vertical 58 Flow Sensors 58 Wafer Probe 58 Form Factor Pluggable 58 MIPS# TM 58 III nitride 58 serial backplane 58 please visit www.EXFO.com 58 serdes 58 SIDACtor 58 Stratix IV FPGA 58 MT#C