Related by context. Frequent words. (Click for all words.) 60 laminations 59 mm ² 59 bonder 58 #x# mm [004] 58 leadframe 58 #μm [002] 57 pcb 57 metallised 57 underfill 57 substrate 57 Flip Chip 57 interposer 57 busbar 56 eutectic 56 substrates 56 ferrules 56 microfabricated 56 reflow soldering 56 metalized 55 8 pin SOIC 55 Ball Grid Array 55 crystallinity 55 parasitics 55 infeed 55 #μm [001] 55 rigid substrates 55 package SiP 55 QFN packages 55 PCB layout 55 baseplate 54 impedance matching 54 sleeving 54 #.#μm [001] 54 singlemode 54 piezo electric 54 RF transmitter 54 lidding 54 #/#-in [001] 54 wafer probing 54 polymerized 54 microlenses 54 wafer bumping 54 BGAs 54 x #.#mm [005] 54 workpieces 54 BGA package 54 belt conveyor 54 servomotor 54 defectivity 54 #x#mm [002] 53 thermal dissipation 53 granulate 53 stereolithography 53 QFN 53 micron thick 53 thermoformed 53 thermally conductive 53 tight tolerances 53 swarf 53 HV# [001] 53 polymeric 53 isotropic 52 chip resistors 52 #um [002] 52 fused silica 52 transmissive 52 rigid flex 52 mandrel 52 hinged lid 52 array BGA 52 belt conveyors 52 dielectric strength 52 ferrite 52 passivation 52 metallized 52 beam splitter 52 photodiode 52 workpiece 52 Xilinx FPGA 52 z axis 52 planar 52 impedances 52 analog circuitry 52 input impedance 52 polymer matrix 52 WLCSP 52 thermally stable 52 coating thickness 52 MLCCs 52 paramagnetic 51 pin QFN 51 #.#mm x #.#mm [003] 51 sintered 51 anneal 51 platen 51 membrane switches 51 SOT# [001] 51 millimeter diameter 51 RS# interface 51 photoresist 51 wave soldering