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(Click for frequent words.) 72 isotherm 70 #oC [001] 70 -4 ° 70 -# degreesC 70 #deg C 69 +# degC [002] 69 ° -# ° [001] 69 #degC [002] 69 #Â ° [002] 69 -# º [001] 68 Deg C 68 ⁰ 68 annealing temperature 68 #.degree [002] 68 #Â º [001] 68 -# ˚ 67 +# º C [002] 67 #degreesC 67 -# ° F [001] 67 degC 67 Meanwhile preheat oven 67 ° -# ° [002] 67 -# deg [002] 67 +# degreesC 67 oC 67 +# º 66 66 -# º C [002] 66 -# º [002] 66 +# º C [001] 66 +# degC [001] 66 +# deg [002] 66 +# oC 66 #Â º C 66 #oF [001] 66 thermal EMF 66 Halifax Weather Overcast 65 ¢ ª 65 +# ° F 65 Kelvin -# 64 deg F 64 C0G 64 #F #C [001] 64 degreesF 64 ° C/# 64 #Â ° C 64 dielectric strength 64 degF 64 mK 63 -# º F [002] 63 -# ° C [001] 63 -# º C [001] 63 μm diameter 63 C 63 #.#Hz 63 input capacitance 63 W mK 63 +# ° F. 63 #bar [001] 63 +# degrees Centigrade 63 #Â ° F [002] 63 Method Preheat oven 63 cm ² 63 -# ° F [002] 63 -# deg C 63 Thermal conductivity 63 ° C ambient temperature 63 Fig. 2b 63 +# degrees Celsius [001] 62 -# deg [001] 62 #.degree [001] 62 +# deg C [002] 62 +# deg C [001] 62 Mostly Cloudy Currently 62 Fig. 4A 62 degreesC 62 -# degrees Centigrade 62 1ppm 62 -# ° Fahrenheit 62 Fig. 2A 62 5μm 62 microvolts 62 Thermocouples 62 -# ˚ C 62 isotherms 62 torr 62 PREHEAT oven 62 º Fahrenheit 62 cementite 62 Î ¼ 62 ° C 62 ⁰ C 62 -# ° C. [002] 61 ˚ C. 61 NTC thermistor 61 -# Celsius [001] 61 μW 61 Min Temp #.# 61 ° F/# ° C [001] 61 +# ° C. [001] 61 ° F -# ° 61 -4 ° F 61 #deg [002] 61 4mA 61 molar ratio 61 -5 ° 61 #oC [002] 61 PSIG 61 #um [002] 61 mbar 60 ohm cm 60 hPa 60 flowrate 60 kPa 60 #Â ° C. 60 1kV 60 #.#nm [002] 60 -# degrees Celcius 60 mV V 60 -# ° Celsius [001] 60 selectivities 60 Pressure Transducer 60 ° 60 ˚ F 60 #ppm ° C 60 fig. S2 60 thermowell 60 celcius 60 +# ° C [002] 60 thermal conductivities 60 Reduce oven 60 ± #.#dB 60 solder reflow 60 Â ± 60 Directions Preheat oven 60 absolute TCR 60 1μm 60 TCXOs 60 ° C/# ° F [001] 60 #.#in [004] 60 wetted parts 59 #.#-# V 59 Fig. 2a 59 Pt# 59 chromatographic separations 59 magnetic stirrer 59 θ 59 voltage divider 59 microampere 59 Min temp 59 ° C ambient 59 ℃ 59 scfm 59 ml min 59 deg 59 FieldFox RF VNA 59 ± #ppm [002] 59 Coriolis meters 59 μmol 59 mT 59 MPa 59 ± #ppm [001] 59 yr -1 59 turbine inlet 59 2kV 59 -# º F [001] 59 uniaxial 59 degrees farenheit 59 helicity 59 #.#N [002] 59 ˚ F. 59 -#.# ° C 59 +# º C. 59 #mA [003] 59 C/# [003] 59 #degrees [002] 59 ° Fahrenheit 59 8kV 59 #deg [001] 59 Â ° C. 59 º Celsius 59 W/cm2 59 Fig. 1c 59 TDFN packages 59 fig. S1 59 Schematic representation 59 enthalpy 59 fahrenheit 59 subvertical dip 59 ps nm 58 Sitrans 58 ° C ± 58 ° C -# ° 58 gelation 58 μH 58 #Ω [002] 58 thermowells 58 compressive stress 58 5kV 58 ohmic 58 #.#deg [001] 58 milliampere 58 adsorption isotherms 58 Fig.1 58 #A #V [002] 58 isomeric 58 ^ sup -1 58 shear modulus 58 +# degrees Celsius [002] 58 testo 58 martensitic 58 thermally stable 58 #C #C [001] 58 fA 58 temprature 58 reduced graphene oxide 58 P0 58 #psi [003] 58 cryostat 58 mu m 58 drilled northwards 58 temperature coefficients 58 #.#uF 58 fig. S6 58 mΩ 58 elastic modulus 58 electrical resistivity 58 #pF [001] 58 temperature coefficient 58 magnon 58 -# º C. 58 Liquid helium 58 tiny 3mm x 58 Hastelloy 58 m³ h 58 differential scanning calorimetry 58 GaN layer 58 cm -2 58 SiO 2 58 Fig. 3d 58 ± #V [001] 58 τ 58 #.#VI O 58 Fig. 2C 58 copper oxide superconductors 58 microvolt 58 dielectric permittivity 58 mH 58 coriolis 58 fluid viscosity 58 ultrahigh vacuum 58 Reheat leftovers 58 Fig. 2B 58 +# deg [001] 57 cathodic 57 -3 dB 57 ambient temperature 57 temperature setpoint 57 Vrms 57 2oC 57 μV 57 toroid 57 MΩ 57 Kelvins 57 Thermocouple 57 magnetic permeability 57 μl 57 Figure 1A 57 √ Hz 57 upper tropospheric 57 ε 57 #.#W [004] 57 #V ac 57 tiny 2mm x 57 #C #F [003] 57 inductance values 57 Fig. 1a 57 -# ° [001] 57 ° F 57 #.#pF 57 Fig. 1A 57 #.#m# [001] 57 PBGA package 57 ± #.#mm [002] 57 thermal gradient 57 voltage coefficient 57 thermally activated 57 thermocouples 57 #nm #nm [002] 57 magnetostrictive 57 Fig. 1b 57 -# degrees Celsius [001] 57 cryogenic temperatures 57 Promass 57 thermal gradients 57 femtogram 57 ferrite core 57 5V CMOS 57 V0 57 diffusivity 57 3v 57 #F #F [002] 57 SCFM 57 paramagnetic 57 ASTM E# [002] 57 ν 57 input impedance 57 MIL HDBK #F 57 microwatt 57 #Vdc [003] 57 #.#h [002] 57 cm -3 57 photon flux 57 Fig. 3B 57 milliohm 57 ° C/# ° 57 IP# sealing 57 transmissivity 57 approx.# [001] 57 kBq 57 Figure 1a 57 pN 57 mM NaCl 57 -# ° C. [001] 57 degs 57 ° C. 57 psia 57 Input Voltage 57 thermal equilibrium 57 ˚ C 57 Fe Mg 57 inductive sensor 57 #cm [001] 57 reflow soldering processes 57 #μF [002] 57 ° C. Brush 57 fig. S3 56 OCXOs 56 º -# º 56 nanopositioning stages 56 PID controller 56 mN 56 mV g 56 0 dBm 56 azimuthal 56 pH electrode 56 #μ 56 ppm ° C 56 σ 56 δ 56 mol 56 ft sec 56 6GHz 56 autoclavable 56 μS cm 56 reflow temperatures 56 wirewound resistors 56 mounting flange 56 downwelling 56 centistokes 56 5ppm 56 hafnium oxide 56 #.#mm x [003] 56 Fig. 4B 56 manometer 56 mA output 56 Fig. 4c 56 #ohm [002] 56 rheometer 56 mitral annular 56 #.#Ω 56 #.#VDC 56 megapascals 56 #Â º [002] 56 zener diodes 56 dewpoint 56 HAAKE 56 anneal 56 #u [001] 56 radial leaded 56 dimensional tolerances 56 dewpoint temperature 56 magnetically coupled 56 Mg Fe 56 superior heat dissipation 56 figs. 56 radioligand 56 Mosfets 56 thermocouple RTD 56 dc voltage 56 pyrometer 56 instrumentation amplifier 56 #-#,# mm 56 bending radii 56 #lm [001] 56 normothermic 56 Fig. 4b 56 Max Temp 56 resistive element 56 mOhm 56 ° ° 56 vertical keystone correction 56 spinous 56 Vdd 56 1kHz 56 Ncm 56 mW/cm2 56 dI dV 56 Orbital Slot 56 4H SiC 56 #.#ppm [001] 56 beamsplitters 56 4V 56 #mΩ [001] 56 #bar [002] 56 g cm 56 Ca2 + 56 pH ORP 56 toroidal 56 oxyhemoglobin 56 output capacitance 56 -1 ^ 56 fig. S5 56 photolysis 56 #.#-# mm 56 thermal impedance 56 RO membrane 56 Thermo Scientific Accela 56 Strain Gauge 56 Fig. 1B 56 weld seams 56 homopolymer 55 2μm 55 +# deg C. 55 feedthrough 55 InAs 55 aliquots 55 Mosfet 55 freezeproof 55 ± #kV 55 1nm 55 conductivities 55 Fig. 3c 55 volts mil 55 Input voltage 55 #Hz #KHz 55 Low Temperature 55 THENCE SOUTH 55 cryogenic cooling 55 Figure 1b 55 viscosities 55 LVDTs 55 IP# enclosure 55 flowrates 55 IEC #-#-# [002] 55 denaturation 55 pin 4mm x 55 mm dia 55 κ 55 #o [003] 55 ppm deg 55 magnesium ion 55 temperature gradient 55 5V tolerant 55 #GHz [001] 55 Fig. 3b 55 º C 55 Fig. 1d 55 #.#μ 55 ₂ 55 ms -1 55 electrolytic capacitor 55 Nd YAG 55 8mm diameter 55 1mA 55 interfacial tension 55 electron doped 55 #.#mA [002] 55 vortex flowmeters 55 Avago ACPL 55 psig 55 nmol 55 Silicon Nitride 55 #.#mV 55 5mA 55 bottomhole pressure 55 Figure 1C 55 7mm x 55 bi axial 55 pulse widths 55 Desorption 55 #psi [001] 55 upflow 55 viscosity fluids 55 #um [001] 55 Figure 2a 55 Celsius #.#F 55 poly L lysine 55 #.#kV [001] 55 L1 L2 55 ° sec 55 V/# 55 P3HT 55 tensile stresses 55 dB insertion loss 55 PO4 55 spectral Doppler 55 microcavity 55 C/# [002] 55 sinusoid 55 capacitance values 55 Laboratory Freezer 55 cuvette 55 Michell Instruments 55 vibrational modes 55 kΩ 55 PXI module 55 absorption spectra 55 picometers 55 crystallinity 55 degrees celcius 55 4 x 4mm 55 Fig. 2E 55 W/m2 55 ˚ 55 nL 55 timebase 55 magnesium Mg 55 X7R 55 #VAC [002] 55 triaxial 55 arbitrary waveforms 55 tensile modulus 55 Nernst 55 dipole moment 55 millidarcies 55 thermally induced 55 #nm wavelength [001] 55 V dc 55 Liquid nitrogen 55 kelvin 55 +# Vdc 55 piezo actuator 55 meV 55 #μF [001] 55 viscous fluids 55 temperature gradients 55 deionised water 55 #lm [002] 55 Fig. 2d 55 thermic 55 PWM output 55 Josephson junction 55 #m# h 55 #.#deg [002] 55 servo controller 55 Fig. 4a 55 #G XFP 55 spindle speeds 55 centrifuged 55 -4 ° C 55 m3/hr 55 kg -1 55 rotary evaporators 55 χ 55 dc converter 55 kGy 55 5mm x 6mm 55 Fig. 2D 55 controlled crystal oscillator 55 microlitres 55 ellipsoids 55 chipscale 55 metastable 54 Amperes 54 positron emitting 54 recrystallization 54 ha -1 54 ultrahigh purity 54 3mm x 54 reflow soldering 54 ± #.#mm [001] 54 #.#mm diameter [002] 54 undoped 54 rugged conduction cooled 54 linearized 54 UV VIS 54 Degrees Fahrenheit 54 liposome formulation 54 +# VDC 54 x 2mm 54 microbalance 54 #Vac 54 torque transducer 54 -5 ° C 54 Position Sensors 54 voltage #.#V 54 2dB 54 frictional heating 54 #.#mL 54 GNRs 54 XRS#L# 54 dissolved oxygen pH 54 #.#V #.#V [001] 54 ultraviolet wavelength 54 capacitances 54 nanometric 54 #/#V 54 ammonia NH3 54 PIN photodiodes 54 polysulfone 54 failure MTTF 54 nanosecond pulse 54 variable resistor 54 #.#μF 54 guanylyl cyclase 54 #μs [002] 54 electromotive force 54 Fig. 1D 54 kinematic viscosity 54 #nm laser [002] 54 RC oscillator 54 SAC# 54 superheater 54 m ^ sup 54 shaft diameters 54 ultrasonic transducers 54 5VDC 54 NiSi 54 #,# bis 54 antiferromagnetic 54 3nm 54 pearlite 54 thermodynamically 54 #.#F [002] 54 moisture vapor 54 cm sec 54 2kHz 54 tetragonal 54 transimpedance amplifier 54 -8 ° C 54 austenite 54 creatine kinase MB 54 thermal foldback 54 #.#kW [002] 54 piezoresistive 54 resonance frequency 54 H#SO# 54 Quiescent current 54 V ac 54 NWs 54 Si substrate 54 lowpass filter 54 channel MOSFETs 54 Tensile strength 54 thermoelectric cooler 54 inductive loads 54 Conductivity 54 Potentiometer 54 ° С 54 toolholder 54 polyphase 54 Si#DP 54 Fig. 3A 54 NEMA 4X enclosure 54 singlemode 54 nMOS 54 1ns 54 #.#μm [001] 54 mmol 54 volts AC 54 intermodulation distortion 54 mount inductors 54 #kA [001] 54 solderable 54 Supplementary Fig 54 -# mV [001] 54 argon gas 54 #.#mx #.#mx #.#m 54 mF 54 umol 54 -# degrees centigrade [002] 54 multipole 54 OPTIMASS 54 transconductance 54 MgO 54 Voltages 54 #m/min [001] 54 infrared spectral 54 thermoelectric cooling 54 PLLA 54 TiN 54 4kV 54 beamwidth 54 vibrationally excited 54 electrically insulating 54 ferrite 54 AST# 54 TECs 54 PowerPAK 54 μg ml 54 SMT LEDs 54 FTIR spectrometer 54 thermally conductive 54 β galactosidase 54 #us [001] 54 normoxic 54 hydrolytic 54 #HT [003] 54 pipe diameters 54 +5 +# 54 chromatogram 54 ρ 54 X7R dielectric 54 velocity dispersion 54 -# degrees Fahrenheit [002] 54 equilibration 54 orifice plates 54 Ferritin 54 joint contracture 54 solvation 54 Temperature Range 54 cP 54 Ozone O3 54 PE# [003] 54 ° #'E 54 varistor 54 η 54 linearisation 54 martensite 54 º C. 54 cartoner 54 electroless copper 54 WBGT 54 ω 54 Flowmeter 54 degress 54 rugged IP# 54 x 3cm 54 #us [002] 54 5V input 54 #x#x# mm [002] 54 absorption spectroscopy 54 cryoprobe 54 quantum oscillations 54 InSb 54 conduction cooling 54 UV absorbance 54 -5 ° C. 54 MWNT 54 preheater 54 Temperature Probe 54 austenitic stainless steels 54 PIN photodiode 54 #E [002] 54 mosfet 54 min -1 54 gph 54 #mm x 54 #oF [002] 54 crystal oscillator 54 Ultrason 54 kg hr 54 #mm# [002] 54 preheaters 54 Fractional N 54 EIRP 54 bilayers 54 nm excitation 54 Infrared Thermometer 54 coupling capacitors 54 #/#-in [002] 54 millivolt 54 #N [003] 54 IP#K 54 thermodynamic equilibrium 54 #.#-#.# [011] 54 emc 54 flux residues 54 compressibility 54 moisture absorption 54 coplanar 53 CF4 53 mAh g 53 VCXO 53 lb hr 53 pMOS 53 bandpass 53 silicide 53 compensated crystal oscillator 53 ZXLD# 53 ± #V [002] 53 bimetal 53 multicell 53 creepage 53 #MS s [002] 53 radians 53 neutron flux 53 reed relays 53 φ 53 Fig. 2c 53 -# degrees Fahrenheit [001] 53 thermo mechanical 53 #x#mm package 53 emittance 53 #nm laser [001] 53 metallic ions 53 γ 53 amperometric 53 distal anastomosis 53 #L/min 53 ANSI AAMI 53 supercooled liquid 53 diffusion coefficients 53 sodium acetate 53 ferrites 53 asynchronous motors 53 #mΩ [002] 53 rectal temperature 53 HNBR 53 #μm [002] 53 kilopascals 53 deoxy 53 tin Sn 53 7V 53 cuvettes 53 #m/min [002] 53 Force Microscopy 53 Fig. 4C 53 bending radius 53 rheological 53 μm thick 53 ° C. Grease 53 scrotal temperatures 53 AG# [001] 53 stoichiometry 53 flexural 53 dV dt 53 isostatic 53 inductive proximity 53 thermal decomposition 53 #BASE 53 oxidative degradation 53 μL 53 tensile stress 53 +5 VDC 53 kA 53 ° C. Lightly grease 53 biaxial 53 emission wavelength 53 BTU hr 53 #.#mm x [002] 53 #VDC [002] 53 parameter measurements 53 +# ° C [001] 53 absorption coefficient 53 magnetic susceptibility 53 CaO 53 Degrees Celsius 53 temperature 53 cored wire 53 ceramic capacitor 53 g mL 53 0C 53 #.#C #.#C 53 #pF [002] 53 vanadate 53 mol L 53 toroids 53 amplitude modulated 53 pin LQFP package 53 diastolic velocity 53 WVTR 53 #.#mm x [004] 53 + -1 53 DirectFET package 53 chlorophyll fluorescence 53 º 53 μsec 53 rotary potentiometer 53 C#A [002] 53 #/#V AC 53 #.#W [003] 53 bottomhole 53 reaction kinetics 53 COOH 53 eSIP 53 magnetoresistance 53 kcal mol 53 -# Fahrenheit [002] 53 MWIR 53 6mm x 53 kg/m3 53 capillary tube 53 phototransistor 53 #MPa 53 Intrinsically safe 53 typ 53 proton conductivity 53 linewidth 53 TO #AB 53 post perovskite 53 Eq. 53 benthic foraminifera 53 lbf 53 Fig. 1C 53 cyclic loading 53 nm wavelengths 53 CL7 53 mrad 53 HV# [003] 53 mounting flanges 53 defoaming 53 Varistors 53 mosfets 53 Mg Ca 53 #Â ° F [001] 53 submerged arc welding 53 intermetallic compounds 53 NaOH 53 Young modulus 53 #ppm Cu 53 humidistat 53 GPa 53 NaCN 53 Exoscan 53 piezo actuators 53 isotropic 53 z axis 53 memset 53 4mm x 53 mm f/#.# ASPH 53 #V dc [001] 53 MAX#E 53 #mm #in 53 lamella 53 sealless 53 #/#Hz [001] 53 Permeability 53 nm VCSEL 53 photoconductive 53 millivolts 53 absorbance 53 #mm x #.#mm [001] 53 SQUIDs 53 thermocouple 53 SiO2 53 thermal diffusivity 53 selective cerebral perfusion 53 dB SPL 53 TappingMode 53 CO2 CH4 53 mm ² 53 ambient temperatures 53 5V supply 53 Capacitance 53 ZrO 2 53 thermistor 53 polymerizes 53 servo controllers 53 Nd YAG lasers 53 water vapor permeability 53 +# dBm output 53 dissolved oxygen DO 53 Inconel 53 kelvins 53 voltammetry 53 pin TSSOP package 53 serum IgG 53 2nm 53 reflowed 53 Interferometric 53 fluorometer 53 Coulomb blockade 53 excitation wavelength 53 sorption 53 MeV 53 cuprate 53 screw compressors 53 diffusion coefficient 53 amu 53 Unidirectional 53 #Â ° [001] 53 irradiance 53 TEOS 53 stripline 53 Yb 53 #ohm [001] 53 UHMW 53 #T# [002] 53 equimolar 53 Mott insulator 53 Å -1 53 2ppm 53 Interpolation 53 NIST traceable 53 μS 53 vario 53 ADXL#