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(Click for frequent words.) 67 Compeq 67 HDI PCBs 66 PWM ICs 65 density interconnect HDI 65 Chin Poon 64 Kinsus 64 leadframes 63 Powerful debug 63 HDI PCB 63 FPCB 62 Unimicron Technology 62 MLCCs 62 Nanya PCB 62 #mm silicon wafers 62 8Gb NAND 62 IC substrate 62 epitaxial wafer 61 PWBs 61 Follow Vishay 61 multilayer PCBs 61 #.# micron node 61 FPCs 61 CMOS circuits 61 CSTN LCDs 61 multilayer printed 61 gallium phosphide 61 #nm wafers 61 poly Si 60 rigid flex 60 multilayer ceramic capacitors MLCC 60 Elpida #nm 60 Printed circuit 60 chip resistor 60 Ichia 60 LTPS TFT 60 VGA TFT LCD 60 color filters CFs 60 capacitive touch panels 60 microvia 60 Compeq Manufacturing 60 nylon yarn 60 Unimicron 60 epiwafer 60 wafer thickness 59 PWM IC 59 integrated circuits IC 59 chipscale 59 #.#μm CMOS process 59 copper metallization 59 Lextar 59 Pseudo SRAM 59 backlight module 59 BGA packaging 59 flex rigid 59 LVDS interfaces 59 rectifier diodes 59 #.#μm CMOS 59 Crystalline silicon 59 Ichia Technologies 59 HannStar Board 59 amorphous alloy transformers 59 Integrated Circuits ICs 59 CMP slurry 59 #mm ² [002] 59 aluminum electrolytic capacitors 59 #Mbit DDR2 59 mechanical polishing CMP 59 LTPS LCD 59 #Mb DDR2 59 crystalline Si 59 sapphire wafer 59 LED BLUs 59 QFP packages 58 wirebonding 58 5G TFT LCD 58 2oz copper 58 SDRAMs 58 GaAs substrates 58 GaAs fab 58 XFP module 58 backlight modules 58 boards PCBs 58 Holtek 58 rigid substrate 58 epitaxial wafers 58 TGA# SM 58 serializer deserializer SerDes 58 #nm CMOS [002] 58 UL#V 0 rated 58 Ardentec 58 wafer diameters 58 laminate substrate 58 PBGA 58 Gallium arsenide 58 Prismark 58 Si TFT 58 GaN wafers 58 TFTs 58 Wus Printed Circuit 58 epiwafers 58 CIS CIGS 58 4Gb NAND flash 58 eutectic solder 58 GaAs gallium arsenide 58 Nan Ya PCB 58 8Gbit 58 quartz oscillators 58 × #mm [002] 58 varistor 58 polycrystalline solar 58 SMD LED 58 GaAs substrate 58 Medium Density Fiberboard MDF 58 HEMTs 58 #mm# [003] 58 nm CMOS process 57 SiON 57 #mm silicon wafer 57 fiber optic transceivers 57 PIN diode 57 copper damascene 57 CMOS wafers 57 fab utilization 57 analog IC 57 ownership CoO 57 solder bumps 57 epitaxial substrates 57 TFT LCD modules 57 #mm ² [001] 57 Siliconware Precision Industries SPIL 57 #.#μ 57 extruded profiles 57 ASICs FPGAs 57 ICs integrated circuits 57 Compound Semiconductors 57 resistive touch panels 57 ultrahigh purity 57 hermetic packaging 57 SI GaAs 57 flex circuits 57 8Gbit NAND flash 57 Soitec produces 57 PBGA package 57 STN LCD 57 capacitors resistors 57 Xeon CPUs 57 QFN packaging 57 multilayer ceramic capacitors 57 solar PV module 57 projected capacitive touch 57 Camera Module 57 VLP RDIMM 57 micrometre scale 57 epi wafers 57 backplane connectors 57 Chlor alkali 57 polysilicon wafers 57 Micromorph 57 layer ceramic capacitor 57 Aixtron MOCVD 57 insulator substrate 57 board assembly PCBA 57 low capacitance ESD 57 transistor arrays 57 Photolithography 57 calcium fluoride 57 nm DRAM 57 AMLCD 57 SOI CMOS 57 Mosfets 57 Sharp Kameyama 57 .# micron 57 silicon modulators 56 SFP + transceivers 56 3U CompactPCI ® 56 Kinsus Interconnect Technology 56 crystalline silicon wafers 56 BOPP films 56 multilayer ceramic 56 amorphous silicon TFT 56 capacitance MLCCs 56 layer ceramic capacitors 56 Sigma fxP 56 sapphire substrate 56 pseudo SRAM 56 inch widescreen panels 56 IC backend 56 ceramic capacitor 56 module LCM 56 dielectric etch 56 silicide 56 Unity Opto 56 semi insulating GaAs 56 multicrystalline silicon 56 DDR SDRAMs 56 Geode LX# 56 silicon germanium SiGe BiCMOS 56 MOS transistors 56 wafer dicing 56 lithography steppers 56 pcb 56 TCS# 56 monocrystalline silicon wafers 56 analog ICs 56 microprocessors chipsets 56 Sonix Technology 56 Fab 3E 56 PowerPC #GX 56 monolithically integrated 56 cellulose ethers 56 Thin Film Transistors 56 #GBASE CX4 56 CMOS imagers 56 Chipbond Technology 56 AlGaInP LED 56 Giantplus 56 DDR2 memory modules 56 TFT LCD module 56 multicrystalline solar 56 printed circuit 56 amorphous silicon Si 56 Nand flash 56 sq. mm 56 oxide semiconductor 56 acrylonitrile butadiene styrene ABS 56 wire bonders 56 die bonder 56 polyvinylchloride PVC 56 semiconductive 56 Taiwanese foundries 56 CULV notebooks 56 solder bump 56 film transistors TFTs 56 SOI silicon 56 4Gbit 56 Printed Circuit Boards 56 pMOS 56 Gbit DDR3 56 ceramic substrates 56 wet FGD 56 extruded shapes 56 #.#um [001] 56 5V CMOS 56 Si TFT LCD 56 TFT LCD panel 56 Giantplus Technology 56 electro deposition 56 LCD module LCM 56 acrylonitrile butadiene styrene 56 DDR3 chips 55 optical transceiver modules 55 extruded polystyrene 55 Sintek Photronic 55 Particulate Reactor TM 55 styrene butadiene rubber 55 #μF [001] 55 2Gbit 55 CyberDisplay #K 55 AGP8X 55 Serdes 55 measuring #.#mm x [001] 55 poly crystalline 55 1Gb DDR3 55 BLUs 55 solder bumping 55 varactors 55 UMC #nm 55 GaN LED 55 inertial MEMS 55 multicrystalline module 55 CMOS ICs 55 Amorphous silicon 55 Sunrex 55 SnO2 55 PCBAs 55 rectifier diode 55 conductivities 55 chip resistors 55 CCFL LCD 55 microelectronic device 55 Intel #GME 55 dynamically reconfigurable 55 Integrated Metrology 55 8G LCD 55 cored wire 55 V# platform 55 MB#R# 55 TPK Touch Solutions 55 Rigid Flex 55 Specialty Engineered Alloys 55 multijunction solar cells 55 controller ICs 55 MB#Q# 55 ion implanter 55 poly silicon 55 Yosun 55 quickturn 55 CMOS circuitry 55 AFBR 55 thermal conduction 55 passive matrix 55 Dell PowerEdge M# 55 Semiconductors Printed Circuit 55 SMD LEDs 55 CSTN LCD 55 epitaxial layer 55 analogue ICs 55 CMP consumables 55 active matrix OLEDs 55 AlGaInP 55 advanced leadframe 55 Si substrate 55 wirebond 55 FinFET 55 clad laminates 55 nanometer nm CMOS 55 monochrome STN 55 #Gb MLC NAND 55 backside metallization 55 plywood veneer 55 CMOS fabrication 55 registered DIMMs 55 polyester filament 55 #nm ArF 55 amorphous alloy transformer 55 4Gb DDR3 55 QFNs 55 Varistors 55 heterojunction bipolar transistor HBT 55 #Gbps Ethernet switch 55 #nm NAND flash 55 nMOS 55 Arteris NoC solution 55 indium gallium phosphide 55 nitride semiconductor 55 8GB NAND flash 55 solderable 55 Zenitron 55 6mm x 6mm 55 deflashing 55 insulator SOI technology 55 monocrystalline ingots 55 DRam 55 Wafer shipments 55 polymethyl methacrylate PMMA 55 #Mx# [001] 55 #nm silicon 55 1Gb DRAM 54 HSAW 54 polyisocyanurate insulation 54 organic TFTs 54 #H# [009] 54 nickel hydroxide 54 dc dc controller 54 ASE Material 54 CS# EDC 54 IC foundry 54 #.#mm thick [002] 54 Ingenic 54 ferrite beads 54 Liquid Crystal Displays 54 RF transistors 54 silicon oxynitride 54 Sitronix 54 pentacene 54 #.#G TFT LCD 54 4mm thick 54 #.#um CMOS 54 LSA#A 54 Casio Micronics 54 Low density polyethylene 54 millimeter silicon wafers 54 inverter air conditioners 54 PIN photodiode 54 Copper Indium Gallium 54 PQFN 54 PEEK polymer 54 SOI wafer 54 wafer ASPs 54 multicrystalline 54 displays FPD 54 #G DPSK 54 DrMOS 54 still cameras DSCs 54 2GB DDR3 54 2Gbyte 54 GaN substrate 54 color STN LCD 54 Silicon wafer 54 2Gb DDR2 54 overmolding 54 clad laminate CCL 54 FPGAs ASICs 54 vinyl ester resin 54 #nm MLC NAND 54 QFN packages 54 MEMS MOEMS 54 passive matrix OLEDs 54 biaxially oriented polypropylene 54 #Mbyte [001] 54 Maanshan Steel 54 dielectric layers 54 MLC NAND Flash 54 opto electrical 54 #Mbit DDR 54 diffractive optical elements 54 linecards 54 #nm RF CMOS 54 #x#x#mm [001] 54 thermoplastic rubber 54 Polypropylene PP 54 multichip package 54 polycrystalline modules 54 GaN RF 54 ultraviolet curable 54 motherglass 54 intermodal railcars 54 ITRS roadmap 54 tantalum capacitor 54 TrueStore 54 film transistor TFT 54 electro optic modulators 54 3mm thick 54 X7R 54 microfine 54 WiMAX baseband 54 Intel #GM Express 54 ion implanters 54 #.#mm# [002] 54 indium gallium 54 PBIT margin 54 polyester staple 54 InAs 54 GeForce #M graphics [001] 54 Aaeon 54 spherical lenses 54 LCD steppers 54 ARM# processors 54 RF MEMS switches 54 carbon nanotube CNT 54 & IC Substrates 54 #pin [001] 54 toroids 54 laminated veneer lumber LVL 54 blowmolding 54 Chemical Mechanical Polishing 54 #nm FPGAs 54 #.#mm ² 54 indium gallium nitride InGaN 54 Flip Chip 54 HBAs switches 54 underfill 54 LQFP# package 54 #.#x#.# 54 #x#x#.# mm 54 CNT FED 54 Flex Rigid 54 #G Ethernet switch 54 multichip 54 nm SRAM 54 oxide thickness 54 1μm 54 rigid PVC 54 Optical Amplifier 54 inkjet printhead 54 CCFL backlight 54 5μm 54 iCoupler 54 ULCH 54 PEALD 53 LTPS TFT LCD 53 liquid crystal polymer 53 Polyester staple 53 dielectric layer 53 bypass capacitor 53 wirewound 53 SigmaQuad 53 amorphous alloy cores 53 GaAs MESFET 53 LED BLU 53 Outbound shipments 53 Silicon carbide 53 sapphire wafers 53 bleached kraft pulp 53 epitaxial deposition 53 planarization 53 BJTs 53 Si Ge 53 semicon 53 line BEOL 53 Microelectromechanical Systems MEMS 53 drives ODDs 53 MOCVD tools 53 Ge substrates 53 ODM OEM 53 silicon epitaxial 53 Silicon Germanium 53 microelectromechanical 53 Ibiden 53 SO8 53 JFET 53 tantalum pentoxide 53 RF Microwave 53 bicomponent 53 quartz plates 53 WLCSP 53 Moschip 53 MB#K# 53 polycrystalline silicon poly Si 53 #nm 2Gb 53 mask ROM 53 Inductors 53 silicon interposer 53 removable HDD 53 brominated flame retardant BFR 53 silicon Si 53 Gallium Nitride GaN 53 conductive pastes 53 AlGaAs 53 Toppoly 53 threshold voltages 53 amorphous TFT LCD 53 VECTOR Express 53 slab caster 53 Mbit MRAM 53 Analog ICs 53 Silicon Nitride 53 ferrites 53 k gate dielectrics 53 digital TVs DTVs 53 Wah Hong 53 hydride vapor phase 53 NanoMarkets predicts 53 planar lightwave circuits 53 nm NAND flash 53 wire bondable 53 Himax Technologies 53 CMOS transistors 53 #nm immersion lithography 53 SiGe C 53 metallisation 53 GAIN HBT 53 PHEMT 53 Arima Computer 53 PIN photodiodes 53 indium gallium phosphide InGaP 53 Gallium nitride GaN 53 SoCs ASICs 53 Nan Ya 53 LCD backlights 53 GPIB interface 53 USD #/tonne 53 NAND FLASH 53 carbon nanotube interconnects 53 uncoated mechanical 53 Wafer fab 53 stainless steel tubular 53 AlN layer 53 Microfluidizer 53 mosfets 53 battery anodes 53 RF LDMOS 53 ferrite core 53 MEMS micro electromechanical 53 DDR2 eTT 53 digital televisions DTVs 53 nano imprint 53 tantalum capacitors 53 Zener diodes 53 dual damascene 53 silicon 53 baseband modems 53 CdTe PV 53 1Gb DDR2 53 K dielectrics 53 viscose staple fiber 53 Kenmos 53 corrugating 53 BOPP film 53 #cm diagonal 53 polymer capacitors 53 ingot wafer 53 Poly Vinyl Chloride 53 polybutadiene 53 Marvell #SS# 53 Esatto Technology 53 electro galvanized 53 superlattice 53 InGaN 53 EP#S# 53 triplexer 53 transistor LCD 53 IGBT Insulated Gate 53 Taiyo Yuden Co. 53 microcomponents 53 Passive Matrix 53 Strained silicon 53 Greatek 53 Fiberglass Reinforced 53 selective emitter 53 AIX #G# 53 #bps yoy [002] 53 heterojunction 53 crystalline silicon modules 53 gigabit Gb NAND flash 53 W mK 53 lithographic processes 53 Caprolactam 53 CellMath IP 53 wph 53 ArF immersion lithography 53 bipolar transistor 53 lanthanum oxide 53 coated coils 53 ceramic dielectric 53 PCB fabricators 53 DIMM modules 53 photolithographic 53 SI GaAs bulk 53 transistor leakage 53 ABS polycarbonate 53 Industry Highest Density 53 customizable dataplane processor 53 LTPS 53 di selenide CIGS 53 DDR2 DRAM 53 inch SXGA 53 3Xnm 53 testliner 53 silicon photovoltaic PV 53 PA6 53 AVY Precision Technology 53 1GB PC# 53 GaAs IC 53 x# blade servers 53 MESFET 52 nanometer lithography 52 transparent electrode 52 polyvinyl chloride resin 52 conductive coating 52 Galvanised steel 52 Abit Computer 52 polyimides 52 Prodisc Technology 52 UHMW 52 laser beam printers 52 Thinlam 52 glass substrate 52 #nm immersion 52 megabit DDR 52 fabless IC 52 #nm geometries 52 laser scribing 52 cemented carbides 52 eTT 52 GbE SFP + 52 embedded passives 52 CCD CMOS 52 monocrystalline wafers 52 wire bonder 52 MTP NVM 52 x4 x8 52 MLC NAND flash 52 HTPS panels 52 2U rackmount 52 IXP# [002] 52 #.#th generation 52 1Gbit DDR2 52 wafer bumping 52 MSM chipset 52 #mm# [002] 52 Chipbond 52 components resistors inductors 52 Ibiden Co. 52 #-Gbit/sec optical 52 SFP + module 52 interposers 52 nanometer CMOS 52 Applied Materials SunFab 52 UMC #.#um 52 CCFLs 52 MB#C# [001] 52 Intel Atom microprocessor 52 #.#mm thickness [002] 52 Nand Flash 52 Injection molding 52 wafer foundries 52 LSAW pipes 52 welding electrodes 52 Leadless 52 stainless steel housings 52 insulating substrate 52 Richtek 52 silicon germanium SiGe 52 Printed Circuit Materials 52 #G CFP 52 phenol acetone 52 Si substrates 52 PET resin imports 52 4U chassis 52 ultrafiltration membrane 52 #.#GHz PowerPC 52 RoCE 52 Handset shipments 52 LiNbO3 52 LED backlit LCD TVs 52 fluorescent backlighting 52 titanium pigment 52 serdes 52 AdvancedMC AMC 52 RF SiP 52 indium gallium arsenide InGaAs 52 #nm DRAM 52 #nm SRAM 52 DRAM SRAM 52 Epitaxial 52 Analog Devices Inc ADI.N 52 electron tubes 52 MEMS gyroscopes 52 projected capacitive 52 inductive sensors 52 KRW #-#,# t 52 Gigabyte X#A 52 #GbE switches 52 serial EEPROM devices 52 gigabit DDR3 52 LDMOS RF power 52 kbit 52 #nm node [002] 52 LBA NAND 52 tensile modulus 52 Indium phosphide 52 CMOS silicon 52 SiC wafers 52 1mm thick 52 nm Stratix IV 52 UHB LEDs 52 cone woofers 52 powder coating resins 52 Fluorescent lamps 52 Co. TWSE 52 CIGS Copper Indium 52 radial leaded 52 passivating 52 Kuan Yin Taiwan 52 Synthetic rubber 52 GaAs wafer 52 ohmic contacts 52 GaAs pHEMT 52 Organic Chemical Vapor 52 planar magnetics 52 germanium substrates 52 FTTH CPE 52 ferritic 52 acrylonitrile ACN 52 immersion litho 52 chalcogenide glass 52 #GV 52 Triquint 52 Cadmium Telluride CdTe 52 ERW pipe 52 CarbonPower R 52 Tetra Reticle Clean 52 southbridge chip 52 Phthalic Anhydride 52 organic electro luminescence 52 ZnO nanowires 52 Nvidia GeForce #M graphics 52 Yieh Phui 52 standalone metrology 52 thermally conductive 52 leadframe 52 solar photovoltaic PV modules 52 SAC alloys 52 LPCVD 52 silicon photonic 52 forgings castings 52 Shipment volumes 52 multichip packages 52 polycarbonate resin 52 transparent conductive oxide 52 DSi etch 52 Czochralski 52 microstrip 52 #Gbit s Ethernet [002] 52 units BLUs 52 InGaP HBT 52 conductive epoxy 52 cemented carbide 52 Mosfet 52 ArF dry 52 prismatic cells 52 Silterra Malaysia Sdn 52 electroless copper 52 WLAN chipsets 52 PbS 52 OTFT 52 SiPs 52 Socket AM3 52 MOCVD reactor 52 microfabrication techniques 52 Yageo Corporation 52 ETXexpress 52 inch sapphire wafers 52 thermal conductivities 52 diffusion furnaces 52 polysulfone 52 EPDM rubber 52 MOCVD tool 52 SOFC stacks 52 Krutul 52 Eng Teknologi 52 LCDs liquid crystal 52 Mux Demux 52 folding boxboard 52 PIN diodes 52 ENIG 52 selective emitter cells 52 SiC epitaxial wafers 52 CIGS solar 52 Gigabit PHY 52 coextruded 52 Intel Atom chipset 52 AlSiC 52 PQFP 52 MOCVD reactors 52 Hybrid Hard Drives 52 nanometer nm NAND flash 52 monolithic CMOS 52 polyamide PA 52 insulator wafers 52 DRX #D 52 monolithic microwave integrated 52 SLC NAND flash 52 NOR Flash Memory 52 #Gb NAND 52 GaSb 52 gallium indium arsenide 52 LCoS liquid crystal 52 mm silicon wafers 52 output capacitors 52 PCIe interconnect 52 boron trifluoride 52 Thin Film Transistor 52 GaN layers 52 transistor HEMT 52 thermo mechanical 52 thermoform 52 5M pixel 52 nm SOI 52 super twisted nematic 52 RFeICs 52 3mm x 3mm x 52 geometries shrink 52 ceramics fracture proppants 52 TIBURON Calif. BUSINESS WIRE 52 etch circuits 52 #.#u 52 Gallium Arsenide GaAs 52 UltraSPARC IIIi 52 ZnSe 52 DRAM memory 52 mono crystalline 52 baseband semiconductors 51 QMEMS 51 Dual Frequency 51 Prepreg 51 4Gbit s 51 stainless steel fasteners 51 millimeter wafer 51 mm ² 51 Intel GM# [001] 51 inch WXGA 51 asynchronous SRAM 51 Centrino chips 51 metalorganic chemical vapor deposition 51 SOI substrate 51 Thermo Plastic 51 CMOS wafer 51 phosphor coated 51 Plastic Additives 51 FeRAM 51 E pHEMT 51 parasitic inductance 51 PDPs plasma display 51 Toppoly Optoelectronics 51 MEMS oscillators 51 semiconductor fabs 51 SiC substrates 51 nanometer transistors 51 polyurethane PU 51 diodes transistors 51 density fiberboard 51 electrolytic aluminum 51 NanYa Plastic 51 #nm lithography [002] 51 silane gas 51 #MHz ARM# 51 #G transceivers 51 cordierite 51 HomePlug compatible 51 wafer prober 51 package SiP 51 Schottky rectifiers 51 tellurium selenium iridium 51 Quiescent current 51 sise 51 WCDMA handset 51 embedded microprocessors 51 Arima Communications 51 hydraulic presses 51 Liteon 51 #MB DDR2 [001] 51 QXGA 51 TSMC #.#um 51 Compact PCI 51 port #GBASE T 51 elastomeric seals 51 Sintek 51 photoconductor 51 nanometer silicon 51 Gigabit DDR2 SDRAM 51 SOIC packages 51 phenolic resins 51 BCTMP 51 UMCi 51 nm CMOS 51 Solamet 51 paints coatings adhesives 51 reflow soldering 51 aluminum foils 51 MP3/PMP 51 Hynix DRAM 51 TPO Displays 51 polyolefin resins 51 hotrolled 51 Gallium Arsenide 51 HyperSolar concentrator 51 parasitic capacitance 51 Cree GaN 51 mono crystalline silicon 51 InGaP 51 #.#mm thickness [003] 51 pre preg 51 TurboCap 51 styrene monomers 51 nanoimprinting 51 XinTec 51 2Gb DDR3 51 welded tubes 51 semiconductor fabricators 51 serializer deserializer 51 #/#-inch thick [001] 51 LG Display LGD 51 InSb 51 indium nitride 51 pluggable optics 51 STLC# 51 Radio Frequency Integrated Circuits 51 IGBT module 51 exotic alloys 51 MV switchgear 51 gigabit DRAM 51 adhesive dispensing 51 kt yr 51 ChipMos 51 interposer 51 DSL aggregation 51 Holtek Semiconductor 51 automotive catalytic converters 51 #GbE switch 51 HannStar Display 51 Mask ROM 51 produces PET polymers 51 niobium titanium 51 #GbE PHY 51 ZIF connector 51 #nm MLC 51 Strained Silicon 51 antireflection 51 plasma etching 51 monocrystalline polycrystalline 51 8HP 51 #MB DDR# 51 Suryajyoti Spinning 51 String Ribbon solar 51 RF amplifiers 51 wafer fabrication equipment 51 Opti Probe 51 #x#mm [003] 51 LDO voltage regulator 51 SOI wafers 51 Radiant Opto Electronics 51 nanotube arrays 51 Gigabit PoE 51 transparent conductive electrodes 51 wafer bonder 51 Integrated Device Manufacturers IDMs 51 CyberTAN Technology