Related by context. All words. (Click for frequent words.) 73 -# deg C 68 -# degreesC 67 +# º C [002] 67 +# degreesC 67 +# degrees Celsius [001] 66 deg F 66 Deg C 65 +# ° C [002] 65 +# degrees Celsius [002] 65 +# ° F 65 +# º C [001] 65 +# degC [001] 64 +# degrees Centigrade 64 ˚ F 64 +# ° F. 64 #degC [002] 64 ° C ambient 64 -# ˚ C 64 +# deg C [002] 64 C 64 solder reflow 63 +# oC 63 degC 62 Halifax Weather Overcast 62 -# ° [002] 62 #oF [001] 62 #oC [001] 62 -# º C [001] 62 +# degC [002] 62 Â ° C. 62 ° C 62 -# degrees Celcius 61 degreesF 61 -# º [001] 61 +# ° C [001] 61 #Â ° C 61 ° C/# 61 degrees farenheit 61 degreesC 61 oC 61 -4 ° 61 ° C ambient temperature 61 +# ° C. [001] 61 -# ° F [001] 61 Mostly Cloudy Currently 60 -# degrees Centigrade 60 #F #C [001] 59 Meanwhile preheat oven 59 Kelvin -# 59 -# ° F [002] 59 ˚ F. 59 ˚ C 59 -# ° Celsius [001] 59 ℃ 59 C0G 59 +# deg [002] 59 ¢ ª 58 5μm 58 freezeproof 58 -# ˚ 58 +# º 58 microampere 58 ⁰ C 58 -# ° Fahrenheit 58 PREHEAT oven 58 Min Temp #.# 58 ° Fahrenheit 58 -5 ° C 58 #Â º C 58 Min temp 58 isotherm 58 input capacitance 58 annealing temperature 58 pin 4mm x 58 W/cm2 58 º Fahrenheit 58 degF 58 +# º C. 57 #Â ° F [002] 57 #degreesC 57 -# º F [001] 57 cryogenic temperatures 57 kelvin -# 57 ° F -# ° 57 celcius 57 8kV 57 #Â ° C. 57 -# deg [002] 57 ° C. 57 ambient temperature 57 º C 57 -# ° C [001] 57 conduction cooled versions 57 +# ° C. [002] 57 dielectric strength 57 reflow temperatures 57 absolute TCR 57 -# º C [002] 57 -# degrees Celsius [001] 57 -# ° C [002] 56 #deg C 56 #C #F [003] 56 degrees celcius 56 microvolts 56 #.degree [002] 56 ambient temperatures 56 ° F 56 Max Temp 56 ° -# ° [001] 56 º F 56 convection cooled 56 #oC [002] 56 Reheat leftovers 56 pin TSSOP package 56 ± #ppm [001] 56 -5 ° 56 W mK 56 corrosive environments 56 -# º F [002] 56 0C 56 temperature coefficients 56 pin BGA 56 4mA 56 ohm cm 55 OptoCooler HV# 55 cm ² 55 dewpoint temperature 55 ˚ C. 55 -# Celsius [001] 55 fahrenheit 55 -5 degrees Celsius 55 capacitance values 55 TSSOP package 55 clamping voltages 55 temperature 55 Liquid helium 55 SO8 55 -5 ° C. 55 -# º C. 55 degress Celsius 55 degrees fahrenheit 55 moisture absorption 55 conduction cooling 55 º Celsius 55 +# deg [001] 55 Relative humidity 55 #pF [001] 55 2oC 54 ohmic 54 ppm ° C 54 uncooled 54 Quiescent current 54 AEC Q# qualified 54 ⁰ 54 rugged conduction cooled 54 -1 ° C 54 thermoelectric cooler 54 luminous flux 54 kΩ 54 5mm QFN package 54 mbar 54 #VDC [002] 54 corrosive atmospheres 54 temperature gradients 54 thermally stable 54 -# ° Celsius [002] 54 moldability 54 #um [002] 54 milliohm 54 ° F. 54 kPa 54 convection cooling 54 piezo actuator 54 thermal EMF 54 #.degree [001] 54 degree Centigrade 54 derate 54 mK 54 +# deg C. 54 turbine inlet 54 amperometric 54 #mm ² [001] 54 pin LQFP package 54 TDFN packages 54 pin SOIC packages 53 thermal conductivities 53 -4 ° F 53 1ppm 53 #Ω [002] 53 tiny 3mm x 53 #VAC [002] 53 spindle speeds 53 LVDTs 53 heat indicies 53 μW 53 #.#oC [002] 53 NTC thermistor 53 #.#Hz 53 ° -# ° [002] 53 Intel Atom processor Z5xx 53 conduction cooled 53 superior heat dissipation 53 ° F/# ° C [001] 53 -# degrees centigrade [002] 53 #degrees [002] 53 thermal dissipation 53 reflow soldering 53 +7 +# 53 #V dc [001] 53 #.#in [004] 53 controlled crystal oscillator 53 dewpoint 53 #.#nm [002] 53 Thermocouples 53 -# degrees Fahrenheit [001] 53 deg C. 53 thermal gradients 53 3mm x 53 #mΩ [001] 53 QFN packages 53 airflows 53 3 x 3mm 53 #Â º [001] 53 ° C/# ° F [001] 53 thermal foldback 53 thermowells 53 transmissivity 53 hygrometers 53 ZXLD# 53 viscoelastic properties 53 BLDC motors 53 -# ° C. [001] 53 Kelvins 53 ° F/# ° C [002] 53 #.#kV [001] 53 thermoelectric cooling 53 1mA 53 -# ° C. [002] 53 SMT LEDs 53 V dc 52 -#.# ° C 52 OCXOs 52 thermo mechanical 52 -8 ° C 52 resistive element 52 5kV 52 #bar [001] 52 flame retardance 52 #Vdc [003] 52 radial leaded 52 º -# º 52 Sparklers burn 52 pyrometers 52 ferrite core 52 degree celcius 52 #C #.#F [001] 52 +5 +# 52 #ppm ° C 52 discharge ESD protection 52 mOhm 52 relative humidities 52 eSIP 52 Temperature Probe 52 rotational torque 52 ultrahigh vacuum 52 gigapascals 52 5V input 52 ± #ppm [002] 52 emittance 52 #.#VDC 52 IP# NEMA 52 reduced graphene oxide 52 μH 52 uniaxial 52 Input voltage 52 IP# enclosure 52 pin MSOP 52 magnetic stirrer 52 dc dc conversion 52 deg C 52 melt adhesive 52 temperature coefficient 52 SOIC package 52 Vdc input 52 Reduce oven 52 #.#VI O 52 tungsten halogen 52 #Vdc [002] 52 mV g 52 polyimides 52 pin SSOP 52 8 pin MSOP 52 voltage #.#V 52 illuminance 52 magnetic rotary encoder 52 MPa 52 º F. 52 voltage derating 52 Degrees Celsius 52 #degC [001] 52 mm diameters 52 torque transducer 52 Localized mild hyperthermia 52 MyFordTouch dashboard system 52 carpet shampooers 52 FieldFox RF VNA 52 megapascals 52 ultrasonic humidifiers 52 8mm diameter 52 degrees Centigrade 52 #mA output [002] 52 √ Hz 52 normothermic 52 #deg [001] 52 pulse widths 51 kelvins 51 voltage divider 51 AFM cantilever 51 failure MTTF 51 elastic modulus 51 serial EEPROMs 51 +6 +# 51 athermal 51 mm ² 51 LWIR 51 inductive loads 51 +1 +3 51 #oF [002] 51 wafer uniformity 51 SOT# [002] 51 Voltages 51 flexural strength 51 temprature 51 #V ac 51 51 ferrites 51 minus #degC 51 #C #C [001] 51 +3 +5 C 51 rectal temperature 51 -# degrees Fahrenheit [002] 51 Thermal conductivity 51 AST# 51 #.#deg [001] 51 deg 51 -2 ° C 51 ° C ± 51 piezo actuators 51 output voltage 51 exotherm 51 degrees centigrade 51 º C. 51 SPDT switch 51 Pt# 51 #VAC [001] 51 chemically resistant 51 bipolar transistors 51 degrees Celcius 51 #.#uF 51 PID controller 51 oscillation amplitude 51 Ncm 51 #μ 51 lamp ballasts 51 ml min 51 #μF [002] 51 ° Celsius 51 #.#C #.#C 51 Serve chilled 51 pyrometer 51 melt viscosity 51 μV 51 ± #.#dB 51 tempera ture 51 humidistat 51 inductive proximity 51 #.#μF 51 LPCVD 51 ratiometric 51 #.#Ω 51 Follow Vishay 51 -7 ° C 51 #deg [002] 51 QFNs 51 millimeter mm 51 3mm x 3mm 51 thermally activated 51 triaxial 51 ADXL# 51 thermally conductive 51 mA output 51 LED binning 51 handheld DMMs 51 Celsius #.#F 51 terahertz quantum cascade 51 thermowell 51 mask aligners 51 bottomhole pressure 51 χ 51 coil voltages 51 dielectric permittivity 51 Z Foil 51 Weather Partly cloudy 51 XPH #U 51 NEMA 4X enclosure 51 digital potentiometers 51 tiny 2mm x 51 microamp 51 thermal impedance 51 5mm x 6mm 50 g accelerometers 50 -# ° [001] 50 AccuWeather.com RealFeel ® 50 resistant magnesium alloy 50 cryogenic cooling 50 magnetic permeability 50 EEPROMs 50 #uA [001] 50 -3 ° C 50 Centigrade 50 conductivities 50 angular displacement 50 thermocouples 50 melt adhesives 50 shaft diameters 50 +# dBu 50 piezoresistive 50 -4 degrees Fahrenheit 50 rear defroster 50 ° C/# ° F [002] 50 Coriolis meters 50 -1 -3 50 Directions Preheat oven 50 reflow soldering processes 50 BJTs 50 #.#pF 50 NCV# 50 xenon lamps 50 #ohm [002] 50 friction coefficient 50 volts mil 50 #μF [001] 50 paramagnetic 50 membrane electrode assemblies MEAs 50 cryogenically cooled 50 tempera tures 50 Vdc 50 martensitic 50 zener diodes 50 formability 50 Mosfets 50 Method Preheat oven 50 DFN packages 50 ° C. Brush 50 dimensional tolerances 50 displacement transducers 50 IP#K 50 pin BGA package 50 MAX#E 50 VICTREX PEEK polymer 50 CMOS ICs 50 joint contracture 50 capacitances 50 IP# sealing 50 ppm deg 50 MIC#/# 50 LiNbO3 50 viscosities 50 instrumentation amplifier 50 #V AC input 50 -8 -# 50 kilopascals 50 kg m² 50 #nm wavelength [001] 50 UV wavelengths 50 vertical keystone correction 50 MAX# MAX# [001] 50 magnetostrictive 50 electrically insulating 50 UV VIS 50 #.#deg [002] 50 bandpass 50 rheological 50 PSIG 50 dropout voltage 50 -# degrees 50 VRMs 50 x 3mm 50 ppm ° C. 50 inductance values 50 ± #V [002] 50 input impedance 50 proton conductivity 50 XC# [003] 50 APTIV film 50 biaxial 50 SINDA G 50 +5 +7 C 50 μS cm 50 CF4 50 electrolytic capacitor 50 mW/cm2 50 #IU [002] 50 phototransistors 50 coplanar 50 degrees Farenheit 50 photoresists 50 AEC Q# automotive 50 leakage currents 50 tensile modulus 50 amorphous silicon Si 50 +2 +7 C 50 transmittance 50 silicone encapsulation 50 #x#mm package 50 cam lobe 50 dielectric constants 50 rim diameters 50 insulative 50 integral nonlinearity INL 50 +3 +8 C 49 hydrolytic stability 49 #mm# [002] 49 5VDC 49 fluid viscosity 49 g/m2 49 m 49 degree Celcius 49 absorption coefficient 49 #kV ESD 49 torr 49 fanless design 49 pre preg 49 synchronous buck converter 49 μm diameter 49 mΩ 49 5V tolerant 49 ± #.#mm [002] 49 durometer 49 frequency transducers 49 ASICs FPGAs 49 TO #AB 49 TQFP packages 49 Liquid nitrogen 49 optocoupler 49 nanopositioning stages 49 temperature extremes 49 temperature gradient 49 ° С 49 degrees Fahrenheit 49 #μA [002] 49 infrared emitters 49 selectivities 49 beamwidth 49 kg hr 49 6C #F 49 5V supply 49 hygrometer 49 2kV 49 tungsten electrode 49 IP# weatherproof 49 stainless steel housings 49 weldability 49 #Â ° [002] 49 typ 49 #nm Virtex 49 thermoelectric coolers 49 chipscale 49 IP# enclosures 49 Vcore 49 wetted parts 49 thermal gradient 49 fA 49 carpet extractors 49 degs 49 hPa 49 Gaussian beam 49 #'C 49 INA# 49 IP# compliant 49 mosfet 49 dimensionally stable 49 #nm #nm [001] 49 centigrade 49 EMI RFI shielding 49 enthalpy 49 -# deg [001] 49 gelation 49 Schottky rectifiers 49 MWIR 49 microwatt 49 dB insertion loss 49 electrical resistivity 49 cobblestone streets doused 49 Virtex TM 49 thermistors 49 breakdown voltages 49 1kV 49 SO8 package 49 thermal conduction 49 mu m 49 Pressure Transducer 49 non dispersive infrared 49 scrotal temperatures 49 #m# h 49 linear axes 49 Hastelloy C 49 ± #.#mm [001] 49 #.#m# [001] 49 pin 3mm x 49 #.# mW MHz 49 beamsplitters 49 LQFP 49 millidarcies 49 -# degrees Celsius [002] 49 heatsink fins 49 composite laminates 49 deg Celsius 49 accuracy repeatability 49 #A #V [002] 49 WBGT 49 compensated crystal oscillators 49 autoclavable 49 #dBm [001] 49 overmolding 49 ASTM E# [002] 49 microlitres 49 #VDC input 49 singlemode 49 pin SOT# package 49 optical encoder 49 #.#v [001] 49 ProASIC3 FPGAs 49 coupling capacitors 49 Localized mild hyperthermia #.#-# 49 capacitive loads 49 voltage MOSFET 49 sunlight readability 49 microamperes 49 UCC# 49 ballscrews 49 VCXO 49 phototransistor 49 flexural modulus 49 femtogram 49 Vrms 49 friction coefficients 49 external resistors 49 #.#F [004] 49 PQFP 49 drilled northwards 49 ° C -# ° 49 overmolded 49 2C #.#F 49 hydrolysis resistance 49 overvoltage overcurrent 49 x 3cm 49 Input Voltage 49 ATX motherboards 49 eutectic 49 variable resistor 49 mask adder 49 wind chill hovered 49 1μm 49 #.#kW [004] 49 Stanyl ® 49 solderable 48 +2 +4 C 48 +9 +# 48 -# º [002] 48 #V AC [002] 48 DirectFET ® 48 de grees 48 aluminized 48 XPH #T 48 liquid crystal polymer 48 Altivar 48 Akulon 48 inductive sensors 48 particulate contamination 48 fansink 48 glow plugs 48 Shutter speeds 48 downlight 48 overcurrent protection 48 ^ sup -1 48 ceramic capacitor 48 RealFeel 48 helicity 48 #.# mb 48 pin TQFP package 48 peltier 48 heatpipe cooling 48 mm Hg millimeters 48 Strain Gauge 48 martensite 48 static dissipative 48 relative humidity 48 pyrolytic 48 output capacitance 48 -4 ° C 48 MeV 48 MLCCs 48 Vdd 48 #μm [002] 48 thoracoabdominal 48 mm f/#.#-#.# 48 corrosion abrasion 48 UV stabilized 48 liquid nitrogen cooling 48 + -1 48 +8 +# 48 temperature setpoint 48 megohms 48 PQFN 48 thermostatic radiator valves 48 InSb 48 AEC Q# 48 SpO 2 48 thermostatic 48 spectral purity 48 polymer matrices 48 X7R 48 active ORing 48 sinters 48 specular reflectance 48 molten salts 48 circular connectors 48 milliampere 48 nitriding 48 +# Vdc 48 capacitors inductors 48 Â ± 48 -# degrees celsius 48 DUTs 48 C/# [003] 48 wirewound 48 InnerCool endovascular 48 APM#xx family 48 pin TQFN package 48 evaporator coils 48 linear encoders 48 magnetocaloric effect 48 weld slag 48 overtemperature protection 48 ° 48 TCXOs 48 #mV [002] 48 viscosity liquids 48 baseplate 48 Nd YAG lasers 48 hafnium oxide 48 microamps 48 CAN transceiver 48 ruggedization 48 absolute rotary encoders 48 5ppm 48 AlGaAs 48 #/#V 48 DFN# 48 pneumatically controlled 48 temperatures 48 soluble Cu 48 perfluoroelastomer 48 reflow oven 48 #psi [001] 48 viscosity fluids 48 infrared LEDs 48 #.#V voltage 48 flexural 48 -5 Celsius 48 1mm thick 48 #Vac 48 6GHz 48 rms jitter 48 thermodynamic properties 48 #mV V 48 varistor 48 THE MAXIMUM TEMPERATURE 48 radiative cooling 48 2degC 48 #W #W [001] 48 LDO voltage regulators 48 rugged IP# 48 Thermogard XP 48 meters/# feet [001] 48 #nm Virtex TM 48 light transmittance 48 DIN rail mounted 48 1ns 48 #nm laser [002] 48 DIN rail mounting 48 MIL HDBK #F 48 #nm immersion 48 power dissipation 48 MΩ 48 #uA [002] 48 L#A [001] 48 Brevoxyl R 48 feedthrough 48 3mm DFN package 48 thermal diffusivity 48 IP#/NEMA 48 Distagon T * 48 input voltages 48 lbf 48 #C [004] 48 ps nm 48 #Â ° F [001] 48 moisture vapor 48 psig 48 vaporisation 48 SOT# package [001] 48 LED emitter 48 moisture ingress 48 voltages 48 +# VDC 48 NEMA Type 48 ± #kV 48 T8 lamps 48 Foil resistors 48 angulation 48 mL kg 48 weatherability 48 manometer 48 varactors 48 V ac 48 nanopositioning 48 UHMW 48 pacing defibrillation circulation 48 ° sec 48 GOA WEATHER Temp 48 K dielectrics 48 watt TDP 48 emissivity 48 ceramic composites 48 cm -2 48 #.#F [001] 48 #ksps 48 conductive adhesives 48 Inductors 48 5Vdc 48 #.#μm CMOS 48 kHz frequency 48 demisting 48 chromium alloy 48 Model LTC# 48 W/m2 48 Varistors 48 5mA 48 millisecond annealing 48 WEST CENTRAL Temperatures 48 molar ratio 48 coplanarity 48 epitaxial layer 48 #V dc [002] 48 bypass capacitor 48 μsec 48 bend radii 48 welded seams 48 mT 48 cm2 48 DirectFET package 48 uV 48 quiescent currents 48 DirectCU 48 lidding 47 evaporative condensers 47 θ 47 heat dissipation 47 withstands harsh 47 OCXO 47 foil resistors 47 voltage coefficient 47 thermistor 47 kelvin 47 tensile strengths 47 backshells 47 emission wavelength 47 gasketed 47 thermal conductance 47 digital multimeter 47 offgas 47 hydraulic presses 47 1mW 47 #.#V [002] 47 #K #K [002] 47 GOT #T 47 Twin Frozr III 47 vapor retarders 47 μs 47 X7R dielectric 47 AMIS # 47 Senpai Series 47 hysteresis 47 μm thick 47 kGy 47 #.#V #.#V [002] 47 2C #F 47 MSOP packages 47 aluminum fins 47 reflow 47 +5 VDC 47 tensile stress 47 -5 -6 47 photon flux 47 ft sec 47 #A #F 47 testo 47 meV 47 wafer metrology 47 serum magnesium 47 compressibility 47 plate heat exchanger 47 planar magnetics 47 linearisation 47 dc voltage 47 chromium chloride 47 Total Harmonic Distortion 47 milliamperes 47 thermally induced 47 thermometer hovered 47 XR#M# 47 NDIR 47 oscillation frequency 47 resonance frequency 47 #lm [001] 47 backrest angle 47 4kV 47 OTDR modules 47 #F #C [003] 47 X#.# [003] 47 ionic contaminants 47 injection molded parts 47 -2 -7 C 47 #f #c 47 compression molded 47 utensil washing 47 impedances 47 ALT elevation 47 degree centigrade 47 #F #F [002] 47 isotropic 47 PoE PD 47 0C #F 47 pF 47 NTC thermistors 47 • LA CYGNE 47 intercooling 47 nitride semiconductor 47 underfill 47 nitrided 47 antibiotics biocides disinfectants 47 decibels dB 47 pH ORP 47 aluminized steel 47 4mm thick 47 dewpoints 47 ceramic superconductors 47 broadly tunable 47 WEATHER Sunny 47 NEMA 4X 47 frictional resistance 47 washdown environments 47 ED# [002] 47 magnetic encoders 47 rigid substrates 47 XPH #TU 47 harmonic filters 47 TEGs 47 entrapped doxorubicin 47 -6 ° C 47 DIMM modules 47 GOA WEATHER Max 47 reflow solderable 47 workpieces 47 preheaters 47 IR thermography 47 5C #F 47 osmolality 47 chip resistors 47 #VDC [001] 47 #Vac input 47 С 47 electrically noisy 47 flowability 47 Å -1 47 flexures 47 -2 +3 47 -3 -5 47 Ionic liquids 47 output voltages ranging 47 flexure 47 #.#mA [002] 47 psia 47 PIN diodes 47 laminating adhesives 47 ownership CoO 47 Hastelloy