Related by context. All words. (Click for frequent words.) 67 solder bumps 64 reflowed 64 coplanar 63 5μm 63 singulation 63 wirebond 62 advanced leadframe 62 capacitances 61 thermoform 61 chipscale 61 overwrap 61 conductive epoxy 61 Si substrate 61 leadframes 61 cuvette 61 QSOP 61 multilayer ceramic 61 #.#x#.#mm 60 connectorized 60 solder mask 60 stripline 60 #x# mm QFN 60 photoconductor 60 DFN# 60 laminations 60 coextrusion 60 parasitic inductance 60 BGA packaging 59 #mm ² [001] 59 4mm x 4mm QFN 59 transimpedance amplifier 59 dimensional tolerances 59 transistor arrays 59 flex circuits 59 geometric tolerances 59 BGA packages 59 mm ² 59 5mm QFN package 59 diecutting 59 wafer prober 59 bonder 58 #x# mm [004] 58 overmolding 58 mounting flanges 58 photolithographic 58 UHMW 58 wire bondable 58 leadframe 58 pin PBGA 58 platens 58 laminate substrate 58 pin BGA 58 resistive element 58 piezo actuators 58 dielectric layers 58 pin SOIC 58 2mm x 3mm DFN 58 demultiplexer 58 loopback mode 58 microtubes 58 8mm x 8mm 58 microstrip 58 silicide 58 nanotubes nanowires 58 #μm [002] 57 wafer dicing 57 wafer probers 57 reflow solder 57 die bonders 57 conductive adhesive 57 busbars 57 pcb 57 1mm thick 57 Lithium ions 57 metallised 57 pin TDFN package 57 4 x 4mm 57 outfeed 57 underfill 57 piezoelectric ceramic 57 substrate 57 pneumatically driven 57 defect densities 57 ballscrew 57 TDFN packages 57 capillary tube 57 fusion splice 57 Flip Chip 57 electrically isolated 57 7mm x 57 DIN rail mounting 57 flexo plates 57 #.#in [004] 57 pin TQFP 57 SMA connectors 57 paperboard boxes 57 differential impedance 57 #.#um [001] 57 autoclavable 57 microswitches 57 threaded fasteners 57 self assembled monolayer 57 leadless 57 CMOS circuitry 57 tamper evident seal 57 #x# mm [003] 57 interposer 57 static dissipative 57 voltage divider 57 busbar 56 overmolded 56 fanfold 56 solderable 56 rigid substrate 56 feedthrough 56 fiber optic transceivers 56 microcapillary 56 surface mountable 56 optical waveguides 56 5mm x 5mm QFN 56 wirewound 56 unmating 56 QT# [001] 56 decoupling capacitors 56 nanoliter 56 linear encoder 56 μm thick 56 leadless chip 56 bimetal 56 x 1mm 56 coplanarity 56 VICTREX PEEK polymer 56 feedthroughs 56 mounting flange 56 1μm 56 tiny 3mm x 56 diffraction grating 56 WaferPro 56 pin DIP 56 LVCMOS 56 pin 5mm x 56 toolholder 56 cuvettes 56 inductive proximity 56 servo driven 56 eutectic 56 #.#mm ² 56 wafer thickness 56 measuring #.#mm x [001] 56 Clearview xPAK 56 6mm x 6mm 56 x 9mm 56 conductive adhesives 56 reflow oven 56 cartoners 56 substrates 56 microvia 56 FPCs 56 multichip modules 56 #.#mm diameter [002] 56 TQFP# 56 SOIC 8 56 capacitive coupling 56 ferrite core 56 ferrules 56 ferrite beads 56 coextruded 56 x 3mm 56 #x#mm QFN 56 pin LQFP 56 microfabricated 56 LDO voltage regulators 56 individually addressable 56 linewidths 56 tighter tolerances 56 sterilizable 56 4mm thick 56 multipin 56 coaxially 56 insertable 56 8mm diameter 56 calcium fluoride 56 reflow soldering 56 inductances 56 metalized 56 die bonder 56 Tektronix oscilloscope 55 LQFP package 55 nitride layer 55 2μm 55 8 pin SOIC 55 photoconductive 55 wafer metrology 55 external EEPROM 55 Ball Grid Array 55 GaN layer 55 TappingMode 55 QFNs 55 optically coupled 55 TSSOP# 55 TDFN package 55 LTPS TFT 55 crystallinity 55 chip inductors 55 5V CMOS 55 thermowell 55 microcapsule 55 corrugate 55 CMOS fabrication 55 parasitics 55 corrugated paperboard 55 parasitic capacitance 55 cored wire 55 collimators 55 infeed 55 silicon nanocrystals 55 pin TSSOP 55 flexible screw conveyors 55 shaft collars 55 capacitive sensor 55 stackability 55 multiwall 55 GaN layers 55 microwell 55 midplane 55 mount SMT 55 #μm [001] 55 rigid substrates 55 3 x 3mm 55 planarization 55 TQFP package 55 robotic palletizing 55 package SiP 55 nitrided 55 piezoelectric sensors 55 SMT LEDs 55 tiny 2mm x 55 5mm x 6mm 55 #.#mm x [003] 55 nanopatterns 55 rewinders 55 TQFP packages 55 SiPs 55 rotary encoder 55 ferrite bead 55 pin 3mm x 55 PQFP 55 DFN packages 55 Follow Vishay 55 decoupling capacitor 55 #mm# [002] 55 rollstock 55 PIN photodiodes 55 microfluidic chips 55 extrudate 55 pin SOT 55 bend radii 55 SO8 55 heat sealable 55 QFN packages 55 FBGA package 55 particulate contamination 55 vacuum gripper 55 RF connectors 55 monolithic CMOS 55 IR#S 55 RGB pixels 55 PWM pulse width modulation 55 infeed conveyor 55 PCB layout 55 QMEMS 55 Ohm impedance 55 interposers 55 DUTs 55 microlens array 55 daughterboard 55 epitaxial layer 55 EOAT 55 mux demux 55 RFID inlay 55 digitisers 55 baseplate 54 quartz crystal oscillator 54 #μm thick [002] 54 inductors capacitors 54 piezo ceramic 54 ATmega#P [001] 54 impedance matching 54 1RU chassis 54 machinable 54 pin TQFP package 54 JTAG port 54 interdigitated 54 barium ferrite 54 4mm x 54 rfid reader 54 sleeving 54 radial leaded 54 #.#μm [001] 54 pin TQFN 54 saddle stitch 54 multimode optical fiber 54 D2PAK 54 DIN rails 54 pin TSOP 54 flexographic plates 54 PIN photodiode 54 singlemode 54 threshold voltages 54 piezo electric 54 RF transmitter 54 pin LFCSP 54 tunable wavelength 54 lidding 54 crosspoints 54 MLCC capacitors 54 aluminum electrolytic capacitors 54 8 pin MSOP 54 integrally molded 54 hydraulically actuated 54 #/#-in [001] 54 solder bump 54 wafer probing 54 pre preg 54 leadless package 54 multilayers 54 predrilled holes 54 polymerized 54 overmold 54 Pressurex ® 54 microlenses 54 interchangeable modules 54 RF baseband 54 cordsets 54 6 pin SOT 54 imagesetter 54 sapphire wafer 54 silicon crystals 54 wafer bumping 54 5mm x 5mm 54 TFT substrate 54 BGAs 54 bayonet coupling 54 crystal resonator 54 PBGA 54 SiGe bipolar 54 x #.#mm [005] 54 Hastelloy C 54 micrometer thick 54 microgel 54 DIN rail mount 54 parameter settings 54 sq. mm 54 precise tolerances 54 workpieces 54 moldability 54 silicon waveguide 54 overtemperature protection 54 APTIV film 54 LVDS output 54 solder reflow 54 pin BGA package 54 servo amplifier 54 × #mm [002] 54 BGA package 54 μm diameter 54 belt conveyor 54 weldments 54 layer graphene 54 5nm 54 accuracy repeatability 54 PWBs 54 servomotor 54 checkweigher 54 cartoner 54 reed switches 54 byte FIFO 54 JFET 54 lithographic processes 54 Schottky rectifiers 54 GNRs 54 nitride semiconductor 54 adhesive vinyl 54 CMOS IC 54 PCBAs 54 nickel hydroxide 54 CONNECTORS 54 defectivity 54 #kHz switching frequency 54 electrically insulating 54 baseplates 54 silicon interposer 54 backshells 54 capacitive touch sensor 54 photoelectric sensors 54 NiPdAu 54 #V MOSFETs [002] 54 EMIF# 54 TSSOP package 54 epiwafers 54 Stahlfolder KH 54 screw fastening 54 spherical roller bearings 54 mer oligo microarrays 54 #nm lithography [002] 54 aspheric lens 54 non pyrogenic 54 #x#mm [002] 54 planar magnetics 54 rovings 54 carbon nanotube CNT 54 leadless packages 54 backside metallization 54 #.#mm diameter [001] 54 tensile stress 54 rotationally symmetric 54 vibratory feeder 54 rigid PVC 54 varying thicknesses 54 #mm ² [002] 54 backplane connectors 54 rugged IP# 54 milliohm 53 airgap 53 TiN 53 TLP# 53 piezo actuator 53 thermal dissipation 53 polymerizes 53 printer applicator 53 granulate 53 k dielectric 53 thermal conduction 53 valve manifolds 53 diplexers 53 2mm x #.#mm 53 sub picosecond 53 scintillators 53 glass frit 53 mating connector 53 thyristor 53 5mm x 53 hexagonal lattice 53 BGA CSP 53 stereolithography 53 MOS transistors 53 #:# LVDS 53 DIN rail mountable 53 zener diodes 53 metallisation 53 absolute rotary encoders 53 bilayers 53 trunnion 53 1RU rack 53 laser annealing 53 GaN wafers 53 SWCNT 53 thinner wafers 53 pipette tips 53 piezoelectric transducer 53 8bit MCU 53 triaxial accelerometer 53 nematic 53 1mm x 1mm 53 QFN 53 varistor 53 chip resistor 53 microvias 53 DIN rail mounted 53 workcell 53 mosfet 53 #.#mm x #.#mm [002] 53 density interconnect HDI 53 composite laminates 53 rotary actuators 53 ferro electric 53 bypass capacitor 53 #bit ADC 53 thermoplastic elastomer 53 M# connectors 53 polyaxial 53 phototransistor 53 monolithically integrated 53 pin SSOP package 53 variable resistor 53 SiT# 53 viscoelastic properties 53 solder spheres 53 #.#mm# [002] 53 pin SOIC package 53 micrometre scale 53 checkweighing 53 Arria GX FPGAs 53 #mm# [001] 53 detector arrays 53 inductive sensors 53 parametrically 53 heterostructure 53 pipette tip 53 filament winding 53 varying diameters 53 molded silicone 53 UV flexo 53 cancellous 53 5mm thick 53 transceiver IC 53 fusible 53 AEC Q# qualified 53 torque wrenches 53 micron thick 53 7mm x 7mm 53 Flanged 53 rotor shaft 53 hydraulic presses 53 thermoformed 53 mechanical actuators 53 debonding 53 pin QFP 53 x 5mm 53 superlattice 53 membrane keypads 53 tensile strengths 53 VFFS 53 #Mx# [002] 53 phosphor coated 53 wph 53 thermally conductive 53 magnetic separator 53 QFN# package 53 pMOS 53 tight tolerances 53 strain gage 53 hex wrench 53 photopolymer 53 hex nut 53 ultrasonic welding 53 electret 53 ultrahigh purity 53 LVDS interfaces 53 dielectric constants 53 CAN transceiver 53 CCD detector 53 multichip 53 LQFP# package 53 modular conveyors 53 QFPs 53 flexo gravure 53 GaAs substrate 53 capillary tubes 53 polyurethane PUR 53 planetary gears 53 swarf 53 #m/min [002] 53 pin SOIC packages 53 HV# [001] 53 rotogravure printing 53 twin screw extruder 53 EEPROM emulation 53 CMOS circuits 53 radiopaque 53 optically transparent 53 LiNbO3 53 external inductor 53 di selenide CIGS 53 PQFN package 53 polymeric 53 ESD diodes 53 thermowells 53 wetted parts 53 SO8 package 53 biologically inert 53 zirconium oxide 53 weld seam 53 inductive sensor 53 trayed 53 TrueFocus 53 tack welded 53 boron carbide 53 servo amplifiers 53 Mach Zehnder modulators 53 triaxial 53 micron diameter 53 superior heat dissipation 53 magnetostrictive 53 Document Feeder 53 hardcoat 53 palletiser 53 #nm CMOS [002] 53 epoxy matrix 53 synchronous MOSFET 53 input capacitance 53 nonmagnetic 53 aluminum electrolytic 53 TGA# SM 53 ZnSe 53 graphene layers 53 piezo motor 53 isotropic 53 toner adhesion 53 micrometer scale 53 QFN packaging 53 hermetic packaging 53 boron atoms 52 toroids 52 TQFN package 52 ownership CoO 52 motor windings 52 pulse width modulator PWM 52 e beam lithography 52 microswitch 52 hollow fibers 52 chip resistors 52 Stratix II GX FPGA 52 nonpolar GaN 52 ± #.#mm [001] 52 paraffin embedded tissue 52 wirebonding 52 UV stabilized 52 eluent 52 #um [002] 52 pneumatically actuated 52 deterministic jitter 52 polydimethylsiloxane PDMS 52 handwheel 52 #kV ESD 52 spindle speeds 52 gallium phosphide 52 3mm DFN 52 multibit 52 varying densities 52 flange mount 52 fused silica 52 synchronous buck converter 52 #pF [001] 52 RGB LEDs 52 palletisers 52 transmissive 52 ultrathin layer 52 #Kbytes [002] 52 2mm x 2mm DFN 52 nanotube arrays 52 4U chassis 52 uniaxial 52 cermet 52 oppositely charged 52 #.#uF 52 chromatography columns 52 rigid flex 52 6mm diameter 52 AdvancedMC modules 52 opto couplers 52 Laser VCSEL 52 mandrel 52 micron pixels 52 paperboard tubes 52 voltage MOSFET 52 SOIC package 52 torque transducers 52 hinged lid 52 sintered metal 52 solvent evaporation 52 extruded profiles 52 4mm x 4mm 52 nanohole 52 3mm x 3mm QFN 52 #.#mm thick [002] 52 synchronous buck controller 52 hermetically sealed ceramic 52 granulates 52 Lynx2 52 magnetic permeability 52 jitter tolerance 52 Sigma fxP 52 serializer deserializer SerDes 52 AirMax VS 52 linearisation 52 AWG wires 52 rewinder 52 RF modulator 52 pinouts 52 array BGA 52 LVDS interface 52 Mbit SRAM 52 microtiter plates 52 #Ω [002] 52 nondestructively 52 belt conveyors 52 concentricity 52 servo controlled 52 conductive coating 52 moisture absorption 52 thermoelectric cooler 52 pipe diameters 52 chamfers 52 PlateRite FX# 52 Cree GaN 52 MCP#X 52 TBU TM 52 #ohm [001] 52 USB DAQ 52 rotaxanes 52 XFP module 52 welded seams 52 CIGS Copper Indium 52 dielectric strength 52 Samsung OneDRAM 52 ferrite 52 rheometer 52 #.#μm CMOS process 52 cadmium chloride 52 nanoholes 52 Leadless 52 pinion shaft 52 passivation 52 MTS# 52 optical transceiver modules 52 chemically bonded 52 PolyJet 52 rotor stator 52 connectorization 52 ± #V [001] 52 ± #.#mm [002] 52 digital flexo plates 52 metallized 52 stator windings 52 photopolymer plates 52 LRUs 52 #.#V CMOS 52 3mm x 3mm 52 beam splitter 52 AdvancedMC module 52 roller conveyors 52 retractable cord 52 spherical bearings 52 Anapurna M 52 PBGA package 52 wideband RF 52 reentrant 52 weldable 52 7 x 7mm 52 fiducial 52 thermal conductivities 52 pearlite 52 #mm x #mm [005] 52 NiSi 52 alumina ceramic 52 VHP# 52 VESA mounting 52 coiler 52 SMA connector 52 photodiode 52 LVDS outputs 52 film transistors TFTs 52 linear axes 52 linearly polarized 52 Joule heating 52 .# micron 52 micropipette 52 indium gallium arsenide 52 flexures 52 pellicle 52 pigment particles 52 OP# [003] 52 pulse width modulation 52 #x#x# mm [001] 52 bypass capacitors 52 parameterisation 52 #x#x#.# mm 52 outer sheath 52 DFN package 52 UV curable ink 52 MTP MPO 52 electroless copper 52 etching DRIE 52 silicon Si 52 nonconductive 52 Serdes 52 workpiece 52 mandrels 52 gasketed 52 Xilinx FPGA 52 subminiature 52 termination resistors 52 programmable microcontroller 52 vibratory feeders 52 passivating 52 dielectric layer 52 micromachined 52 hydride vapor phase 52 IP# enclosures 52 wire bonder 52 FOUP 52 compressive stresses 52 extrusion coating 52 triplexer 52 z axis 52 swivel casters 52 exacting tolerances 52 Langmuir Blodgett 52 palletizers 52 8 pin TDFN 52 planar 52 dimensionally stable 52 impedances 52 #kN [002] 52 reflow profiles 52 Valox 52 analog circuitry 52 eutectic solder 52 MI #XM 52 spherical particles 52 slitter rewinders 52 input impedance 52 firestop 52 polymer matrix 52 micron thickness 52 inertial sensing 52 electromechanical relays 52 diode arrays 52 #Kbyte [002] 52 ballscrews 52 WLCSP 52 thermo mechanical 52 stainless steel housings 52 3mm x 3mm DFN 52 #um [001] 52 SWNT 52 thermally stable 52 indium arsenide 52 BNC connector 52 electrolyte membrane 52 silicone gasket 52 LC connector 52 aligned carbon nanotubes 52 coating thickness 52 magnetic separators 52 sortation systems 52 solder bumping 52 FOUPs 52 heat shrinkable tubing 52 capacitors inductors 52 coated polyester 52 InAs 52 prefilter 52 silicone coating 52 5V supply 52 PEEK OPTIMA 52 screw conveyor 52 #A #V [002] 52 crankshaft bearings 52 sensing resistor 52 microfluidic channels 52 NEMA 4X enclosure 52 MOSFET gate 52 mm LFCSP 52 axis CNC 52 iCoupler 52 MLCCs 52 palletizer 52 melt viscosity 52 paramagnetic 51 wafer bonders 51 adhesive residue 51 conductivities 51 photoelectric sensor 51 multirate 51 NIST traceable 51 ISL#E [002] 51 imprinter 51 Datamate 51 pin QFN 51 nanometric 51 SOIC packages 51 #.#μm CMOS 51 #.#mm x #.#mm [003] 51 polystyrene beads 51 pentacene 51 vinyl ester resin 51 copper metallization 51 metallic foils 51 Quick Disconnect 51 flexo printed 51 reflowable 51 biaxial 51 home tna public html 51 Carbon nanotube 51 sintered 51 #.#pF 51 LQFP 51 SP#E 51 pinion gears 51 proteinaceous 51 FFC FPC 51 subrack 51 electrode assemblies 51 polytetrafluoroethylene PTFE 51 photomultipliers 51 #x#mm package 51 coupling capacitors 51 mono crystalline silicon 51 hydraulically powered 51 Mbit MRAM 51 ultrasonic transducers 51 FBGA packages 51 pallet conveyor 51 backplane traces 51 valves actuators 51 3mm DFN package 51 microbalance 51 color CMYK 51 bayonet mount 51 retort pouch 51 #ksps 51 ultrasonic vibration 51 snubber 51 PIN diode 51 toolholders 51 collets 51 hot swappable modules 51 vacuum suction 51 quartz oscillators 51 thermoplastic urethane 51 Aerosol Jet 51 anneal 51 jitter measurement 51 AlGaN 51 thermally bonded 51 passivated 51 Si#/# 51 diffractive optical elements 51 optionally configured 51 indium gallium phosphide InGaP 51 seam sealer 51 trans impedance 51 PWM output 51 injection moldable 51 flowability 51 1cm thick 51 characteristic impedance 51 platen 51 indium gallium arsenide InGaAs 51 output capacitors 51 nano patterning 51 gear reducers 51 leakage currents 51 photodiode arrays 51 gate dielectrics 51 paperlike 51 PET preforms 51 motorized faders 51 9V battery 51 cadmium selenide 51 corrosion resistant stainless steel 51 membrane switches 51 SOT# [001] 51 mm diameters 51 LSA#A 51 millimeter diameter 51 #x# matrix 51 omni directional antenna 51 thickness uniformity 51 phototransistors 51 nm VCSEL 51 metering pumps 51 threaded inserts 51 microtiter plate 51 rotationally molded 51 injection molding extrusion 51 3cm thick 51 silicon nanowire 51 photodiode array 51 PCB mountable 51 RS# interface 51 thermally activated 51 Co2 laser 51 TVS diode 51 mask aligners 51 nanometer nm CMOS 51 PID controllers 51 IntelliMAX 51 MWNT 51 photoresist 51 impedance measurements 51 wave soldering 51 SWIR cameras 51 lithographic patterning 51 FPC connectors 51 resin impregnated 51 semiconductive 51 walled carbon nanotube 51 epitaxial substrates 51 #G OTN [002] 51 igubal 51 microstructured 51 PVC tubing 51 MSOP packages 51 crystalline Si 51 milling spindle 51 hafnium oxide