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(Click for frequent words.) 65 eutectic 64 SN#C 64 Sn Pb 64 SAC# 63 solder alloys 63 solder alloy 62 ENIG 62 cordierite 62 NiPdAu 61 resists corrosion 61 solderable 60 solder pastes 60 electroless copper 60 conductive epoxy 60 reflow temperatures 59 hafnium oxide 59 ferritic 59 niobium oxide 59 electroless nickel 59 leaded solder 59 Gallium Arsenide GaAs 59 weldability 59 threshold voltages 59 flux residues 59 solder bumping 59 nanocoatings 59 glass frit 59 GaN wafers 59 nickel chromium 59 transparent electrode 59 ITO indium tin 59 copper metallization 59 carbides 59 solder reflow 59 tin Sn 58 Inconel 58 zirconium oxide 58 lanthanum oxide 58 magnesium alloys 58 multilayer ceramic capacitors 58 conductivities 58 melt viscosity 58 semiconductive 58 W mK 58 ceramic capacitor 58 Tellurium 58 ferritic grades 58 metallisation 58 nanopowders 58 solderability 58 intermetallic 58 PIN diodes 58 Particulate Reactor TM 58 chromium alloy 58 MLCCs 58 HSLA steels 58 wirewound 58 particulate contamination 58 nickel hydroxide 58 thermosets 58 nitrogen NOx emissions 58 piezo actuators 58 transmissivity 57 thermally conductive 57 automotive catalytic converters 57 silicon oxynitride 57 TDFN packages 57 alloying element 57 Silicon carbide 57 SnPb 57 reflow soldering 57 C0G 57 metallic ions 57 austenitic 57 thermowells 57 dielectric layers 57 antireflective coatings 57 austenitic grades 57 indium tin oxide 57 tantalum capacitors 57 microcrystalline 57 bearing sulphides 57 cored wire 57 low k dielectrics 57 austenitic stainless steels 57 conductive adhesives 57 HEMTs 57 platinum Pt 57 1ppm 57 PVD coating 57 nitrided 57 excellent solderability 56 IP# sealing 56 elastic modulus 56 overmolding 56 varistor 56 reflow solder 56 wire bonders 56 nitride semiconductor 56 weatherability 56 thermo mechanical 56 #μ 56 nanometal 56 hydrolytic stability 56 transparent conductive coatings 56 intermetallic compounds 56 solder mask 56 SiC substrates 56 ceramic substrate 56 Powerful debug 56 dimensionally stable 56 k gate dielectrics 56 capacitance values 56 nanotube arrays 56 resistive element 56 wirebonding 56 ZnS 56 vanadium oxide 56 ferrite core 56 ceramic membranes 56 crystallinity 56 ceramic dielectric 56 indium gallium 56 LiNbO3 56 MWCNTs 56 hydrogen embrittlement 56 selenide 56 silicide 56 shot peening 56 CMOS transistors 56 PbS 56 PVC CPVC 56 crossflow 56 reflowed 56 elastomeric seals 56 solder bump 56 indium tin oxide ITO 56 APTIV film 56 martensitic 56 leadframes 56 solder joints 56 telluride 56 compressive stress 56 dielectric materials 56 dual damascene 56 wirewound resistors 56 aluminosilicate 56 carbonate vein 56 airheater 56 extruded profiles 56 aqueous dispersion 56 hydrostatically 56 tin oxide 56 thermal dissipation 56 thermally activated 56 planar magnetics 56 zinc indium 56 solder spheres 56 wave soldering 55 SiO2 55 cadmium selenium 55 Z Foil 55 aramid fibers 55 VICTREX PEEK 55 1μm 55 dielectric strength 55 QFN packages 55 EMI RFI shielding 55 GaAs MESFET 55 electrolytic capacitor 55 Tantalum capacitors 55 IP# NEMA 55 carbon steels 55 X7R dielectric 55 alloying agent 55 epi wafers 55 parasitic capacitances 55 composite laminate 55 Silicon dioxide 55 catalytic oxidation 55 graphitic carbon 55 copper alloys 55 light fastness 55 pleated filter 55 k dielectric 55 coercivity 55 purity cobalt 55 silicon etch 55 bipolar transistors 55 phototransistors 55 BGA packaging 55 galvanic corrosion 55 oxide nanoparticles 55 laterite ores 55 inductive loads 55 amorphous alloy transformers 55 thermal conductivities 55 Lithium ions 55 inconel 55 BGA packages 55 tungsten electrode 55 dunite 55 manganese molybdenum 55 alloying elements 55 wetted parts 55 ferrites 55 indium nitride 55 ownership CoO 55 polishing pads 55 calcium fluoride 55 tensile modulus 55 composite laminates 55 thermal impedance 55 austenitic stainless steel 55 conductive coating 55 polymer capacitors 55 anode materials 55 silicon Si 55 dielectric layer 55 voltage circuit breakers 55 spindle speeds 55 dielectrics 55 activated carbons 55 electrically insulating 55 thermal conduction 55 busbars 55 deep silicon etch 55 stainless steel housings 55 zinc sulphide 55 UL#V 0 55 QFNs 55 tighter tolerances 55 K dielectrics 55 Lanthanum La 55 machinability 55 Si substrate 55 #degC [002] 54 phenolic resins 54 injection molded parts 54 Dektak 54 DSSCs 54 SiO 2 54 chlorite carbonate 54 lithium cobalt oxide 54 cemented carbide 54 ferritic stainless steel 54 H#SO# 54 silicone elastomers 54 thermally stable 54 superalloys 54 tin plating 54 zinc cobalt 54 synchronous MOSFET 54 leakage currents 54 QFN packaging 54 nickel plating 54 MgO 54 arsenide 54 Ionic liquids 54 reed switches 54 acid soluble 54 finely dispersed 54 electro galvanized 54 dielectric constants 54 pyrite marcasite 54 flotation circuits 54 polyacrylonitrile 54 emittance 54 silicon substrates 54 BJTs 54 PEEK OPTIMA 54 Lexan Thermoclear sheet 54 magnetostrictive 54 capacitive loads 54 Schottky diodes 54 Gallium arsenide 54 Silicon Nitride 54 2ppm 54 zinc selenide 54 magnetisation 54 solar reflectance 54 cathodic 54 PIN diode 54 Valox 54 electroless nickel immersion 54 palladium Pd 54 molybdenite MoS2 54 liquid chromatographs 54 chalcopyrite chalcocite 54 Dysprosium Dy 54 aluminized steel 54 AlN layer 54 Polycrystalline 54 environmentally friendly refrigerants 54 electroless nickel plating 54 ZrO 2 54 NdFeB 54 clad laminates 54 passivation layer 54 adsorptive 54 silicon carbide ceramic 54 bandgaps 54 magnetic permeability 54 hardfacing 54 ultrahigh purity 54 sulfide ores 54 flexural strength 54 reflow profiles 54 leach recoveries 54 pearlite 54 molybdenum sulfide 54 electroless 54 reed relays 54 #ppm ° C 54 titanium oxides 54 tensile strain 54 Victrex PEEK 54 ductility 54 copper interconnects 54 tribological 54 W/cm2 54 pre preg 54 #L stainless steel 54 oxide layer 54 MEMS oscillators 54 transparent conductive oxides 54 flame retardance 54 aluminate 54 Czochralski 54 nitrides 54 pH electrodes 54 nickel alloys 54 indium gallium phosphide 54 silica substrate 54 alloyed steel 54 thermoset composites 54 regrind 54 weld slag 54 flame retardancy 54 electro deposition 54 leach circuit 53 opto electrical 53 titanium nitride 53 flotation concentrate 53 zero valent iron 53 5kV 53 manganite 53 gasketing 53 metal halides 53 electrochemical sensor 53 HASL 53 UV stabilized 53 temperature coefficients 53 UV coatings 53 wafer dicing 53 annealing temperature 53 praseodymium 53 quartz oscillators 53 VICTREX PEEK polymer 53 samarium cobalt 53 di selenide CIGS 53 Cu Pb 53 5V CMOS 53 epitaxial substrates 53 bi metallic 53 TCXOs 53 silica SiO2 53 chromium nickel 53 polyphenylsulfone 53 leadless packages 53 polymeric composites 53 heat spreaders 53 MoS2 53 EOSINT M 53 cobalt oxide 53 gelation 53 brazed 53 tensile stress 53 conductive adhesive 53 reflow oven 53 colloidal silica 53 Chalcopyrite 53 Lithium Niobate 53 nanomembranes 53 reagent consumption 53 Beralcast R 53 interfacial tension 53 passivating 53 graphene layers 53 acid leached 53 Terbium Tb 53 antistatic properties 53 hermeticity 53 wafer thickness 53 nano composites 53 corrosion resistance 53 GaAs substrates 53 zinc oxide ZnO 53 X7R 53 Cymbet EnerChip 53 SOFC stacks 53 cerium oxide 53 moldability 53 RO membrane 53 thermoplastic materials 53 aluminum heatsink 53 UVTP 53 GaN transistor 53 FPCs 53 dichromate 53 #.#kV [001] 53 pentoxide 53 quartz crystal oscillator 53 photoresists 53 cermet 53 photomultiplier 53 poly crystalline 53 piezoceramic 53 temperature coefficient 53 lightfastness 53 formability 53 aluminum gallium nitride 53 Gallium Arsenide 53 Stanyl ® 53 NiCad 53 Kynar 53 ballast resistors 53 NiMH cells 53 insert molding 53 zinc Zn 53 motor windings 53 extrudate 53 Terbium 53 electromechanical relays 53 agglomerates 53 vat leaching 53 corrosion resistant alloy 53 aluminum electrolytic capacitors 53 Santoprene TM 53 eutectic solder 53 PEX tubing 53 polysulfone 53 aluminum electrolytic 53 OptoCooler HV# 53 JFET 53 Titanium Dioxide TiO2 53 Ge substrates 53 mount SMT 53 PMOS transistors 53 Hastelloy ® 53 silicone encapsulation 53 IP# enclosure 53 accuracy repeatability 53 electro optic plastics 53 lithium oxide 53 silicone carbide 53 alkaline leaching 53 sapphire substrate 53 rigid foams 53 ohmic 53 frequency harmonics 53 varistors 53 sodium magnesium 53 multicrystalline module 53 silicate glass 53 polybutadiene 53 planar lightwave circuits 53 photoconductive 53 sintered metal 53 tantalum oxide 53 AEC Q# automotive 53 HfO2 53 thermowell 53 copper oxides 53 super alloys 53 PVD coated 53 silicon germanium SiGe BiCMOS 53 Stanyl 53 nickel alloy 53 organic TFTs 53 water vapor permeability 53 flexural modulus 53 6mm thick 53 frictional resistance 53 HDDs SSDs 53 quartz veins containing 53 gate electrode 53 1mm thick 53 Follow Vishay 53 Knelson Concentrator 53 solventborne 53 voltage MOSFETs 53 anodising 53 thermal conductivity 53 ferrite 53 wafer uniformity 52 SnO2 52 barium carbonate 52 phosphide 52 BIOX ® 52 solder paste 52 #x#mm package 52 Ti 4V 52 CMP polishing 52 ionic conductivity 52 threaded fasteners 52 extractables 52 swarf 52 ferrite beads 52 MOS transistors 52 tourmaline veins 52 Thermocouples 52 micropores 52 polymethyl methacrylate PMMA 52 transparent conductive 52 heat spreader 52 manganese oxide 52 wirebond 52 rectifier diodes 52 poly Si 52 chromitite layers 52 milliohm 52 CAPEX OPEX 52 greenschist 52 electroplated 52 NiCd batteries 52 coated pistons 52 photocouplers 52 Animas vein 52 oxide semiconductor 52 gate dielectrics 52 pyrites 52 dopant 52 CMOS fabrication 52 oxidisation 52 halides 52 electrodeposition 52 pigmented coatings 52 oxidation catalyst 52 polyimides 52 sodium metal halide 52 ASTM C# [002] 52 #nm CMOS [002] 52 PWBs 52 FBGs 52 martensitic stainless steel 52 Aerogels 52 #.#uF 52 ionic contamination 52 parasitic capacitance 52 ElectriPlast ¿ 52 dc dc conversion 52 XLPE 52 DrMOS 52 cemented carbides 52 magnetocaloric effect 52 thinner wafers 52 SMA connectors 52 multilayer PCBs 52 anticorrosive 52 piezoelectric ceramic 52 coating thickness 52 sintered 52 thermoset rubber 52 nanoclays 52 electrospray 52 UV lasers 52 thermal conductance 52 Laser diodes 52 formate 52 MLCC capacitors 52 Zytel ® 52 exotherm 52 moisture absorption 52 iron titanium vanadium 52 conventional photolithography 52 NEMA 4X enclosure 52 trioxide 52 PIN photodiode 52 grease lubrication 52 vanadium pentoxide 52 wire bondable 52 MOVs 52 polymer electrolyte 52 calcined kaolin 52 GaN HEMTs 52 voltage divider 52 metal insulator 52 molybdenum disulfide 52 atmospheric leach 52 alkali metals 52 Platinum Pt 52 tensile strengths 52 GaN layers 52 CAN transceivers 52 Vor ink 52 compressive strain 52 CyberDisplay #K 52 Torlon 52 LIBs 52 barium titanate 52 SAW oscillators 52 CS# EDC 52 4mA 52 nitriding 52 overmold 52 barium sulfate 52 electrowinning 52 alloy steels 52 Nd YAG 52 cryogenically cooled 52 manganese dioxide 52 polymer membranes 52 biaxial 52 epitaxial layer 52 Li#CO# 52 polymeric membranes 52 OptoCooler 52 Zener diodes 52 inkjet inks 52 Prepreg 52 nanoparticle inks 52 submerged arc welding 52 chlorite sericite 52 mask aligners 52 #.#um [001] 52 tellurium selenium iridium 52 chemically resistant 52 IC substrates 52 coupling capacitors 52 Epoxy resin 52 reaction kinetics 52 reflow soldering processes 52 rheology modifier 52 backplane connectors 52 vinyl ester resin 52 volumetric efficiency 52 capacitors 52 eutectic alloy 52 Santoprene TPV 52 thermal gradients 52 #ppm Cu 52 UMG silicon 52 zener diodes 52 metallization 52 unoxidized 52 tin alloy 52 electroluminescence EL 52 k dielectrics 52 solder flux 52 battery anodes 52 corrosion resistant coating 52 LDO voltage regulators 52 radial leaded 52 gadolinium Gd 52 wafer bonder 52 matte tin 52 stair nosings 52 MTS# 52 polyaniline 52 flotation tailings 52 aluminum nitride AlN 52 process flowsheet 52 fluoropolymer coatings 52 SLC NAND flash 52 conformal coatings 52 pcb 52 LPCVD 52 Solamet ® 52 thermosetting 52 Indium Tin Oxide 52 chemically inert 52 Tungsten carbide 52 pathfinder element 52 SiC diodes 52 MEMS gyroscope 52 Cyanidation 52 underfill 52 AFM probes 52 NdFeB magnets 52 DFN package 52 nonmagnetic 52 nanopowder 52 ZrO2 52 metallization pastes 52 metallurgical coals 52 heterostructure 52 Formex GK 52 Arcoplate 52 deflashing 52 cathode materials 52 #pF [001] 52 ZnSe 52 #.#μ 52 Titanium oxide 52 JFETs 52 nanocrystalline 52 metalworking fluid 52 sulphide concentrate 52 Schottky 52 friction coefficient 52 CBT resin 52 tantalum nitride 52 Intel Core i7 CPUs 52 QPAC ® 52 clamping voltages 52 overmolded 52 HPGR 52 electromigration 52 ferric oxide 51 nMOS 51 zirconium hafnium 51 Santoprene TPV B# 51 HNBR 51 PolySwitch 51 prepreg materials 51 XFP module 51 transparent conductive oxide 51 liquid electrolytes 51 martensite 51 flowrate 51 UV VIS 51 pyrite concentrates 51 defect densities 51 cadmium chloride 51 antimicrobial additives 51 exotic alloys 51 Galvanized steel 51 mechanical potentiometers 51 spherical roller bearings 51 kaolinite 51 electrolyte membrane 51 sacrificial anodes 51 ultrafiltration membrane 51 adularia 51 5μm 51 chip resistors 51 polymer coatings 51 tantalum pentoxide 51 microvia 51 isotope fractionation 51 SOT# package [001] 51 fuel cells SOFCs 51 detector arrays 51 SO8 package 51 Amorphous silicon 51 tantalum powder 51 thermoplastic elastomer 51 bimetal 51 Germanium Ge 51 flowability 51 silicone sealants 51 Schottky rectifiers 51 CIGS cells 51 titanomagnetite 51 Yampi Member 51 DDR3 DIMMs 51 polytetrafluoroethylene PTFE 51 BeO 51 low capacitance ESD 51 NanoBridge 51 external EEPROM 51 photomultiplier tubes 51 germanium substrates 51 die castings 51 yttrium barium copper 51 weld seams 51 microlens 51 reflow solderable 51 diecasting 51 diaphragm valves 51 zinc sulphides 51 tantalum capacitor 51 ferrite magnets 51 thermoplastic polyurethane TPU 51 corrosion abrasion 51 photomultipliers 51 VCSELs 51 ANSYS FLUENT 51 aqua regia acid digestion 51 copper sulfide 51 Intrinsically safe 51 germanium antimony 51 InSb 51 PA6 51 garnet skarn 51 lithographic techniques 51 nano coating 51 multijunction solar cells 51 antimonide 51 planarization 51 moisture analyzer 51 absolute TCR 51 CMP slurry 51 polymer matrices 51 phototransistor 51 EUV masks 51 conductive pastes 51 thermodynamic properties 51 gallium indium 51 geopolymer 51 carbide insert 51 ferrochromium 51 Therban 51 QMEMS 51 Carbon fiber 51 HPAL 51 AQ# [001] 51 #.#μF 51 electrical resistivity 51 copper ores 51 Kraton G# 51 thermoplastic injection molding 51 CaF2 51 toroids 51 integrated circuits IC 51 insitu 51 sensing resistors 51 hydrometallurgical processing 51 moisture ingress 51 EPDM rubber 51 polyurethane PU 51 mechanical polishing CMP 51 ultrapure 51 pyrochlore 51 #oC [001] 51 polyamides 51 perfluoroelastomer 51 electroforming 51 5mm QFN package 51 maximizes uptime 51 CIS CIGS 51 pn junctions 51 pyrophyllite 51 transceiver modules 51 antimony arsenic 51 di dt 51 superlattice 51 HfSiON 51 feedthroughs 51 conductivity 51 superalloy 51 vinyl esters 51 flexo plates 51 lanthanum La 51 Coriolis meters 51 AWG wires 51 fully dimmable 51 CMP consumables 51 aluminum nitride 51 anatase 51 thermodynamically stable 51 supergene copper 51 #.#mm thick [002] 51 rhodium Rh 51 palladium nanoparticles 51 Cadmium Telluride CdTe 51 engineering thermoplastics 51 cementite 51 amorphous silicon Si 51 PZT 51 RT duroid 51 condenser tubes 51 OCXOs 51 rigid polyurethane foam 51 Ag Pb 51 uranophane 51 vanadium pentoxide V#O# 51 boron nitride 51 pyrite arsenopyrite 51 potassium feldspar 51 fluid viscosity 51 5ppm 51 AlGaAs 51 oxides 51 cm ² 51 SiC Schottky diodes 51 SiON 51 magnetron sputtering 51 PEEK polymer 51 AlN 51 microchannel plate 51 silicification quartz 51 Physical Vapor Deposition 51 Varistors 51 holmium 51 ilmenites 51 gallium indium arsenide 51 turbine inlet 51 conductive inks 51 busbar 51 AEC Q# qualified 51 reflow 51 HDI PCBs 51 T5 lamps 51 multilayer ceramic capacitors MLCC 51 conduction cooling 51 oxide 51 acid chloride 51 Cold Cathode Fluorescent Lamps 51 static dissipative 51 CIGS solar cells 51 gate dielectric 51 planetary gearboxes 51 multicrystalline silicon 51 schistose 51 calorimeters 51 ohmic contacts 51 k gate dielectric 51 finned tubes 51 leach CIL 51 ceramic powders 51 electrolyte membranes 51 inductive sensors 51 polysiloxane 51 Ruthenium 51 ceramic composites 51 #ppb gold 51 stainless steal 51 sulphide ores 51 sulphide flotation 51 flowrates 51 TiN 51 CMOS wafer 51 #ppb [002] 51 emulsion PCR 51 Hastelloy 51 zero valent 51 stabilized zirconia 51 epoxy adhesive 51 microvolts 51 asparagine containing food 51 ductile 51 spinel 51 advanced argillic alteration 51 bend radii 51 Evergreen Solar panels 51 ferro 51 silicon crystals 51 thermoplastic elastomer TPE 51 TetraMAX ATPG 51 capacitances 51 silanes 51 NiCd 51 tungsten alloys 51 GTAW 51 magnesium fluoride 51 8kV 51 copper Cu 51 nanofluids 51 comminution 51 Novelis Fusion TM 51 battery chemistries 51 optical fiber cabling 51 FD SOI 51 injection moldable 51 toolholder 51 crystal oscillator 51 bicomponent 51 RF transistors 51 tungsten trioxide 51 molybdenum sulphide 51 ADMP# 51 Foundation fieldbus 51 elastic deformation 51 reflow ovens 51 IGBT modules 51 tetrahydrofuran THF 50 titanium alloys 50 repeatable measurements 50 Elpida #nm 50 stripline 50 millisecond annealing 50 anodes 50 scheelite 50 fused silica 50 sulphidation gold 50 liquid crystal polymer 50 laser annealing 50 partially oxidized 50 gallium phosphide 50 planar transistors 50 liquid electrolyte 50 electrical conductivity 50 cerium lanthanum 50 sphalerite zinc 50 chromated 50 laminate substrate 50 gallium selenide 50 polycarbonate resin 50 Calcium carbonate 50 Fourier transform infrared FTIR 50 Liquidmetal alloy 50 uniaxial 50 processability 50 polyamide PA 50 tensile strength steel 50 dielectric permittivity 50 GaN LEDs