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(Click for frequent words.) 65 flexo plates 64 photolithographic 63 flexo printing 63 Printhead 62 photopolymer plates 61 inkjet printhead 61 imagesetters 60 Foveon X3 60 Prosetter 60 UV curable ink 60 flexographic 60 LED UV curing 60 heat shrinkable 60 nm CMOS process 60 photopolymer 60 rigid substrate 60 UV inkjet printer 59 imagesetter 59 OP# [003] 59 superwide printers 59 #μm thick [002] 59 crystal resonator 59 KODAK TRENDSETTER 59 Platesetter 59 UV flexo 59 Durst Rho 59 CMOS imager 59 Rastek UV wide 59 telecentric lenses 59 superwide format 59 rotogravure printing 59 flexographic printing 59 UV flatbed printer 59 inkjet printing systems 59 squeegee blades 59 Kodak Flexcel NX 59 BGA packaging 59 thermal CTP 59 #.#um [001] 59 QUANTUM Platesetter 59 HP Scitex FB# [002] 59 transistor arrays 59 Photolithography 58 diecutting 58 #.#um CMOS 58 Mask Aligner 58 Kodak Versamark 58 wirebond 58 thermal platesetters 58 Flexcel NX 58 UV flatbed 58 Platesetters 58 UV curable 58 wafer bonder 58 Rastek ™ UV 58 Laser Marking 58 TRENDSETTER NEWS 58 aqueous coater 58 Thermal Plates 58 Aerosol Jet 58 monolithically integrated 58 brightfield 58 EFI Vutek 58 flatbed printer 58 #μm [002] 58 #.#μm CMOS 58 industrial inkjet printing 58 pin BGA package 58 pin LQFP package 58 ws# 57 #.# micron CMOS 57 inkjet inks 57 TGA# SL 57 Epson DURABrite 57 format inkjet printers 57 extruded profiles 57 halftone proofing 57 EFI Colorproof XF 57 Gennum VXP 57 fusion splice 57 violet laser 57 #nm wavelength [001] 57 Epson UltraChrome K3 57 × #mm [002] 57 UV inkjet printers 57 flexo 57 wafer prober 57 membrane keypads 57 injection moldable 57 wafer dicing 57 forgings castings 57 oxide semiconductor 57 linewidths 57 Peregrine UltraCMOS 57 indium gallium arsenide InGaAs 57 Simitri HD 57 epiwafers 57 flexo printed 57 hardcoat 57 Print Standardizer 57 Cycoloy 57 nano imprint 57 Stereolithography SLA 57 HTPS panels 57 computational lithography 57 digital flexo plates 57 Onset S# 57 silicone elastomers 57 PIN photodiode 57 KODAK MAGNUS 57 poly crystalline 57 NIKKOR lens 56 beamsplitters 56 multichip 56 KODAK FLEXCEL NX 56 Thin Film Transistor 56 DocuSP 56 inkjet printers UV 56 #G DPSK 56 corrugated paperboard 56 ferroelectric liquid crystal 56 Ferromatik 56 optical comparators 56 SMT LEDs 56 CMOS wafer 56 cored wire 56 DiscPainter 56 #.#μm CMOS process 56 hydride vapor phase 56 lithographic 56 Océ CS# Pro 56 LMX# 56 sq m hr 56 ABS M#i 56 Co2 laser 56 SOI CMOS 56 platesetting 56 optical waveguides 56 linerless 56 C0G 56 TQFP packages 56 solder mask 56 eco solvent 56 UV curable inks 56 accuracy repeatability 56 litho printing 56 diffractive optical elements 56 leadless 56 servo driven 56 Simitri 56 7 x 7mm 56 platesetters 56 resistive element 56 TOSA ROSA 56 Suprasetter 56 rollstock 56 Heidelberg Saphira 56 heat sealable 56 EOSINT M 56 Bragg grating 56 SMD LED 56 laser diode module 56 Diamond #LX 56 fused quartz 56 5μm 56 #x# mm [003] 56 Micromorph 56 ownership CoO 56 PIN diode 56 SWIR cameras 56 LTPS TFT 56 membrane switches 56 Fused Deposition Modeling FDM 56 mask aligners 56 Prinergy workflow 56 #x# mm [004] 56 Calibre LFD 56 #um [002] 56 Stahlfolder 56 CF# [003] 56 KODAK STACCATO Screening 56 MB#K# 56 imprint lithography 56 #.#x#.#mm 56 Automatic Pallet Loader 55 4 x 4mm 55 HP SmartStream 55 DuraBrite 55 CTP platesetter 55 antireflection 55 slitter rewinders 55 lithographic plates 55 GelSprinter 55 Phoseon Technology 55 electrophotographic 55 epitaxy HVPE 55 hermetic packaging 55 thermoform 55 VUV 55 CMOS logic 55 edge roughness LER 55 5mm x 5mm 55 coupled inductor 55 polymer jetting 55 PV# [002] 55 thermal platesetter 55 .# micron 55 Inca Onset S# 55 #lpi 55 Micro Piezo 55 8 pin MSOP 55 UV inkjet 55 ArF immersion lithography 55 ASML TWINSCAN 55 optical encoder 55 optically coupled 55 VUTEk GS#r 55 monolithic microwave integrated 55 Anapurna M 55 Ultem 55 pellicle 55 anilox 55 ProFire Excel 55 twin screw extruder 55 CMOS fabrication 55 advanced leadframe 55 Matchprint Virtual Proofing 55 inkjet print 55 HP Designjet T# [002] 55 Follow Vishay 55 solder bumps 55 rigid substrates 55 UV curing 55 iTi 55 MFC #cn 55 EVG# 55 aspheric lens 55 radial leaded 55 EFI Fiery ® 55 microstrip 55 TQFN 55 #bit ADC 55 lithography simulation 55 Thermal Platesetter 55 inkjet proofing 55 rigid PVC 55 pin LQFP 55 mask aligner 55 foil stamping 55 PaxScan 55 flexo plate 55 imageCLASS D# [002] 55 transceiver IC 55 Digital Flexographic System 55 VECTOR Express 55 DI presses 55 LTPS LCD 55 Lumiramic phosphor technology 55 silicon germanium SiGe BiCMOS 55 C#dn 55 RICOH Pro 55 inkjet printing 55 conductive epoxy 55 UV inks 55 DDR NAND 55 temporary wafer bonding 55 NanoBridge 55 servo controller 55 UV coatings 55 Valox 55 KODAK PRINERGY Workflow 55 DirectDrive 55 fxP 55 overmolded 55 saddlestitcher 55 #.#μm [001] 55 epi wafers 55 DuPont Zytel 55 KODAK PRINERGY POWERPACK Workflow 55 OPTEK 55 Arria GX FPGAs 55 absolute rotary encoders 55 SHELLCASE 55 wire bonder 55 ProLINE RoadRunner 55 optical isolators 55 Laser Multifunction 55 Formex GK 55 mount SMT 55 printer applicator 54 QS# [003] 54 KODAK TRILLIAN SP 54 millisecond annealing 54 monochrome printer 54 CY#C#x# 54 KODAK COLORFLOW Software 54 #mm ² [001] 54 gravure printing 54 x 3mm 54 PIN photodiodes 54 triplexer 54 laser printers inkjet printers 54 UMC #.#um 54 presswork 54 QT# [001] 54 SMT placement 54 pH electrodes 54 Epson Claria 54 6mm x 6mm 54 ColorSpan 54 singulated 54 Color imageRUNNER LBP# 54 compression molding 54 laser diode modules 54 Leadless 54 ferrite core 54 FFEI 54 MAX# integrates 54 singlemode 54 inline coating 54 sapphire wafers 54 DirectFET MOSFET 54 AlInGaP 54 PCI Express PHY 54 backside metallization 54 ZMD# 54 UV inkjet printing 54 VersaUV 54 label applicators 54 numerical aperture NA 54 MPR# [003] 54 overmolding 54 DEV DA TOMAR NEXT 54 servo amplifier 54 leadless package 54 pin BGA 54 TruLaser 54 HP Scitex TJ# 54 NeoCircuit 54 Pictiva 54 Truepress Jet# 54 SA# IHZ [002] 54 GammaTag 54 #x# dpi [001] 54 measuring #.#mm x [001] 54 x 9mm 54 vinyl acetate ethylene 54 YAG lasers 54 Autoplate 54 die bonder 54 Heidelberg Speedmaster 54 embedded EEPROM 54 dielectric etch 54 borosilicate 54 linear encoder 54 microfine 54 piezo inkjet 54 Océ ColorWave 54 Fortus #mc 54 Dotrix 54 ultraviolet curable 54 lithographic printing 54 LiNbO3 54 GPIB interface 54 CRIUS 54 #nm #nm [002] 54 Screen Truepress 54 nano patterning 54 S#D# 54 electroformed 54 HP Scitex LX# Printer 54 Esko Kongsberg 54 magnetic encoder 54 Cyrel 54 uPrint Plus 54 PowerPro MG 54 1mm x 1mm 54 sq. mm 54 IBM Infoprint 54 extruded shapes 54 Impinj AEON 54 PBGA package 54 Oce TCS# 54 Santur Corporation 54 #,# sph 54 Signal Conditioner 54 TMS#DM# [002] 54 nm wavelengths 54 wirewound 54 EFI XF 54 submerged arc welding 54 nanoimprinting 54 autoclavable 54 UV Setter 54 PETG 54 MacDermid ColorSpan 54 quickturn 54 lithographic processes 54 QLP 54 indium gallium phosphide InGaP 54 XFP module 54 density interconnect HDI 54 EFI VUTEk 54 Silicon Nitride 54 Jetrion R 54 PrintShop Mail 54 HD Flexo 54 polymerized toner 54 GMG FlexoProof 54 SAW resonator 54 MLCC capacitors 54 VersaUV LEC 54 heat shrinkable tubing 54 ECOSYS 54 OptiCell 54 pin TSSOP 54 DFB lasers 54 flexo presses 54 electrodeposition 54 C#VP 54 digital halftone 54 XMPie ® 54 decorative laminate 54 QFN packages 54 Serial EEPROMs 54 GaN layers 54 WorkCentre Pro 54 Eden# 54 manufactures integrated circuits 54 coupled diode laser 54 RFID inlay 54 TECNIS ® 54 #MF [001] 54 aspherical lens 54 reticle inspection 54 wire bondable 54 SOI MEMS 54 phototransistor 54 4mm thick 54 microfocus X ray 54 Noritsu D# 54 RFCMOS 54 Solamet ® 54 Epson UltraChrome 54 UV Inkjet System 54 #pin [001] 54 thermal inkjet 54 Inlays 54 PlateRite News 54 3Xnm 54 FS #D 54 ZINK Paper 54 MOS transistors 54 SO8 54 FreeFlow Print Server 54 Abrisa Technologies 54 RFID printer encoder 54 pigment inks 54 deflashing 54 Linear Actuators 53 DriveTronic SPC 53 Imprio 53 KODAK FLEXCEL 53 MI #XM 53 wirebonding 53 alumina ceramic 53 CDI Spark 53 Ti# [001] 53 MEMS fabrication 53 patented electron beam 53 polymer composite 53 1μm 53 #nm CMOS [002] 53 monolithic CMOS 53 silicon photonic 53 copper metallization 53 fiber optic transceivers 53 processless 53 XRT#L# 53 e beam lithography 53 Printmaster PM 53 DuPont Teijin Films 53 ZnSe 53 GaAs substrate 53 Procelerant 53 Oce JetStream 53 Epson Stylus Pro GS# 53 Designjet 53 3D LUTs 53 #.#μ 53 color CMYK 53 Rapid prototyping 53 sunlight readable touchscreen 53 4mm x 4mm 53 5mm x 6mm 53 nm CMOS 53 metallurgically bonded 53 Screen PlateRite 53 color laser MFPs 53 tunable DWDM 53 directional couplers 53 x #mm [001] 53 GaN wafers 53 HP LaserJet P# 53 quartz plates 53 Xerox ColorQube 53 QMEMS 53 C1S 53 iSPAN 53 UltraChrome K3 53 RIPit 53 microphone preamplifier 53 photon detection 53 thermo mechanical 53 UV Inkjet 53 Bystronic 53 magnetron sputtering 53 JDF connectivity 53 #x#mm [002] 53 iSSD 53 Vistasolar 53 Epson 3LCD technology 53 RFMD GaN 53 PHEMT 53 L#A [001] 53 opto 53 pre preg 53 Flexcel 53 MB#R# 53 MV# [003] 53 RoHs compliant 53 DocuPrint C# 53 quartz oscillators 53 Polyimide 53 heatset web 53 CMOS circuitry 53 additive masterbatches 53 Ferrite 53 Prinect Inpress Control 53 backplane connector 53 inkjet printable 53 compression molded 53 NexPress Solutions 53 Varistors 53 piezoceramic 53 singulation 53 coating thickness 53 embedded spectrophotometer 53 CMOS silicon 53 Agfa Anapurna 53 CameraLink 53 8bit MCU 53 x 1mm 53 surface mountable 53 Datamate 53 microtubes 53 Multilayer Ceramic 53 TiN 53 cartoner 53 leadframe 53 stainless steel housings 53 MFC #CN [002] 53 Optical Profiler 53 QFN# package 53 sheetfed printing 53 HiPrint 53 Stratasys FDM 53 Epson MicroPiezo 53 Thermal Plate 53 TSMC #.#um 53 7mm x 7mm 53 paperboard tubes 53 Zund 53 SiGe bipolar 53 Mercury5e 53 8mm x 8mm 53 laser diode drivers 53 fusion splicing 53 HRTEM 53 pin QFN packages 53 photodetectors 53 printcom 53 DDR2 DRAM 53 VUTEk ® 53 thermoformer 53 PQFP 53 Canon imageCLASS 53 Applied Baccini 53 Sigma fxP 53 WLCSP 53 inductive sensor 53 laser interferometer 53 optional duplexer 53 electro galvanized 53 thermoplastic materials 53 PVD coating 53 color perfector 53 thermochromic 53 #mm ² [002] 53 Droplet Technology 53 #x# mm QFN 53 Anapurna M2 53 sapphire wafer 53 Dye Sublimation 53 subrack 53 Ultra Wide Angle 53 mm × 53 #m/min [002] 53 colorimeters 53 QFNs 53 micromachined 53 PolyJet Matrix TM 53 flexo gravure 53 TrueStore 53 MF#dn 53 halftone 53 colorimetric 53 outcoupling 53 HepcoMotion 53 STV# 53 saddle stitcher 53 FOGRA 53 #.#mm thick [002] 53 violet platesetters 53 flexography 53 acrylic polymer 53 ArF dry 53 Printing Inks 53 Mbit SRAMs 53 Rapida #a 53 waterless printing 53 GaN HEMT 53 Cree GaN 53 SP #N 53 InnerArmor 53 GF AgieCharmilles 53 AlSiC 53 TGA# SM 53 Silicon Germanium 53 SMIC #.#um 53 aluminum nitride 53 indium phosphide InP 53 Lithrone 53 TDK EPC 53 Xaar Proton 53 ULTEM 53 mono laser printers 53 MICR printer 53 cuvette 53 C#/C# Series 53 Ball Grid Array 53 aspheric 53 scanning electron microscope SEM 53 AlN layer 53 E pHEMT 53 #.#mm ² 53 laser micromachining 53 deinking 53 conductive pastes 53 MacDermid Printing Solutions 53 solventless 53 InkJet Printer 53 #mm# [003] 53 Speedmaster XL 53 polishing pads 53 SpecMetrix 53 aspheric lenses 53 sheetfed offset 53 hotmelt 53 PowerPAK 53 CMOS Image Sensor 53 Rastek 53 Actel FPGA 53 stripline 53 Xerox Phaser #MFP 53 Laminator 53 Inpress Control 53 HV CMOS 52 UV ink 52 Jetrion ® industrial 52 PEEK OPTIMA 52 #.#mm x [003] 52 Sabritec 52 Micrometer 52 VUTEk R 52 XT #i 52 Texas Instruments OMAP# 52 FS #DN 52 multilayer PCBs 52 Indium Phosphide InP 52 Flex OneNAND 52 Synopsys DFM 52 Digimaster 52 TestKompress 52 DIN rail mounting 52 Bipolar CMOS DMOS BCD 52 Si TFT 52 Eco Solvent 52 aluminum housings 52 #nm laser [002] 52 polymer extrusion 52 PIN diodes 52 Zip Pak 52 BOBST 52 superwide digital inkjet printers 52 EFI MicroPress 52 laminate substrate 52 Southern Lithoplate 52 micromirror 52 Stitchmaster ST 52 aluminized steel 52 SOT# [002] 52 pin SOIC package 52 Cyrel R 52 Xerox iGen 52 passivating 52 UV curing flatbed 52 1Gbit DDR2 52 AMCC QT# 52 darkfield 52 film transistor TFT 52 Canon ScanFront 52 LQFP# package 52 DocuPrint 52 extrusion coating 52 TSSOP 52 MTS# 52 CryptoRF 52 electron beam welding 52 Dual Frequency 52 Thin Film Transistors 52 Rastek H# 52 polycarbonate resin 52 litho 52 saddle stitching 52 stepper motor 52 HP Designjet printers 52 #nm laser [001] 52 quantum cascade 52 HP Scitex LX# 52 Heidelberg Speedmaster CD 52 X7R 52 piezo motor 52 prepress workflow 52 optoelectronic packaging 52 Gb DDR3 52 2μm 52 millisecond anneal 52 PolyJet 52 Thinlam 52 folder gluer 52 Tonejet 52 Lexmark E#dn 52 capacitive touch sensor 52 MF#Cdn 52 Atlantic Zeiser 52 8 pin SOIC 52 sheetfed web 52 Dektak 52 ARRISCAN 52 CLP #ND 52 ECOPACK 52 HORIBA Jobin Yvon 52 flatbed UV 52 Prinergy 52 #mm x #mm [005] 52 FARO Gage 52 CMP consumables 52 Thermex 52 microbolometer 52 polytetrafluoroethylene PTFE 52 optimized dpi 52 mosaicking 52 USB PHY 52 ADMP# 52 Polymerized Toner 52 sintered metal 52 VersaCAMM VS 52 Kodak Nexpress 52 sub micron 52 pin MLF 52 compatible inkjet cartridges 52 silicone foam 52 Thermal Printer 52 DPSS laser 52 density fiberboard 52 magnetic encoders 52 metallisation 52 metalized 52 vinyl ester resins 52 NIST traceable 52 stencil printer 52 Land Grid Array 52 borderless printing 52 Aficio SP #N 52 Tessera Licenses 52 DocuColor #AP 52 AEC Q# qualified 52 LED printheads 52 Complementary Metal Oxide Semiconductor 52 Masterpiece Graphix 52 ferroelectric RAM 52 FLEXCEL NX System 52 parametric testers 52 microvia 52 copying scanning 52 Xerox FreeFlow ™ 52 SOI wafer 52 voltage CMOS 52 micro optics 52 dye sublimation printer 52 Parylene 52 Capillary Electrophoresis 52 C#N 52 Virtex 5 52 Lexmark X#e 52 gravure 52 electroless nickel 52 polyvinyl butyral 52 RTL Compiler 52 M#A [002] 52 3D lenticular 52 Silicon Oxide Nitride 52 LSA#A 52 copier printers 52 GRACoL 52 X ray microanalysis 52 Altera FPGAs 52 AMLCD 52 mono crystalline 52 metallic inks 52 photoconductor 52 Xenoy 52 chipscale 52 spherical lenses 52 sheetfed offset presses 52 FS C#DN 52 iPF# [002] 52 EMIF# 52 gasketing 52 APTIV film 52 #x# dpi [002] 52 sapphire substrate 52 deep ultraviolet DUV 52 D2PAK 52 Heidelberg Prinect 52 dye sublimation 52 TSP# 52 Intel LGA# [001] 52 thermoset composite 52 EFI Monarch 52 Signal Controllers DSCs 52 Encapsys 52 embedded SerDes 52 MBd 52 sheetfed presses 52 shaftless 52 multilayer ceramic 52 JENOPTIK GmbH 52 DDR2 memory controller 52 DAC# 52 6mm x 52 weldments 52 Océ VarioPrint 52 Komori Lithrone 52 spherical roller bearings 52 laser scribing 52 chip resistor 52 CMOS IC 52 iP#v 52 Production Color Presses 52 bond aligner 52 PressVu UV 52 RGB LED 52 COLORFLOW Software 52 precision machined components 52 circuit MMIC 52 Workflow Collection 52 Wide Format Printer 52 BIOIDENT 52 BelaSigna 52 Fujifilm Sericol 52 thermoformable 52 GX# [003] 52 thermoplastic biocomposite compounds 52 laser MFP 52 mux demux 52 RF Microwave 52 package SiP 52 μm diameter 52 coated paperboard 52 mm ² 52 bizhub PRESS 52 conductive adhesive 52 thermoplastic compounds 52 blowmolding 52 Si substrate 52 MPEG decoder 52 nanostructured silicon 52 photoelectric sensors 52 MICR printing 52 NanoScope 52 laser sintered 52 #mm x #mm [007] 52 transimpedance amplifier 52 leadless packages 52 detector arrays 52 extruded sheet 52 PROSPER S# Imprinting System 52 x 6mm 52 flux cored wires 52 faster makeready 52 susceptor 52 Print Engine 52 photomasks 52 UV Curing 52 crosspoint switch 52 laminations 52 parasitic extraction 52 laser toner 52 #/#-inch thick [001] 52 serializer deserializer 52 Membrana 52 ACPL K# 52 high voltage BCDMOS 52 AdvancedMC module 52 Wide Format 52 SpectroProofer 52 Mbit MRAM 52 Gbps transceiver 52 platesetter 52 pin 4mm x 52 flex circuits 52 #.#mm x #.#mm [001] 52 copier printer 52 offset printing presses 52 InSb 52 pin SOIC 52 AQ# [001] 52 BGA packages 52 KODAK SQUARESPOT Imaging 52 Elpida #nm 52 Selective Laser Sintering SLS 52 wafer thickness 52 HP Scitex FB# Printer [001] 52 metallised 52 Laser Sintering 52 TECHSPEC 52 interposer 52 Encounter Timing System 52 HMC#LP#E 52 voltage MOSFET 52 STN LCD 52 Frame Sequential 52 Vertical Cavity Surface Emitting 52 Process Plates 51 EFI Fiery XF 51 PBGA 51 #x#mm QFN package 51 photoresist 51 Prepress Solutions 51 UHB LEDs 51 PTFE membrane 51 nonpolar GaN 51 planarization 51 DYMAX 51 LightABLE ™ 51 Kyocera ECOSYS 51 ballscrew 51 aluminum electrolytic capacitors 51 UV LED 51 HID proximity 51 film transistors TFTs 51 Vor ink 51 IR#S 51 Fiber Bragg Grating 51 liquid crystal polymer 51 #.#um CMOS process 51 imagePROGRAF iPF#S 51 Océ ColorStream # 51 iCoupler 51 #nm SRAM 51 Color Polymerized Toner 51 laser sintering systems 51 2Xnm 51 Aera2 51 #HS [002] 51 RFIC simulation 51 Northbridge chipset 51 embedded passives 51 Flip Chip 51 Esatto Technology 51 VarioPrint 51 IntraLase FS 51 Priport DX 51 TAS# [001] 51 polyurethane spray 51 Datacard ® 51 pseudo SRAM