megapascals

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(Click for frequent words.) 71 gigapascals 69 MPa 67 #MPa 67 kPa 65 mbar 65 GPa 64 tensile strengths 64 #bar [002] 63 psia 63 kilopascals 63 W/cm2 63 PSIG 63 cm ² 62 ohm cm 62 #bar [001] 62 #.#nm [002] 61 elastic modulus 61 torr 61 W mK 61 g cm 61 μW 61 mm ² 60 annealing temperature 60 volumetric efficiency 60 μS cm 60 #psi [001] 60 flexural 60 Nm3 h 60 #psi [003] 60 cm -2 60 tensile modulus 60 m3/hr 59 ml min 59 Tensile strength 59 ms -1 59 μm thick 59 Mpa 59 picometers 59 psig 59 compressive stress 59 microvolts 59 m³ h 59 milliohm 59 tensile stress 59 #oC [001] 59 μm diameter 59 cm ³ 59  m 59 +# º C [002] 58 cm -3 58 ˚ C. 58 dielectric strength 58 Å -1 58 millivolts 58 kg/m3 58 #psi [002] 58 kg hr 58 interfacial tension 57 #.#in [004] 57 flexural strength 57 ksi 57 5μm 57 mK 57 absorption coefficient 57 #cm [001] 57 57 newtons 57 #degC [002] 57 ⁰ C 57 keV 57 inch psi 57 oxide thickness 57 volts mil 57 mm Hg diastolic 57 ultimate tensile strength 57 conductivities 57 degC 57 psi 57 piezo actuators 57 bending rigidity 57 #.#-#.# [011] 57 dielectric constants 57 W/m2 57 MeV 56 aramid fibers 56 scfm 56 1μm 56 areal densities 56 mu m 56 cm3 56 degF 56 -# ° [002] 56 #μm [002] 56 micrometre 56 wafer thickness 56 cm ^ sup 56 bending stiffness 56 diameter rotors 56 ZrO 2 56 #ohm [002] 56 -# ° C [001] 56 millimeter diameter 56 #um [002] 56 microampere 56 diamond anvil 56 ° C. 56 hectopascals 56 ° C/# ° F [001] 56 degreesC 56 hafnium oxide 56 micron pixels 55 transmissivity 55 thermally stable 55 2ppm 55 Young modulus 55 cryogenically cooled 55 lbf 55 microlitres 55 #.#kV [001] 55 nm excitation 55 2dB 55 WxDxH 55 micron diameter 55 mW/cm2 55 AlGaAs 55 #oF [001] 55 55 55 femtogram 55 spherical roller bearings 55 8mm diameter 55 isotherm 55 chipscale 55 kT 55 MIL HDBK #F 55 modulus 55 proton conductivity 55 55 mT 55 gauss 55 threshold voltages 55 º Fahrenheit 55 ° C 55 #m# h 55 cm2 55 wetted parts 55 thermal conductivities 55 nanoliters 55 isostatic 55 megohms 55 friction coefficient 55 mOhm 55 acid leaching HPAL 55 swing adsorption 55 boron trifluoride 55 #.#μm [001] 55 Ncm 55 #.# mb 55 axial loading 55 dB insertion loss 55 ° -# ° [001] 55 ppm boron 55 #kN [002] 54 hydrostatically 54 SiO 2 54 corrugation 54 #kN [001] 54 1kV 54 molybdenum disulfide 54 diameters ranging 54 flowrate 54 m/s2 54 Â ° C. 54 ± #ppm [001] 54 austenitic stainless steel 54 inductance values 54 g/m2 54 microns 54 resists corrosion 54 equivalently sized 54 kWe 54 compressive strength 54 +# oC 54 welded tubes 54 Gigaflops 54 microwatt 54 tantalum pentoxide 54 kGy 54 μl 54 nanowatts 54 interparticle 54 lamella 54 C0G 54 ultrahigh purity 54 Inconel 54 μm 54 dimensional tolerances 54 hydrolytic stability 54 Â ± 54 ppm deg 54 microliters 54 nanotube arrays 54 uniaxial 54 #mm ² [001] 54 Deg C 54 1mm thick 54 mm Hg systolic 54 stainless steel housings 54 capacitances 54 austenitic stainless steels 54 3nm 54 D2PAK 54 ° C ambient temperature 54 photon energies 54 ° sec 54 mV V 54 #.#uF 54 multicrystalline cells 54 backplane connectors 53 1ppm 53 m3 h 53 + #.#mm 53 degreesF 53 Fig. 3b 53 diametre 53 #mm #in 53 sq. mm 53 ps nm 53 nanoliter 53 Wh kg 53 Gbps transceiver 53 mm diameters 53 thermal gradients 53 SCFM 53 output voltages ranging 53 sq cm 53 TDFN packages 53 Vrms 53 compressive strengths 53 sq. cm 53 Pascals 53 ferrite core 53 #um [001] 53 Intraocular pressure 53 lb hr 53 8kV 53 melt viscosity 53 tensile stresses 53 #x#x#mm [001] 53 x #.#cm [001] 53 frictional resistance 53 micrometer 53 droplet sizes 53 micrometers thick 53 dielectric constant 53 C/# [003] 53 #.#mm diameter [001] 53 nanomesh 53 numerical apertures 53 tph 53 accuracy repeatability 53 GaN wafers 53 compressive load 53 5kV 53 μg mL 53 graphitic carbon 53 magnetostrictive 53 angstroms 53 cordierite 53 mAh g 53 #μm [001] 53 GeV 53 niobium titanium 53 rpm spindle 53 corrosion abrasion 53 ppmv 53 nH 53 nanomolar 53 shear modulus 53 Global Warming Potential GWP 53 #mV V 53 micrometres 53 2kV 53 sub Angstrom 53 nT 53 ft sec 53 wafer uniformity 53 hPa 53 yr -1 53 photomultiplier tube 53 ASTM A# 53 ferritic 53 purities 53 microlitre 53 #F #C [001] 53 thermal insulator 53 kg payload 53 superheater 53 osmotic pressure 53 wph 53 GFlops 53 moisture absorption 53 cm -1 53 Fig.2 52 desorption 52 welded seams 52 kilotonne 52 dB SPL 52 liquid chromatography HPLC 52 x 2mm 52 χ 52 capacitance values 52 kt yr 52 kelvin 52 Coriolis meters 52 kcal mol 52 #mΩ [001] 52 in. dia 52 neutron flux 52 extrudate 52 deg F 52 μH 52 poly L lysine 52 chromium alloy 52 t/m3 52 oC 52 μF 52 nanometric 52 coercivity 52 ductility 52 micrometres thick 52 outer diameters 52 diameters 52 electron bunches 52 lanthanum oxide 52 weldability 52 input impedance 52 crystalline Si 52 tensile strength 52 nanometers nm 52 wafer diameters 52 diamond anvils 52 Stanyl 52 YAG lasers 52 meV 52 ± #.#mm [001] 52 +# degC [001] 52 velocity dispersion 52 #Ω [002] 52 picogram 52 CMOS wafers 52 μmol 52 spindle speeds 52 #ppm Cu 52 thermal EMF 52 #.#um [001] 52 flowrates 52 electronvolts 52 mono crystalline silicon 52 voltage divider 52 m z 52 psi flowing 52 magnetically coupled 52 resonance frequency 52 viscosities 52 oxide thickness EOT 52 shaft diameters 52 #mm# [002] 52 +# degC [002] 52 #ppb gold 52 zirconium oxide 52 photocurrent 52 #.#m# [001] 52 millidarcies 52 viscosity liquids 52 reflow temperatures 52 #-#,# mm 52 electron volt 52 thermo mechanical 52 -# ° C. [002] 52 #.#mm thickness [001] 52 forged crankshaft 52 ohmic 52 magnesium ion 52 l h 52 Thermal conductivity 52 Mg Fe 52 InAs 52 chromatographic separations 52 electrical resistivity 52 #.#Ω 52 nMOS 52 x 7mm 52 #C #F [003] 52 ± #.#dB 52 freezeproof 52 5nm 52 Amperes 52 microamp 52 Fig. 2b 52 input capacitance 52 friction coefficients 52 nm wavelengths 52 cryogenic temperatures 52 flexural modulus 52 √ Hz 52 boron carbide 52 mEq 52 APTIV film 52 +# deg C [001] 52 THD + N 52 micron thick 52 mm dia 52 Si#DP 52 tensile strain 52 oscillation frequency 52 ppm U 51 Min temp 51 #pF [001] 51 electrically insulating 51 Bq/m3 51 nanometers billionths 51 kN 51 nm VCSEL 51 -# º F [002] 51 x 4mm 51 MnO 51 elastic deformation 51 g cc 51 Halifax Weather Overcast 51 6kW 51 #mA [003] 51 intensifier pumps 51 2nm 51 compressive strain 51 x 6mm 51 -# degrees Celsius [001] 51 turbo compressor 51 #mm# [003] 51 molar ratio 51 mm2 51 pulmonary arterial 51 enthalpy 51 ppm ° C 51 ° C. Brush 51 irradiance 51 thermally activated 51 martensitic 51 Si substrate 51 teraelectronvolts TeV 51 INR #,#-#,# mt 51 thermal conductivity 51 pCi l 51 toroid 51 polybutadiene 51 5mm x 6mm 51 DFN package 51 #.#m# [002] 51 #degreesC 51 varistor 51 powerpack 51 ppbv 51 º C. 51 4U chassis 51 ε 51 temperature coefficients 51 MWNT 51 HNBR 51 millimeter mm 51 emittance 51 CaCO3 51 linewidths 51 #V MOSFETs [002] 51 Vdd 51 #W halogen 51 kinematic viscosity 51 microwatts 51 pipe diameters 51 millimeters mm 51 sinters 51 #mm# [001] 51 ammonia borane 51 MSOP packages 51 -# degrees Fahrenheit [002] 51 micro sieverts 51 nm wavelength 51 CdSe 51 isoelectric point 51 Vdc input 51 LiNbO3 51 clamping voltages 51 #.#mL 51 fig. S2 51 scf t 51 mg/m3 51 ˚ F 51 #x#mm [005] 51 #.#kW [002] 51 #m# [005] 51 nitrided 51 DFN packages 51 #.#:# compression ratio [002] 51 electron volts 51 PEEK OPTIMA 51 anneal 51 fA 51 coating thickness 51 mW MHz 51 hydraulic conductivity 51 transmittance 51 ug mL 51 TFlops 51 kVp 51 Î ¼ 51 dielectric layer 51 Bq l 51 #Â º C 51 4mA 51 reduces NOx emissions 51 stabilized zirconia 51 cam lobe 51 mmHg systolic 51 vibrational modes 51 #mm x 51 carbon nanotube fibers 51 micrometre sized 51 magnetic permeability 51 pneumatic actuators 51 ° C ambient 51 mA output 51 alloyed steel 51 moldability 51 #mmHg [001] 51 compressibility 51 breakdown voltages 51 2 MeV electron 51 º C 51 º Celsius 51 revs min 51 #Vdc [003] 51 ZnSe 51 mating cycles 51 piezo resistive 51 μg g 51 AST# 51 ° F -# ° 50 durometer 50 nitride semiconductor 50 ohms 50 μg ml 50 laser resonator 50 Ti 4V 50 1nm 50 friability 50 kilovolt amperes 50 aluminum honeycomb 50 gasketing 50 Nd YAG 50 epitaxial layer 50 fluorescence intensity 50 MWCNTs 50 picoliter 50 #.#t [003] 50 Particulate emissions 50 ° Celsius 50 hermeticity 50 thermowells 50 dBFS 50 yaw angle 50 UV absorbance 50 polyether 50 millibar 50 high temperature HPHT 50 Min Temp #.# 50 HEMTs 50 hydrophobicity 50 yttrium oxide 50  C 50 elastomeric seals 50 homopolymer 50 electron density 50 mol L 50 rotor stator 50 PQFN 50 ± #V [001] 50 μm wavelength 50 carbon steels 50 planetary gearboxes 50 mU liter 50 degrees celcius 50 ˚ C 50 #μF [002] 50 airflows 50 photoemission 50 -# º C [002] 50 bending radius 50 FWHM 50 mN 50 nmol 50 cuvettes 50 arcsecond 50 micrometer scale 50 degrees above preindustrial 50 NPSH 50 #Vrms 50 arcmin 50 V dc 50 BTU hr 50 gph 50 SO8 50 thermal equilibrium 50 emulsion droplets 50 FeO 50 #ppb Au [002] 50 nanosecond pulse 50 dimensionally stable 50 #VDC [002] 50 × #mm [002] 50 crystal lattices 50 angular displacement 50 micromolar 50 #.#-#.# [005] 50 rotational torque 50 3mm x 50 absorber layers 50 corrosion resistance 50 VICTREX PEEK polymer 50 x 5mm 50 GaAs MESFET 50 gate electrode 50 #rpm [001] 50 #deg C 50 .3 microns 50 boron nitride nanotubes 50 ^ sup -1 50 mJ 50 sealability 50 4kW 50 vinyl ester resin 50 cP 50 concentration Cmax 50 ft. lbs 50 +# deg C [002] 50 moisture vapor 50 aqueous dispersion 50 MAOP 50 Dektak 50 x #.#mm [005] 50 EMIF# 50 m ^ sup 50 PVDF 50 mm diameter 50 LPCVD 50 TCXOs 50 flowability 50 nM 50 mH 50 ceramic capacitor 50 #.#mohm 50 polysulfone 50 ppm eU 50 #.#mm diameter [002] 50 pin SOIC packages 50 fluid viscosity 50 mmol 50 x 3mm 50 -1 ^ 50 oscillator frequency 50 rotary vane 50 sealless 50 #.#Hz 50 LVDTs 50 pMOS 50 #ppm [002] 50 mg/Nm3 50 cryostat 50 microbolometers 50 byte FIFO 50 50 propellant tanks 50 thicknesses ranging 50 creepage 50 lateral stiffness 50 particle sizes 50 photomultiplier tubes 50 torque outputs 50 #/#-in [001] 50 Viton ® 50 retained austenite 50 bending radii 50 kBq 50 leakage currents 50 PBGA package 50 ppm ° C. 50 cm H2O 50 SOT# [002] 50 maraging steel 50 piezo actuator 50 thermal conduction 50 Nova NanoSEM 50 #x# ^ 50 backpressure 50 melt processable 50 voltage coefficient 50 kHz frequency 50 upflow 50 bend radii 50 capacitive loading 50 Pressurex 50 ballscrews 50 microlens 50 MBd 50 Vpp 50 NTC thermistor 50 ug ml 50 mm3 50 Shipment volumes 50 ° F/# ° C [001] 50 SiO2 50 #.#mm x #.#mm x [002] 49 tensile 49 linear axes 49 #.#mm x [005] 49 micropores 49 subnanometer 49 martensite 49 piezoelectric ceramic 49 axial loads 49 dBm output 49 x 2in 49 electrical conductivity 49 selectivities 49 Aluminum Oxide 49 RDS ON 49 osteoconductive 49 0 dBm 49 nitric oxides 49 hydrolysis resistance 49 temprature 49 sqft hr 49 oscillation amplitude 49 #GS s 49 screw compressors 49 Shutter speeds 49 millivolt 49 uL 49 cylinder bores 49 Rdson 49 lattice mismatch 49 superheated steam 49 microfarads 49 cobalt chromium alloy 49 ZXLD# 49 +# degrees Celsius [001] 49 #mm Hg 49 +# deg [002] 49 silicon nanowire 49 AQ# [001] 49 cm sec 49 #m/min [002] 49 Voltages 49 piezoelectric actuators 49 non dispersive infrared 49 frictional heating 49 TiO 2 49 pore sizes 49 Gbits sec 49 Bragg grating 49 fig. S1 49 Fig. 4B 49 adsorption isotherms 49 ft3 49 WVTR 49 ohm impedance 49 bandgap 49 Fig. 4b 49 regulated output voltages 49 QFNs 49 SO8 package 49 4 x 4mm 49 2μm 49 XPH #TU 49 absorbance 49 biaxial 49 thermal dissipation 49 overpressure 49 shear mixers 49 kelvins 49 mesoporous 49 Fig. 2a 49 sulfur dioxide SO 49 UV stabilized 49 exotherm 49 micrograms mL 49 #x#x# mm [003] 49 arcsec 49 1MHz switching frequency 49 oxidise 49 polystyrene spheres 49 pmol 49 vanadium oxide 49 #mm diameter [002] 49 μsec 49 5mm QFN package 49 XLPE 49 gravitational acceleration 49 #.#mm [002] 49 piconewtons 49 ° С 49 CO2emissions 49 camshaft profiles 49 oxidiser 49 5mm x 5mm 49 crystallinity 49 friction COF 49 #:#.#-#.# 49 ammonium ions 49 x #.#in [002] 49 microns millionths 49 inductances 49 phototransistors 49 thermoelectric cooling 49 kg -1 49 serum homocysteine 49 liquefied gases 49 supercritical steam 49 GaN HEMTs 49 kA 49 PA6 49 temperature coefficient 49 ± #ppm [002] 49 5mA 49 radioactivity intersected 49 compression molded 49 numerical aperture NA 49 thermal coefficient 49 Gcal h 49 nanometers thick 49 gradeability 49 emission wavelength 49 #.#VI O 49 tighter tolerances 49 sodium magnesium 49 #.#-# [029] 49 wheel spacers 49 x 9mm 49 bilayers 49 hydroxyphenyl 49 reaction kinetics 49 μm particle 49 g t Ta 49 frequency transducers 49 -#.# ± [001] 49 Nitrogen oxide emissions 49 sorption 49 V ac 49 g/m3 49 piston pumps 49 #cm x 49 Available Seat Kilometres ASKs 49 Hastelloy C 49 Nm3 49 -# degrees Centigrade 49 joules 49 megajoules 49 1kHz 49 reinforced thermoplastic 49 degree celcius 49 kgf 49 AlGaN 49 offgas 49 milliampere 49 Fine Crossbred Indicator 49 #mm x #.#mm [003] 49 #.#mm x [004] 49 #Wp 49 IP# sealing 49 thermally optimized 49 desorbed 49 torsional stiffness 49 cored wire 49 CaCO 3 49 ˚ F. 49 thicknesses 49 SAC alloys 49 BGA packaging 49 g l 49 nanometer wavelength 49 Sensilica 49 rheometer 49 #MSPS 49 brazed 49 capillary tube 49 swing adsorption PSA 49 optically transparent 49 woven fiberglass 49 Ubaque reservoir 49 thermal impedance 49 permeabilities 49 nanoporous 49 picoliter droplets 49 chemical inertness 49 piezoresistive 49 caustic soda sodium hydroxide 49 emissions combustor 49 Liquid helium 49 derate 49 ambient temperature 49 solar reflectance 49 #Â ° C 49 pulse durations 49 monocrystalline cells 49 chemically resistant 49 49 nanosize 49 #.#VDC 49 conductance 49 bezel width 49 respired 49 CF Y5 49 rev min 49 voltage MOSFETs 49 LQFP 49 wetted surface 49 excitonic 49 stoichiometric 49 NMOS 49 reflow profiles 49 cm diameter 49 Rotliegend sandstone 49 Victrex PEEK 49 kilovolts kV 49 3mm x 3mm x 49 3 mm DFN 49 Fig. 2A 49 #Â º [001] 49 picolitre 49 #.#m #.#m [004] 49 1m 3ft 49 mrad 49 aberration correctors 48 stretchability 48 -# ° F [001] 48 neodymium oxide 48 #.#mm x [003] 48 polyurethane coating 48 X ray diffraction pattern 48 -# ˚ C 48 +# ° F. 48 viscoelastic properties 48 #.#mm thick [002] 48 corona discharge 48 fused silica 48 pearlite 48 UV wavelengths 48 6GHz 48 inspiratory 48 serum LDL cholesterol 48 Mainline RPMs 48 Porosity 48 sintered 48 x #mm [001] 48 r2 = 48 kg m² 48 ballscrew 48 #.#Tbps [002] 48 tractive force 48 Btuh 48 kV HBM 48 #.#mm x #.#mm [004] 48 #ppb [003] 48 #μm thick [002] 48 rotary potentiometer 48 #.#μ 48 PLLA 48 min -1 48 fluence 48 magnetic stirrer 48 superheat 48 #ppm Mo 48 petawatt 48 pyrolytic 48 crystalline silicon modules 48 wirewound resistors 48 UHMW 48 mm DFN package 48 CMOS transistors 48 IP# enclosure 48 -# Celsius [001] 48 transconductance 48 interstitial fluid 48 picocurie 48 hexagonal lattice 48 sieverts 48 dielectric permittivity 48 CaO 48 epoxides 48 deformability 48 4dB

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