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(Click for frequent words.) 60 um CMOS 60 .# micron 59 Gbps transceivers 58 micron pixel 57 Gbps transceiver 56 m 55 megapixel CMOS sensors 55 magnetic encoder 55 x 6mm 55 micron pixels 55 nm CMOS process 55 Imprio 55 MHz contactless 54 numerical aperture NA 54 mm BGA 53 #V MOSFETs [002] 53 Mpixel 53 #.#μm CMOS 53 #μm thick [002] 53 #.#um CMOS 53 HD PXL 53 x #.#mm [005] 53 nm wavelengths 53 sq. mm 52 micron 52 microwatt 52 #nm SRAM 52 inch SVGA 52 LQFP# package 52 Mbit MRAM 52 nm CMOS 52 #.#μm [001] 52 QFN packaging 52 mm2 52 x #.#mm [001] 52 mm ² 51 #x#x#.#mm [003] 51 pin BGA package 51 nanometer nm CMOS 51 pixel CCD 51 fin div 51 x 9mm 51 mW MHz 51 Gigahertz GHz 51 #.#μ 51 #.#μm CMOS process 51 SOT# package [001] 51 W mK 51 #.# micron CMOS 51 Elpida #nm 51 QCIF + 51 ATtiny# 51 WiLink 51 wph 51 nanometer CMOS 51 millimeter mm 50 QXGA 50 fiber optic transceivers 50 picometers 50 QVGA TFT LCD 50 nonpolar GaN 50 nm lithography 50 #nm wavelengths 50 megapixel webcam Bluetooth 50 meter panchromatic 50 #x#mm package 50 bezel width 50 crystal resonator 50 #/#.#in 50 inch HWD 50 EuroDOCSIS 50 nanometer lithography 50 WiPort 50 Gbits s 50 silicon germanium SiGe BiCMOS 50 oxide thickness 50 mW/cm2 50 rotary potentiometer 50 6mm x 50 #mm x #.#mm [003] 50 DMIPS MHz 49 numerical apertures 49 #mm silicon wafer 49 ° sec 49 dielectric etch 49 8bit MCU 49 megapixel CMOS 49 1μm 49 #bit ADC 49 5V CMOS 49 #mm# [003] 49 5μm 49 x #.#mm package 49 ferroelectric RAM 49 cellular baseband processor 49 #nm FPGAs 49 photoelectric conversion 49 Mbit s Ethernet 49 areal densities 49 mega pixel sensor 49 #nm SoC 49 sapphire wafer 49 7mm x 49 XA Spartan 3A 49 Kbits 49 Zoom NIKKOR lens 49 #.#u 49 nm VCSEL 49 Mpixels 49 #mm ² [001] 49 #nm DRAM 49 #x# mm [004] 49 #nm immersion lithography 49 Gb DDR3 49 TSMC Reference Flow 49 megapixel CCD sensor 49 DMC LZ7 49 MHz PJM 48 CMOS fabrication 48 wireless LAN chipset 48 #.#μm [002] 48 LTPS LCD 48 Schottky rectifiers 48 Megabit Mb 48 kbit 48 Megapixel sensor 48 rpm spindle 48 chip inductors 48 millimeter silicon wafers 48 #.#mm x [001] 48 #.#mm x #mm [002] 48 Megapixel CCD 48 nm immersion 48 embedded SerDes 48 cm diagonal 48 CMOS logic 48 piezo motor 48 kHz frequency 48 Megapixel resolution 48 Silego 48 mega pixel CCD 48 #.#x#.#mm 48 capacitance values 48 XRT#L# 48 x 5mm 48 linear encoder 48 TDFN packages 48 axis accelerometers 48 serdes 48 photon detection 48 Gigahertz 48 MegaPixel 48 selective emitter 48 multichip 48 chipscale 48 measuring #.#mm x [001] 48 #mm# [001] 48 #/#.#-inch CCD [001] 48 dB insertion loss 48 MAX# integrates 48 mm QFN packages 48 silicon germanium SiGe 48 #.# micron node 47 meV 47 8Gbit 47 megapixel sensors 47 #.#mx [001] 47 nanometer silicon 47 6mm x 6mm 47 #.#nm [002] 47 DDR2 DRAM 47 nm MirrorBit 47 SOT# [002] 47 text indent 47 #.#mm# [001] 47 kS s 47 x #dpi [002] 47 SiC substrates 47 QVGA LCD 47 Mbps HSPA 47 pin SSOP package 47 megapixel digicam 47 leadless package 47 embedded EEPROM 47 Stratix II GX 47 Gigabit DDR2 SDRAM 47 μW 47 #K pixel 47 6x optical zoom 47 CCD imagers 47 #.#mm thickness [001] 47 MSRPs ranging 47 #.#mx #.#m [002] 47 x 3mm 47 5mm x 5mm 47 nm nodes 47 megabit Mb 47 BGA packaging 47 inch #x# pixel 47 #x#x# mm [003] 47 k gate dielectrics 47 #.#um [002] 47 Gbits sec 47 nanometer NAND 47 silicon photonic 47 pin SOIC package 47 x #.#cm [001] 47 cm ² 47 Gbs 47 linewidths 47 nanometer node 47 nines reliability 47 nm immersion lithography 47 3nm 47 nm geometries 47 nH 47 Mega pixels 47 MEMS gyros 47 #.#mm x [003] 47 CCD camcorder 47 TCXO 47 PQFN package 47 gigabit DDR3 SDRAM 47 RF transistors 47 megapixel #/#.#-inch 47 foot lamberts 47 pin TQFP package 47 #.#um [001] 47 psec 47 DongbuAnam 47 #.#mm x #.#mm x [002] 47 uL 47 x #.#in [002] 47 micron wafers 47 Stratix II 47 XBee PRO ZNet 47 Avago ACPL 47 SO8 47 #nm laser [002] 47 SMIC #.#um 47 numerical aperture 47 ArF immersion lithography 47 megapixels 3x optical zoom 47 copper metallization 46 μH 46 L#A [001] 46 megabits sec 46 × #.#mm [001] 46 #GS s 46 threshold voltages 46 D2PAK 46 LTPS TFT 46 3 x 3mm 46 CMOS IC 46 inch XGA 46 deformable mirror 46 OP# [003] 46 voltage divider 46 mW cm 2 46 micromirror 46 megapixel CCD 46 projected capacitive touch 46 monolithic microwave integrated 46 #nm node [002] 46 ADSL accesses 46 indium phosphide InP 46 lumen projector 46 wire bondable 46 5mm QFN package 46 electron volt 46 QFN# package 46 Bandspeed AirMaestro 46 #nm 8GB 46 MOS transistors 46 #.#Hz 46 x #.#mm [004] 46 × #.#mm [002] 46 CMOS oscillators 46 x #.#mm [003] 46 CMOS 46 mrad 46 MSPS ADC 46 megapixel autofocus 46 × #mm [002] 46 wafer thickness 46 #nm CMOS [002] 46 Arria GX FPGAs 46 MAX# MAX# [001] 46 meter multispectral 46 3x optical 46 x 8mm 46 Firmware Version 46 mm 46 #cm diagonal 46 #nm FPGA 46 TSMC #nm process 46 micron thick 46 msrp 46 4 x 4mm 46 #MSPS 46 3x zoom lens 46 TI WiLink 46 Distagon T * 46 GHz frequencies 46 EO polymer 46 microbolometers 46 Megapixel CCD sensor 46 g cm 46 transistor HEMT 46 CY# [003] 46 nano imprint 46 #Mb DDR2 46 ARM#EJ processor 46 transistor arrays 46 1mm x 1mm 46 QFN# packages 46 pin LQFP 46 mm QFN package 46 nanotube transistor 46 TFT LCD display 46 GaN wafers 46 #GBASE CX4 46 #nm NAND flash 46 MHz RFID tags 46 GSa s 46 mm diameters 46 #.#mm thick [002] 45 #.#mm [003] 45 #nm #nm [002] 45 planarization 45 transimpedance amplifier 45 neodymium magnet 45 Riviera PRO 45 GHz WiMAX 45 milliohm 45 QMEMS 45 pMOS 45 pin MSOP 45 GaAs substrates 45 AlSiC 45 #nm lithography [002] 45 Jeff Arend Impala 45 pin SOT 45 oxide semiconductor 45 3mm DFN package 45 ceramic capacitor 45 ownership CoO 45 optocoupler 45 Mbps HSDPA 45 #mm ² [002] 45 indium gallium arsenide InGaAs 45 RDS ON 45 ohm cm 45 #mm# [002] 45 1mm thick 45 Mbit 45 epiwafers 45 mm × 45 CMOS silicon 45 measures #.#mm x 45 micron wavelength 45 #/#nm 45 physical layer PHY 45 MHz downlink 45 WXGA #x# 45 arcsec 45 lp mm 45 voltage CMOS 45 WxDxH 45 5mm x 45 x#.# x#.# 45 inch #x# [002] 45 aspherical lens 45 #.#mm x [002] 45 iCoupler 45 SOI CMOS 45 InSb 45 WLCSP 45 wafer dicing 45 GaN HEMTs 45 HardCopy II 45 nm SRAM 45 x#.# [003] 45 kΩ 45 inch KDL 45 #Gbit [001] 45 TSMC #.#um 45 PowerDI TM 45 laterally diffused metal 45 CMOS wafers 45 f#.# lens 45 phototransistors 45 Silicon Germanium 45 gigabit Gb NAND flash 45 Angstroms 45 PV DV# 45 GigaByte 45 1nm 45 Fine Crossbred Indicator 45 #x# mm [003] 45 #nm VCSEL [001] 45 Dionex DNEX 45 2mm x 2mm 45 × #mm [001] 45 VCXO 45 #Msps [002] 45 inch tweeter 45 SiGe C 45 Virtex 5 45 WXGA LCD 44 FinFET 44 XDR DRAM 44 DMC LZ8 44 6nm 44 #.#um CMOS process 44 MBit s 44 EUV mask 44 MHz bandwidth 44 #pF [001] 44 narrow bezel 44 OCXO 44 WiMAX basestation 44 #/#.#-inch [002] 44 #.#x zoom lens 44 #nm wavelength [001] 44 5mm x 6mm 44 #x#x#mm [002] 44 pin QFN packages 44 7mm x 7mm 44 Porphyry -RIGHT PATH 44 digital converters ADCs 44 nanoimprinting 44 inch measured diagonally 44 #Mbit DDR2 44 millimeter 44 epitaxial deposition 44 Super HAD CCD 44 LSA#A 44 solder bumping 44 nm 44 photodetectors 44 multimode optical fiber 44 megapixel Kodak EasyShare 44 optical encoder 44 picosecond lasers 44 Phil Burkart Toyota Celica 44 nitride semiconductor 44 wire resistive touch 44 PIN diode 44 BiCMOS processes 44 #.#mm x [005] 44 FLD glass 44 optically coupled 44 OSTAR Compact 44 inch rack mountable 44 nm SOI 44 #:#.#-#.# 44 GHz Intel Xeon 44 mm equiv 44 1Gb DDR3 44 3x optical zoom lenses 44 mΩ 44 #/#-inch CCD 44 telephoto zoom lens 44 pin BGA 44 amorphous silicon Si 44 ED VR II 44 #mm f#.# [001] 44 Mbps HSUPA 44 galvo 44 #.#x#.#x#.# 44 6T SRAM 44 MHz NMR 44 ADC#D# 44 GaAs pHEMT 44 2mm x #.#mm 44 Gary Densham Chevy Impala 44 DFB lasers 44 Bipolar CMOS DMOS 44 4x optical 44 nanowatts 44 FPC connector 44 3mm x 3mm 44 #m/min [002] 44 #.#x#mm [001] 44 microfarads 44 x #.#cm [003] 44 TLP# 44 Xacti VPC 44 Gallium Nitride 44 #nm CMOS [001] 44 #nm silicon 44 μm 44 AlGaAs 44 3 mm DFN 44 sapphire substrate 44 Gb sec 44 SMA connectors 44 mm QFN 44 mux demux 44 megapixel Lumix 44 Steve Spiess Cobalt 44 Gbit NAND flash 44 dB attenuation 44 Flash microcontrollers 44 in. dia 44 TWINSCAN XT 44 voltage MOSFET 44 #.#mm x #.#mm [001] 44 Dektak 44 μV 43 WQVGA 43 GaN HEMT 43 μm wavelength 43 HRTEM 43 3mm x 3mm x 43 milliwatt 43 DMC LZ# 43 WXGA display 43 tapeouts 43 micrometer 43 darkfield 43 weighs #.#g 43 ClearVid CMOS Sensor 43 leadless 43 #.#Mp [002] 43 ADA# 43 .3 microns 43 SOI wafers 43 #mm x #.#mm [002] 43 ohm impedance 43 JOPS @ Standard 43 #x#x# [004] 43 k gate dielectric 43 toUS 43 fully synthesizable 43 pixel TFT 43 Mbits s 43 HEMTs 43 geometries shrink 43 serializer deserializer 43 PaxScan 43 microampere 43 Leica Digilux 43 #mm x #.#mm [001] 43 #.#mm thick [003] 43 wafer diameters 43 #.#x#.# 43 XFP module 43 SOIC packages 43 BCDMOS 43 mm LFCSP 43 high-k/metal gate 43 Sitrans 43 ENOB 43 DDR3 modules 43 pin LQFP package 43 mm F#.# 43 PBGA package 43 x #.#in [001] 43 XGA display 43 inch transflective 43 kbit s 43 heterostructure 43 TPCA# H 43 surface mountable 43 #X magnification 43 imprint lithography 43 HyperCrystal LCD 43 x 1mm 43 Mbit SRAMs 43 #.#mm x [004] 43 2Gb DDR3 43 #.#V voltage 43 #cm x 43 Gary Densham Impala 43 3mm x 43 k dielectric 43 #nm laser [001] 43 #nm NAND Flash 43 mask ROM 43 #Ω [002] 43 revs min 43 #.#a/b/g Bluetooth 43 #mm x 43 bipolar transistors 43 #.#mm x #.#mm [004] 43 #.#mm x #.#mm [002] 43 tiny 3mm x 43 silk dome tweeter 43 silicon Si 43 Cruz Pedregon Firebird 43 μm thick 43 #nm SOI 43 solder bump 43 nsec 43 pin TSSOP package 43 z axis 43 mGy 43 megapascals 43 aspheric lens 43 Frankfurt Xetra DAX index 43 pin SOIC packages 43 triplexer 43 GB #K RPM 43 NR# [001] 43 VECTOR Express 43 #u [001] 43 Gary Densham Monte Carlo 43 #.#mm thickness [003] 43 TrenchFET 43 7 x 7mm 43 EP#S# 43 Melanie Troxel Charger 43 input capacitance 43 epitaxial wafer 43 Del Worsham Impala 43 pin TQFP 43 pin SOIC 43 millimeter diameter 43 bending radius 43 x #pixels 43 #mm F#.# [002] 43 Gb s gigabits 43 #.#mm [002] 43 micron pixel pitch 43 DS DBR 43 EMIF# 43 micrometre 43 FWHM 43 ADS# [002] 43 bdrms starting 43 kg/m3 43 microlens array 43 frames sec 43 dual damascene 43 sub Angstrom 43 #nm transistors 43 #.#x Optical Zoom 43 JPY9 43 3CCD 43 hafnium oxide 43 angstrom 43 SerDes 42 √ Hz 42 #mm F4 [002] 42 microvia 42 crystalline Si 42 CMOS processes 42 #x #x [003] 42 inch Amoled 42 G5/iMac/MacMini DDR PC# 1GB 42 silicon oxynitride SiON 42 #μ 42 digital converter ADC 42 x#.# [002] 42 #x#x#mm [001] 42 x 2mm 42 #μm [002] 42 gigabit Gb 42 x#.# [004] 42 wirebond 42 QAM channels 42 instrumentation amplifier 42 LDMOS 42 Vdd 42 inch WQVGA 42 4mm x 4mm 42 #mA output [002] 42 #nm/#nm 42 megahertz MHz 42 package SiP 42 #.#uF 42 #.#mm x #.#mm [003] 42 #.#in [004] 42 CMP consumables 42 carbon nanotube CNT 42 #mm f/#.#-#.# [001] 42 epitaxy HVPE 42 leadframes 42 Nanometer 42 #Msps [001] 42 pin 3mm x 42 #x#cm [001] 42 intrinsic jitter 42 #mm f#.# [002] 42 gigabit NAND flash 42 defect densities 42 SOI MEMS 42 #X zoom lens 42 pin 5mm x 42 x 7mm 42 electron optics 42 MHZ 42 Measuring #mm [001] 42 Gbps throughput 42 GDDR4 42 fA 42 SAR ADC 42 varifocal lens 42 NanYa technology 42 3mm thick 42 #nm [001] 42 ZUIKO DIGITAL 42 indium gallium phosphide InGaP 42 GHz ISM 42 Tb s 42 ASPH lens 42 e beam lithography 42 ITRS roadmap 42 Jim Underdahl Suzuki 42 microbalance 42 Jeg Coughlin Cavalier 42 CHF #'# [002] 42 UMC #nm 42 angstroms 42 MSOP packages 42 Gary Densham Mustang 42 KHz 42 2μm 42 SOIC package 42 overlay metrology 42 millimeters thick 42 inductive sensor 42 mu m 42 microstrip 42 #x#mm [004] 42 8mm diameter 42 5Mp 42 megapixel #/#.# 42 pin SOT# package 42 WL CSP 42 capacitances 42 fxP 42 8mm thick 42 3G CDMA# 42 Zuiko Digital ED 42 WXGA TFT 42 RF amplifier 42 SWIR cameras 42 infrared LEDs 42 #nm RF CMOS 42 μF 42 monolithically integrated 42 7mm thick 42 #mm x #mm [007] 42 nm FPGA 42 QFN packages 42 1Mbit 42 f/#.# aperture 42 MESFET 42 inch wafer fabs 42 piezo actuators 42 f/#.#-#.# 42 epitaxial silicon 42 optiPoint 42 ESUP 42 nm wavelength 42 TQFN package 42 6 pin SOT 42 SST SuperFlash technology 42 SOI substrates 42 8 pin SOIC 42 UltraCMOS 42 MI #XM 42 mm f/#.# ASPH 42 CdTe Si 42 inch diagonal XGA 42 #.#x zoom 42 Jeg Coughlin Stratus 42 #.#μF 42 cm2 42 mm wafers 42 Gbit 42 E#/T# ports 42 SOP Advance 42 GHz 41 nanometers nm 41 insulator SOI technology 41 Soitec produces 41 nm excitation 41 titanium dome tweeter 41 x 2in 41 #MS s [001] 41 mm x 41 #pixels 41 ft sec 41 Mpts 41 DDR3 DIMMs 41 pin TSSOP 41 #CM [002] 41 pixel TFT LCD 41 PIC#F# [002] 41 microvolts 41 inch widescreen LED backlit 41 μs 41 SiGe bipolar 41 MBytes 41 pin QFN 41 density interconnect HDI 41 microchannel plate 41 Msps 41 thinnest slider 41 x 4mm 41 LiNbO3 41 pin 4mm x 41 #GHz [001] 41 wafer probing 41 3Xnm 41 JFET 41 monochromator 41 mega pixels 41 #nm lithography [001] 41 3X optical zoom 41 silicon oxynitride 41 #x#mm [001] 41 pHEMT 41 #.#cm x #.#cm x 41 epitaxial wafers 41 laser interferometer 41 shaft diameters 41 Mbits sec 41 micromachined 41 SiT# 41 Exmor APS HD 41 microwatts 41 arcsecond 41 motherglass 41 UMTS LTE 41 EasyShare C# 41 TOPX gained 41 #.#in x 41 mm thick 41 #/#.#-inch [001] 41 SCFM 41 pin PBGA package 41 μ 41 'M AWARE R 41 Cpk 41 #LP [002] 41 #mm x #mm [005] 41 #.#-#.# [011] 41 copper interconnects 41 #,#:# contrast ratio [003] 41 QphH @ #GB [001] 41 nanoimprint 41 cm -2 41 inches HWD 41 8mm x 8mm 41 x optical zoom 41 μS cm 41 SiP 41 TQFP packages 41 mosfet 41 pin QFN package 41 C0G 41 #.#mm [005] 41 antifuse 41 Jeff Arend Solara 41 weighs #g [001] 41 PIN diodes 41 microbolometer 41 TDFN package 41 MEX# gained 41 inductance values 41 ZIF 41 MCP# AFE 41 -BrawnGP 41 #.#mm x #.#mm x [004] 41 Vario Tessar 41 WCDMA GPRS 41 Oxide Silicon 41 BGA package 41 mm DFN package 41 Tony Pedregon Monte Carlo 41 Schottky 41 mHz 41 helical scan 41 Lumix G 41 fibonacci retracement level 41 Topix index shed 41 Topix index slid 41 SiC wafers 41 nickel silicide 41 #GB RAID 41 W/cm2 41 aspheric 41 lx 41 wirewound 41 dielectric constants 41 ± #.#mm [001] 41 Del Worsham Monte Carlo 41 #mm f/#.#-#.# [002] 41 InGaP HBT 41 InAs 41 Kenny Koretsky Cobalt 41 ZrO 2 41 Pentax lens 41 ± #ppm [001] 41 ANSI lumen 41 ACPL #J 41 mA output 41 Whit Bazemore Dodge Stratus 41 FBGA package 41 V ac 41 4kW 41 millimeter wafer 41 #x#mm [005] 41 connectorized 41 #x#mm [002] 41 SMT LEDs 41 deformable mirrors 41 Tony Bartone Monte Carlo 41 CMOS wafer 41 nanometer nm node 41 flexographic plates 41 millimeters mm 41 #mm equiv [001] 41 mH 41 micro SMD package 41 Cruz Pedregon Monte Carlo 41 diameter wafers 40 VCSEL 40 #.#mm# [002] 40 alloy wheels shod 40 kg hr 40 IARC No.5 Version 40 #um [002] 40 low k dielectric 40 PacketHop Communication System 40 bandpass 40 LQFP 40 CAPITAL ACCOUNT 40 #.#X zoom 40 PCI ExpressCard 40 Saelig Co. 40 gigabit DDR3 40 #.#x optical zoom [002] 40 HfSiON 40 inch vari angle 40 wirebonding 40 μm diameter 40 CMOS transistors 40 solder bumps 40 x #.#cm [002] 40 - -winger Colby Armstrong 40 Scott Kalitta Solara 40 DFN packages 40 2kV 40 XR#M# 40 DFN package 40 Canon CanoScan LiDE 40 SO8 package 40 ZR# [002] 40 #mm x #mm [001] 40 SOI wafer 40 MOS transistor 40 #ksps 40 SLR lens 40 nanometers nanometer 40 high-k/metal gate HKMG 40 Shutter speeds 40 SiON 40 5nm 40 laser annealing 40 #nm #nm [005] 40 QphH @ #GB [002] 40 image intensifier tube 40 CMOS circuits 40 AFM probes 40 VR lens 40 Zoom Lens 40 BiCMOS 40 PIN photodiode 40 lithographic processes 40 Phil Burkart Monte Carlo 40 Flexfet 40 2Gbit 40 insulator substrate 40 scintillator 40 nanoliter 40 multilayer ceramic 40 manufactures integrated circuits 40 epitaxial layer 40 Tricast £ 40 Erica Enders Cobalt 40 OS HSM 40 Shawn Gann Suzuki 40 UMC #.#um 40 pin DIP 40 Schottky diode 40 WL CSP package 40 line BEOL 40 pin TQFP packages 40 Kbit 40 transparent conductive 40 Greg Stanfield GXP 40 epi wafers 40 #nm immersion