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(Click for frequent words.) 68 #um [002] 68 #μm [002] 65 μm thick 65 5μm 65 3mm x 65 #.#μm [001] 64 DFN packages 64 cm ² 64 QFPs 64 #.#in [004] 64 #μm [001] 64 #.#mm x [003] 64 TDFN packages 63 #.#x#.#mm 63 1μm 63 x 3mm 63 QFNs 63 BGA packages 63 GaN layer 63 MSOP packages 63 overmolded 63 PBGA package 63 x 9mm 63 #.#mm [002] 63 #x#mm [002] 63 Si substrate 63 μm diameter 62 2μm 62 cone woofers 62 QFN packages 62 PQFP 62 SPDT switch 62 5mm x 62 shaft diameters 62 Unidirectional 61 capacitances 61 SO8 61 4mm x 61 6mm x 61 #.#um [001] 61 electrically insulating 61 AlN 61 MWNT 61 piezo actuators 61 x 2mm 61 5mm x 6mm 61 5mm x 5mm 61 8 pin SOIC 61 SiO 2 61 pin SOIC packages 61 x 1mm 61 TiN 61 CMOS transistors 61 HV# [001] 61 2mm x #.#mm 61 QSOP 61 2mm x 61 SOIC package 61 mm ² 61 ZnSe 61 #.#mm diameter [002] 61 #x#x#.#mm [003] 60 #pin [001] 60 LiNbO3 60 biaxial 60 LQFP 60 ZrO 2 60 voltage divider 60 #.#mm x #.#mm x [002] 60 x 5mm 60 #.#mm diameter [001] 60 μm 60 4mA 60 aluminum nitride 60 pin TDFN package 60 regrind 60 D2PAK 60 phototransistors 60 #nm wavelength [001] 60 subminiature 60 ferrite core 60 ballscrews 60 micron thick 60 pin TSSOP 60 pin LQFP 60 TQFP packages 60 TQFP 60 measuring #.#mm x [001] 60 pin TQFP 60 YAG lasers 60 underfill 60 capacitance values 60 #nm #nm [002] 60 pin DIP 60 3mm x 3mm 60 hafnium oxide 60 magnetic separator 60 anneal 60 x #.#mm [005] 60 Inconel 60 #:# multiplexer 60 #x# mm [004] 60 planarization 60 twin screw extruder 60 stripline 60 1mm thick 60 4mm x 4mm 60 reflowed 60 compressive stress 60 tiny 3mm x 60 singlemode 60 #x#mm package 60 nm wavelengths 60 #.#mm x #.#mm [003] 60 Ball Grid Array 60 XLPE 60 Nd YAG 60 overmolding 59 pin 4mm x 59 OP# [003] 59 Silicon Nitride 59 PIN photodiode 59 thermoplastic elastomer 59 GaAs MESFET 59 UHMW 59 #mm ² [001] 59 #x#mm [005] 59 TDFN package 59 #mm x #.#mm [002] 59 resistive element 59 pin TSSOP package 59 VCXO 59 EMIF# 59 #-#,# mm 59 electroless nickel 59 DFN package 59 8 pin MSOP 59 mm dia 59 #.#μ 59 #/#-in [001] 59 pin SOIC 59 #x# mm [003] 59 picoliter droplets 59 #mm diameter [002] 59 pin BGA package 59 #nm laser [002] 59 4 x 4mm 59 AdvancedMC module 59 emission wavelength 59 tensile stress 59 weldable 59 TQFN package 59 interposer 59 biotinylated 59 PEEK OPTIMA 59 backplane connectors 59 1mm x 1mm 59 coplanar 59 chipscale 59 FBGA package 59 SOIC 8 59 pin BGA 59 mounting flanges 59 8mm diameter 59 ZnS 59 2mm x 2mm 59 leadless 59 Attenuator 59 radial leaded 59 mm LFCSP 59 7mm x 7mm 59 Mbit SRAMs 59 SPI interfaces 59 BGA package 58 thermowells 58 TO #AB 58 pearlite 58 nanometric 58 microcavity 58 4H SiC 58 #MSPS 58 SMA connectors 58 #.#pF 58 Akulon 58 #mm x 58 MWCNTs 58 SOI substrates 58 W mK 58 denier polyester 58 carbides 58 coextrusion 58 LQFP package 58 directional coupler 58 Pulse Width Modulation PWM 58 pin BGA packages 58 4mm x 4mm QFN 58 subrack 58 dielectric layers 58 epiwafers 58 dimensional tolerances 58 silica spheres 58 indium gallium phosphide InGaP 58 pin SOIC package 58 PIN diode 58 wafer dicing 58 ZMD# 58 GaAs FETs 58 conductive epoxy 58 leadless package 58 TSSOP 58 mounting flange 58 tiny 2mm x 58 mu m 58 dopant 58 TSSOP package 58 monofilaments 58 BGA packaging 58 reflow profiles 58 pMOS 58 UCC# 58 Mach Zehnder modulator 58 silicon oxynitride 58 aluminum swingarm 58 nMOS 58 #kN [001] 58 SO8 package 58 pin 3mm x 58 #mm x #.#mm [003] 58 eutectic 58 X7R 58 #nm laser [001] 58 zirconium oxide 58 chip resistor 58 5mm x 5mm QFN 58 microtubes 58 Leadless 58 QFN# package 58 uniaxial 58 #pF [001] 58 #AWG 58 silicide 58 XR#M# 58 TQFP# 58 heterostructure 58 TQFN 58 3 x 3mm 58 Fractional N 58 Vor ink 58 InAs 58 bandpass 58 pin 5mm x 58 SOT# package [001] 58 PVD coating 58 MIC#/# 58 5mm QFN package 58 ADMP# 58 alumina ceramic 58 58 copper metallization 58 thermally conductive 58 PIN photodiodes 58 Differential Quadrature Phase 58 MAX# MAX# [001] 58 Bragg grating 58 mm diameters 57 PEDOT PSS 57 piezoelectric ceramic 57 inductive proximity 57 cone woofer 57 AFM probes 57 4mm thick 57 #.#mm# [002] 57 bicomponent 57 pin TQFN package 57 ultrahigh purity 57 CdSe 57 thermally enhanced 57 Sitrans 57 heat spreader 57 cermet 57 Stanyl 57 ferrite 57 thermoplastic polyester 57 Crystal Oscillator 57 silica substrate 57 transconductance 57 lowpass filter 57 photoelectric sensor 57 tph 57 sealless 57 coated polyester 57 Lithium Niobate 57 Nd Yag 57 #.#x#.# 57 laser annealing 57 mm BGA 57 CdS 57 kg hr 57 solderable 57 NiSi 57 QMEMS 57 7mm x 57 #.#mm thick [002] 57 flux residues 57 5V CMOS 57 parasitic capacitance 57 5kV 57 ferritic 57 Input Voltage 57 DrMOS 57 static dissipative 57 toroid 57 PLL synthesizer 57 thermoelectric cooler 57 Copolymer 57 Voltages 57 x 7cm 57 diode arrays 57 Fiberglass Reinforced 57 LQFP packages 57 Nova NanoSEM 57 cm -2 57 millimeter diameter 57 solder bumping 57 Industry Highest Density 57 photomultiplier tubes 57 wetted parts 57 monolithically integrated 57 QFN packaging 57 streptavidin 57 wire bondable 57 thermowell 57 Schottky diodes 57 GaAs MMIC 57 Load Cell 57 aluminum heatsink 57 pin QFN package 57 PWM output 57 #/#mm [001] 57 soft dome tweeters 57 #μm thick [002] 57 SOIC packages 57 downconverter 57 SDS PAGE 57 MAX# integrates 57 W/cm2 57 laser resonator 57 pin QFN 57 Flip Chip 57 Metallization 57 surface mountable 57 gate electrode 57 indium phosphide InP 57 analog circuitry 57 #μF [002] 57 coplanarity 57 x 4mm 57 x 7mm 57 PowerPAK 57 PIN diodes 57 low k dielectrics 57 MBd 57 fxP 57 TFTs 57 microfluidic channels 57 z axis 57 Thermocouple 57 pin SSOP package 57 cm ^ sup 57 APTIV film 57 SiT# 56 Mach Zehnder 56 dielectric layer 56 planetary gearbox 56 #.#nm [002] 56 MESFET 56 pin TQFP package 56 thermally bonded 56 granulates 56 Cu Cu 56 #x#mm [004] 56 phototransistor 56 SSOP packages 56 flexural 56 ISL#M 56 AlGaAs 56 Clamp Meter 56 mount inductors 56 denier nylon 56 autoclavable 56 zener diodes 56 MI #XM 56 transistor amplifier 56 austenitic stainless steel 56 magnetic stirrer 56 silicon waveguide 56 tensile strengths 56 #KHz [002] 56 #.#mm x #.#mm [001] 56 thickness uniformity 56 elastic modulus 56 linewidths 56 pre preg 56 Si substrates 56 #mm# [002] 56 instrumentation amplifier 56 ps nm 56 electron bunches 56 molybdenum disulfide 56 Fig. 3A 56 cuvettes 56 Datamate 56 pin TQFN 56 QFN# 56 TLP# 56 MASW # 56 input impedance 56 GaN wafers 56 polydimethylsiloxane PDMS 56 CaO 56 cored wire 56 SOT# [002] 56 SiC substrates 56 octyl 56 FinFETs 56 thermo mechanical 56 MLPQ package 56 SiGe bipolar 56 chip resistors 56 #/#T 56 6mm thick 56 nm VCSEL 56 wavelength tunable 56 transimpedance amplifier 56 OCXOs 56 sintered metal 56 in. dia 56 #.#mm x [005] 56 #.#uF 56 MOSFETS 56 Avago ACPL 56 DPAK 56 submicron 56 nonpolar GaN 56 polytetrafluoroethylene PTFE 56 Hytrel 56 polyetheretherketone PEEK 56 UV VIS 56 #Msps [002] 56 #GBASE LR 56 varactors 56 #.#μF 56 Photoelectric Sensors 56 thixotropic 56 PE# [001] 56 NTC thermistor 56 #u [001] 56 mosfets 56 linear encoder 56 AdvancedMC modules 56 Schottky diode 56 #mm# [001] 56 ohm cm 56 nitrided 56 micromirror 56 3mm thick 56 #oC [001] 56 × #mm [002] 56 reflow solder 56 BJTs 56 piezoelectric actuators 56 jointless 56 cartoner 56 SWCNT 56 LMX# 56 MSOP package 56 bend radii 56 #A #V [002] 56 poly crystalline 56 solder pastes 56 IR#S 56 photomultipliers 56 #x#x# mm [002] 56 #mm ² [002] 56 transmissivity 56 M# connectors 56 magnetostrictive 56 molded silicone 56 synchronous buck converter 56 glass frit 56 motorized faders 56 rheometer 56 chamfer 56 3mm DFN package 56 polydimethylsiloxane 56 dual damascene 56 meltblown 56 collimators 56 ZIF 56 Digital Converter ADC 56 microlens array 56 AQ# [001] 56 titanium nitride 56 Yb 56 DFN# 56 #Vdc [003] 56 x 6mm 56 Coriolis meters 56 ferrites 56 silicon modulators 56 reflow oven 56 Zirconium Oxide 56 varying thicknesses 56 electroformed 56 epitaxial layer 56 doped silicon 56 solder bumps 56 sq. mm 56 toolholder 56 GaN HEMTs 56 servo driven 56 OTDR modules 56 Ultra DMA 56 inkjet printer cutters 56 SMA connector 56 SFP + transceivers 56 pipette tips 56 UV lasers 56 OPTIMASS 56 Photometer 56 magnetically coupled 56 Gigahertz GHz 56 GaN layers 56 silicon germanium SiGe 56 Schematic representation 56 PHY# [001] 56 Maxle 56 mux demux 56 CAN transceiver 56 pin SOT# package 56 multilayers 56 #L stainless steel 55 7 x 7mm 55 transceiver module 55 HEMTs 55 ADA# 55 nm excitation 55 MAX#/MAX# [002] 55 Potentiometer 55 Er YAG 55 8mm x 8mm 55 ± #.#mm [002] 55 brazed 55 ripstop 55 tiny #.#mm x 55 jaw crusher 55 microstrip 55 polyacrylonitrile 55 ± #V [001] 55 AFBR 55 3U rack mount 55 2kHz 55 picoliter 55 #degreesC 55 1U rackmount server 55 Schottky rectifiers 55 planarity 55 passivation layer 55 cuvette 55 varying densities 55 CY# [003] 55 mechanical polishing CMP 55 SiON 55 V dc 55 TOSAs 55 PQFN package 55 nanosecond pulse 55 wavelength tunability 55 input capacitance 55 laminations 55 #degC [002] 55 x 8mm 55 TMP# 55 gear reducers 55 microvolts 55 density fiberboard 55 3cm thick 55 pin LQFP package 55 nanometers nm 55 granulate 55 #.#mm x [001] 55 mechanical actuators 55 cryogenically cooled 55 #x#x#mm [002] 55 #ppm ° C 55 pH electrode 55 tunable filters 55 aluminum housings 55 UV stabilized 55 Signal Generator 55 #AX# 55 toroids 55 Linear Actuator 55 milliohm 55 wph 55 prefilter 55 reflow soldering 55 magnesium ion 55 ballscrew 55 sintered 55 TQFP package 55 Exoscan 55 tin oxide 55 MLCCs 55 Vdd 55 tin Sn 55 bending radii 55 Hastelloy C 55 thermoplastic polymer 55 Thermo Plastic 55 thermoset composite 55 electret 55 rim diameters 55 AlN layer 55 wirewound 55 Gallium arsenide 55 1W LEDs 55 QFN 55 polysulfone 55 Mosfets 55 micropores 55 rpm spindle 55 8 pin TDFN 55 pin SOT 55 QFP package 55 preheater 55 servo amplifier 55 rms jitter 55 ADN# 55 QCLs 55 SOT# [001] 55 3mm x 3mm DFN 55 crystal resonator 55 JFETs 55 #x# mm QFN 55 #mm x #mm [007] 55 OC-#/STM-# [001] 55 #Ω [002] 55 Nd YAG lasers 55 IP# enclosure 55 #x#x# mm [001] 55 2mm thick 55 Hastelloy 55 sub micron 55 -# ° [002] 55 6 pin SOT 55 ATtiny# 55 Bulk Metal 55 aramid fibers 55 aluminum fins 55 concentricity 55 centrifuged 55 PWM frequency 55 QFN# packages 55 torque transducer 55 x 4cm 55 strain gage 55 #m/min [002] 55 NWs 55 Si#DP 55 HV# [003] 55 P3HT 55 H#SO# 55 IP# sealing 55 GMSK 55 HMC#LP#E 55 #.#mm x [004] 55 rotor stator 55 subwavelength 55 Neodymium magnet 55 #μF [001] 55 metallisation 55 rotary encoders 55 μS cm 55 μF 55 pin SSOP 55 reticles 55 exotherm 55 AlGaN 55 martensitic 55 peening 55 ppm ° C 55 TRF# [002] 55 MIM capacitors 55 superlattice 55 TSSOP# 55 Pt# 55 copper interconnects 55 #.#kV [001] 55 CL7 55 1W LED 55 ohm resistor 55 #/#-inch [003] 55 OCXO 55 PLLA 55 #mm x #mm [006] 55 microcapillary 55 photonic crystal fiber 55 mount SMT 55 conjugated polymer 55 #x#x# cm 55 circular connectors 55 oscillator frequency 55 pin QFN packages 55 Inductors 55 55 oxide thickness 55 tantalum capacitors 55 lead LFCSP 55 GaAs substrates 55 λ 55 toroidal 55 U#A [002] 55 cannulated screws 55 coextruded 55 Conductive Polymer 55 Measuring #mm [002] 55 #.#mm x #.#mm [002] 55 wafer thickness 55 asynchronous SRAM 55 martensite 55 +4 dBm 55 capillary tube 55 thermally optimized 55 nanometer wavelength 55 mosfet 55 1nm 55 C0G 55 VCOs 55 dielectrics 55 TDFN 55 Schematic illustration 55 microbalance 55 micrometre 55 filter housings 55 diametre 55 comminution 55 MTS# 55 pin MLF 55 3 mm DFN 55 6mm x 6mm 55 absorption coefficient 55 workpieces 55 pellicle 55 NMOS 55 #bit ADCs 55 polyamide PA 55 femtosecond pulse 55 mesh sieve 55 atomically smooth 55 ISL#A 55 #G XFP 55 electroless 55 mask aligner 55 STA# [001] 55 #mm# [003] 55 Z Foil 55 AWG wires 55 PF# [002] 55 TCXOs 55 Fig. 2b 55 carbon nanotube CNT 55 precise tolerances 55 Leadframe 55 CNC machined 55 CCD detector 55 ft sec 55 nanocrystalline 54 nL 54 WLCSP 54 GaAs pHEMT 54 micrometer thick 54 thermoplastic polyurethane TPU 54 Measuring #mm [001] 54 melt processable 54 tensile modulus 54 nanochannels 54 eutectic solder 54 ferrule 54 melt viscosity 54 nm CMOS process 54 compression molded 54 #.#mV 54 busbars 54 airgap 54 transceiver modules 54 6mm 54 Gaussian filter 54 micron diameter 54 piezo motor 54 #pF [002] 54 polymer matrices 54 wirewound resistors 54 Chip Scale 54 SMD LEDs 54 #.#m# [001] 54 cordsets 54 HfO2 54 toolholders 54 connectorized 54 plasma etching 54 μl 54 variable resistor 54 2dB 54 #Mx# [003] 54 metering pumps 54 Scale Package 54 MoS2 54 DPSS laser 54 flexure 54 collimator 54 #.#VDC 54 helical gears 54 Mosfet 54 Zytel ® 54 epitaxial layers 54  m 54 parasitic inductance 54 V0 54 digitally programmable 54 #mm diameter [001] 54 UV absorbance 54 microgel 54 dc dc conversion 54 ultrasonic vibration 54 Nd YAG laser 54 Ultrathin 54 UV inkjet printer 54 Dektak 54 ADF# 54 borosilicate glass 54 TCXO 54 pin PBGA 54 g cm 54 4U chassis 54 epi wafers 54 microstructured 54 transistor HEMT 54 DDR2 DRAM 54 TOF TOF 54 indium gallium 54 multicrystalline module 54 Al#O# 54 voltage dividers 54 pin TQFP packages 54 nonmagnetic 54 DEV DA TOMAR NEXT 54 optocoupler 54 triplexer 54 2nm 54 #nm CMOS [002] 54 moisture vapor 54 AdvancedMC processor 54 1RU chassis 54 coupling capacitor 54 autosampler 54 +# oC 54 nH 54 rotary vane 54 HMC# [001] 54 titanium aluminide 54 microns thick 54 lamella 54 platens 54 Lithium ions 54 mandrel 54 volute 54 modulus 54 Co2 laser 54 metalized 54 crystallinity 54 WL CSP package 54 polymer fibers 54 antireflective coatings 54 3nm 54 Gallium Nitride 54 TPCA# H 54 Mbit Ethernet 54 Microfluidic devices 54 icosahedral 54 injection moldable 54 SPDT switches 54 nanocrystalline diamond 54 absorbance 54 EDFAs 54 #.#μm CMOS 54 sensing resistors 54 DPSS lasers 54 attenuators 54 porous membranes 54 T6 aluminum 54 Thermo Scientific Accela 54 viscosity liquids 54 #.#R# [002] 54 semiconductive 54 RP Processor 54 magnetic separators 54 silicon substrates 54 microvias 54 axial leaded 54 LVCMOS 54 bypass capacitors 54 taper roller bearings 54 5mm x 6mm x 54 1u 54 QFN package 54 EVA foam 54 RGB LEDs 54 SY#U SY#U 54 rotary valves 54 TDA# [002] 54 PHEMT 54 carbide insert 54 coaxial connector 54 SWNT 54 downtube 54 coarser grind 54 MB#F# 54 modulation formats 54 #mm x #mm [001] 54 VR lens 54 leadframe 54 dielectric constant 54 kbit 54 UHMWPE 54 nickel hydroxide 54 pin QFP 54 8mm thick 54 5nm 54 agarose 54 countersink 54 #.#dB [003] 54 multimode optical fiber 54 Ultramid 54 ultrathin layer 54 #ksps 54 osteoconductive 54 tensile strain 54 Si#DB 54 fluorogenic 54 3mm x 3mm x 54 NaOH 54 Shimano Deore XT 54 monochromator 54 HOUSE Remains 54 omnidirectional antenna 54 termination resistors 54 DAC# 54 thermally stable 54 PQFN 54 mW/cm2 54 RF demodulator 54 SDR S# [002] 54 solder bump 54 VICTREX PEEK polymer 54 CBT resin 54 AMIS # 54 coupled diode laser 54 corrugation 54 particle sizing 54 #AX# preamp tubes 54 InSb 54 SerDes chipset 54 2kV 54 Mbit MRAM 54 alloyed steel 54 Micrometer 54 pyrophosphate 54 JFET 54 Germanium Ge 54 #/#/# Mbps 54 PA6 54 μW 54 borosilicate 54 nucleation layer 54 #ohm [002] 54 homopolymers 54 MICRO FOOT 54 FPCs 54 PX# [003] 54 homopolymer 54 #x#.# [002] 54 5mm thick 54 ultrasonic transducers 54 silicate glass 54 HCS# 54 FinFET 54 3mm DFN 54 Pebax

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