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(Click for frequent words.) 68 metallisation 65 #nm CMOS [002] 65 calcium fluoride 64 pellicle 64 zinc selenide 64 gallium arsenide gallium nitride 64 semiconductive 64 copper metallization 64 hafnium oxide 63 vapor deposition 63 ZnS 63 oxide semiconductor 63 di selenide CIGS 63 ZnSe 63 biologically inert 63 optical waveguides 63 silicon oxynitride 63 epitaxy HVPE 63 Silicon dioxide 63 aluminum nitride 63 Gallium arsenide 63 #μm thick [002] 63 thermoplastic polyester 63 PEEK OPTIMA 63 zirconium oxide 62 fused quartz 62 indium gallium nitride 62 InAs 62 indium gallium 62 epi wafers 62 ceramic dielectric 62 antireflection 62 transparent electrode 62 titanium nitride 62 nanoparticle inks 62 LiNbO3 62 diffractive optical elements 62 nanotubes nanowires 62 conductive coating 62 eutectic solder 62 nanofilm 62 polysiloxane 62 copper indium diselenide 62 5V CMOS 62 transparent conductive 61 indium phosphide InP 61 Silicon Nitride 61 pulsed laser deposition 61 .# micron 61 Powerful debug 61 PIN photodiode 61 conductive epoxy 61 tin oxide 61 APTIV film 61 microfabricated 61 #.#um [001] 61 nanocrystalline 61 Solamet ® 61 coextrusion 61 photomultipliers 61 amorphous silicon Si 61 silicide 61 photoconductive 61 #nm wavelength [001] 61 AlGaInP 61 Cadmium Telluride 61 wafer dicing 61 stereolithography 61 silicon substrates 61 k dielectric 61 Photolithography 61 polytetrafluoroethylene PTFE 61 epitaxial silicon 61 silicon Si 60 photolithographic 60 thinner wafers 60 microstructured 60 kerf 60 Si substrate 60 planarization 60 multilayers 60 cadmium chloride 60 NiSi 60 Silicon Germanium 60 ultraviolet curable 60 CdSe 60 overmolding 60 embedded nonvolatile memory 60 AFM probes 60 Polyimide 60 silica spheres 60 hydride vapor phase 60 microfabrication techniques 60 chalcogenide glass 60 leaded solder 60 coextruded 60 SiO 2 60 insulator substrate 60 CIGS Copper Indium 60 insulator wafers 60 atomically smooth 60 conductive adhesive 60 imprint lithography 60 LTPS TFT 60 Carbon nanotube 60 CIGS solar cell 60 #nm #nm [002] 60 leadframes 60 solder bump 60 glass frit 60 indium gallium phosphide 60 CIGS copper indium 59 #.#μ 59 solder reflow 59 SiON 59 fused silica 59 electrodeposition 59 SiGe bipolar 59 gallium phosphide 59 titanium carbide 59 agarose 59 inorganic nanocrystals 59 absorber layer 59 Si substrates 59 indium tin oxide ITO 59 mechanical polishing CMP 59 GaAs MESFET 59 underfill 59 cordierite 59 barium titanate 59 CNT FED 59 silicon modulators 59 thermoform 59 gallium selenide 59 silicon nanocrystals 59 nematic 59 nickel hydroxide 59 nonconductive 59 nano imprint 59 Lithium ions 59 injection moldable 59 GaN wafers 59 di selenide 59 ultraviolet lasers 59 inkjet inks 59 organic TFTs 59 ion milling 59 nitride semiconductor 59 optically transparent 59 #nm silicon 59 polymer substrates 59 #.#um CMOS process 59 epiwafers 59 magnetron sputtering 59 silicate glass 59 cuvette 59 nano tubes 59 nonpolar GaN 59 pentacene 59 nanometric 59 YAG lasers 59 SWIR cameras 59 surface functionalization 59 5μm 59 aqueous dispersion 59 UV reactive 59 PIN photodiodes 59 SiC substrates 59 HEMTs 59 III nitride 59 reflow solder 58 nanometal 58 AlN 58 eutectic 58 microcrystalline 58 projected capacitive touch 58 #.#μm [001] 58 polyacrylonitrile 58 mask aligner 58 TiN 58 toroids 58 gallium indium arsenide 58 reflowed 58 Cadmium Telluride CdTe 58 plasma etching 58 cadmium selenide 58 Europium 58 SWCNT 58 Smart Stacking 58 absorption spectroscopy 58 Flip Chip 58 #nm laser [002] 58 Gallium Nitride GaN 58 transistor arrays 58 SOI CMOS 58 nanostructured silicon 58 zirconium dioxide 58 virgin PET 58 heat shrinkable 58 #.# micron CMOS 58 ZnO nanowires 58 PIN diode 58 electron beam welding 58 MWNT 58 pHEMT 58 inkjet printhead 58 aluminum nitride AlN 58 pre preg 58 advanced leadframe 58 Si Ge 58 transparent conductive oxides 58 epitaxial wafers 58 #.#um CMOS 58 Silicon wafers 58 Indium Phosphide InP 58 gallium indium 58 piezo ceramic 58 CdTe Si 58 MEMS MOEMS 58 nm CMOS process 58 Langmuir Blodgett 58 film transistors TFTs 58 electrically insulating 58 micromachined 58 mask ROM 58 rectifier diode 58 nano porous 58 P3HT 58 tellurium selenium iridium 58 Rapid prototyping 58 GaAs substrates 58 GaSb 58 Nd YAG lasers 58 MWCNTs 58 cermet 58 layer deposition ALD 58 Tetra Reticle Clean 58 laminate substrate 58 x 9mm 58 metallic nanostructures 58 thermal conduction 58 photoresists 58 nanotube arrays 58 particulate contamination 58 TFTs 58 electroless copper 58 indium gallium arsenide 58 μm thick 58 QMEMS 58 granulates 58 germanium substrates 58 opto electrical 58 MEMS resonators 58 nanocoating 58 nanoimprinting 58 phthalocyanine 58 copper indium gallium diselenide 58 wirewound 58 indium gallium arsenide InGaAs 58 microns thick 58 LCoS liquid crystal 58 wafer thickness 58 low k dielectrics 57 heterostructures 57 photodetector 57 Electroless 57 carbon nanotube CNT 57 melt viscosity 57 Aerogels 57 EMI RFI shielding 57 conductive adhesives 57 micrometer thick 57 GaN LEDs 57 SAC# 57 polysilicon ingot 57 heat sealable 57 Follow Vishay 57 CarboGran 57 sputter deposition 57 electroactive 57 photocatalysts 57 aspheric lens 57 wet granulation 57 dichromate 57 cadmium zinc telluride 57 photoresist stripping 57 cadmium sulfide 57 biocompatible polymers 57 ferro electric 57 defect densities 57 PEDOT PSS 57 silanes 57 DSSCs 57 #um [001] 57 electro deposition 57 RF transistors 57 LED printheads 57 Lumiramic phosphor technology 57 metalorganic chemical vapor deposition 57 6mm x 6mm 57 Gallium Arsenide GaAs 57 Chemical Vapor Deposition CVD 57 BreatheWay 57 micro machining 57 poly crystalline 57 CMOS silicon 57 nanofabrication techniques 57 ultrathin layer 57 ferrite beads 57 electroplated 57 protein adsorption 57 BGA packaging 57 thermoplastic polymer 57 conductive pastes 57 String Ribbon 57 2μm 57 nanofabricated 57 cored wire 57 nanometers nm 57 3mm thick 57 CMOS transistors 57 thermally stable 57 UV VIS 57 excimer 57 Lithium Niobate 57 Thin Film Transistors 57 microwell plate 57 nanoarrays 57 perfluorinated 57 ferrites 57 microelectromechanical 57 4mm thick 57 phototransistors 57 Pigmented 57 microcavities 57 #μm [002] 57 photovoltaic glazing 57 optically pumped 57 Elpida #nm 57 LSA#A 57 porous silicon 57 dielectric layers 57 ultraviolet LEDs 57 polymer coatings 57 pyrolytic 57 latex caulk 57 Micromorph 57 photorefractive 57 high voltage BCDMOS 57 Gallium Arsenide 57 borosilicate glass 57 AlInGaP 57 doped silicon 57 injection molding extrusion 57 SIMOX 57 anneal 57 nanopowders 57 Polycrystalline 57 multijunction solar cells 57 aluminum electrolytic capacitors 56 backside metallization 56 static dissipative 56 #nm immersion lithography 56 logic CMOS 56 coating thickness 56 UV curable ink 56 CIGS solar cells 56 Oxide Silicon 56 furnaceware 56 processable 56 epiwafer 56 electro conductive 56 photonic bandgap 56 DS DBR 56 through silicon vias 56 selenide 56 crystallinity 56 UV lasers 56 AccelArray 56 bismuth telluride 56 reflective polarizer 56 silicon waveguide 56 stripline 56 battery anodes 56 surface mountable 56 active matrix OLEDs 56 Grätzel cells 56 nanopatterns 56 holmium 56 PVD coating 56 polydimethylsiloxane 56 wafer bonder 56 BaFe 56 FinFET 56 polycrystalline diamond 56 silica substrate 56 outcoupling 56 Thin Film Transistor 56 2Xnm 56 laterally diffused metal 56 metallurgically bonded 56 GTAW 56 ownership CoO 56 bipolar transistors 56 polymer nanocomposite 56 corrosion resistant coating 56 DEV DA TOMAR NEXT 56 liquid crystal polymer 56 meltblown 56 ultrapure 56 nano imprinting 56 Copper Indium Gallium diSelenide 56 parylene 56 Indium Tin Oxide 56 bicomponent 56 OSTAR ® 56 polyethylene fiber 56 flux residues 56 inorganic LEDs 56 hardcoat 56 transparent conductive oxide 56 CIGS cells 56 ferric oxide 56 SMIC #.#um 56 boron nitride 56 nanosphere 56 TQFP packages 56 nanopatterned 56 borosilicate 56 low k dielectric 56 aligned carbon nanotubes 56 NdFeB magnets 56 CameraChip 56 #um [002] 56 multicrystalline ingots 56 Electrografting 56 metallised 56 ceramic powders 56 silicon photonic 56 photopolymer 56 nanoantenna 56 resistive element 56 copper indium gallium 56 nucleation layer 56 UV coatings 56 InSb 56 electroless nickel 56 Co2 laser 56 Indium Phosphide 56 wafer metrology 56 AlGaAs 56 nanoparticulate 56 sapphire wafer 56 cuprous oxide 56 AlGaN 56 magnetic permeability 56 nanosilicon 56 coplanar 56 carbonization 56 dielectric layer 56 SiO2 56 insulator SOI technology 56 capacitors inductors 56 diffraction gratings 56 #.#mm thick [002] 56 dopant 56 thermoplastic elastomer 56 OTFT 56 epitaxial layers 56 graphene circuitry 56 PLLA 56 flexo gravure 56 alkali metal 56 indium gallium nitride InGaN 56 microcavity 56 electro optic modulators 56 Solamet 56 nanotube sheets 56 photodetectors 56 manganite 56 manganese oxide 56 silicon MEMS 56 dielectric etch 56 solder bumping 56 SOI wafer 56 singulation 56 electroless 56 sintered 56 crystalline semiconductors 56 millisecond anneal 56 conjugated polymer 56 passivating 56 picoliter droplets 56 quantum dots QDs 56 transparent conductive coatings 56 solder flux 56 InGaP 56 backside illumination 56 GaAs substrate 56 On Insulator SOI 56 specially formulated adhesive 56 Zener diodes 56 thermal conductivities 56 ferrite 56 Simitri HD 56 microlens array 56 Aluminum Nitride 56 AlN layer 56 resin composites 56 μm diameter 56 PolyJet Matrix TM 56 nanocoatings 56 external EEPROM 56 Vor ink 56 solder bumps 56 embedded SRAM 56 HfSiON 56 switchgrass wood 56 reticles 56 roughening 56 UVTP 56 Structured eASIC 56 CIS CIGS 56 aqueous dispersions 56 multilayer ceramic 56 ultrasonic welding 56 Carbon fiber 56 inorganic molecules 56 variable resistor 56 CdTe PV 56 plasma etch 56 thermoset composite 56 chemically inert 56 biaxially oriented polypropylene 56 Photonic crystal 56 nonmagnetic 56 lithium niobate 55 nanometer transistors 55 solder mask 55 MI #XM 55 polyaniline 55 BGA packages 55 nanosized particles 55 polyisoprene 55 #nm laser [001] 55 nanometer CMOS 55 nitrided 55 Zeolites 55 monolithically integrated 55 sapphire substrate 55 thermowells 55 Mercury5e 55 porous membranes 55 epitaxially 55 #.#x#.#mm 55 halide 55 thickness uniformity 55 3Xnm 55 copper interconnects 55 electrochemical sensor 55 Nd YAG 55 emission spectroscopy 55 pn junctions 55 heat spreaders 55 capacitive sensors 55 micron thick 55 PHEMT 55 Silicon germanium 55 wirebond 55 Scanning Probe Microscopes 55 PEDOT 55 Fiberglass Reinforced 55 Copper Indium Gallium 55 dielectric materials 55 microfine 55 microlens arrays 55 manufactures integrated circuits 55 solution processable 55 superlattice 55 micro optics 55 moldability 55 nitride 55 LQFP package 55 polydimethylsiloxane PDMS 55 electret 55 epitaxial deposition 55 crystalline Si 55 metallic interconnects 55 magnesium fluoride 55 dual damascene 55 electroformed 55 permeable membranes 55 sulfonated 55 Hastelloy C 55 heterostructure 55 K dielectrics 55 metallic inks 55 highly conformal 55 extrudate 55 metalised 55 micrometer sized 55 RoHs compliant 55 mount inductors 55 nano crystals 55 SOI MEMS 55 silicon interposer 55 DURABIS 55 germanium antimony 55 corona discharge 55 Erbium 55 Sn Pb 55 yttrium barium copper 55 Raman lasers 55 nanodevice 55 ferrite core 55 zinc oxide ZnO 55 reflow soldering 55 CyberDisplay #K 55 halides 55 mount SMT 55 scanning electron microscopy SEM 55 titanium zirconium 55 Nanotube 55 nanodots 55 amorphous silicon PV 55 pMOS 55 crystalline silicon photovoltaic 55 Esatto Technology 55 #nm immersion 55 resists abrasion 55 microwires 55 indium arsenide 55 CVD reactors 55 fusible 55 nano imprint lithography 55 thermometers barometers dental amalgams 55 powerline modem 55 liquid crystal polymers 55 MAX# integrates 55 #.#mm x [003] 55 nanowire transistors 55 Ball Grid Array 55 Schematic representation 55 polymer coated 55 CIGS photovoltaic 55 Nanopores 55 Cree GaN 55 monocrystalline silicon 55 digital halftone 55 ElectriPlast ¿ 55 indium gallium phosphide InGaP 55 InGaN 55 SOI Silicon 55 flexo printing 55 5mm thick 55 triacetate 55 Z Foil 55 calcium magnesium phosphorus 55 photonic lattice 55 epitaxial wafer 55 shrinking geometries 55 stylus profilers 55 cryogenically cooled 55 Pls redistribute 55 conductive polymer 55 Surface Acoustic Wave 55 CMOS fabrication 55 carbides 55 thermo mechanical 55 lithographic processes 55 #μ 55 silicon 55 lysate 55 carbon nanotubes CNT 55 polyethylene PEN 55 e beam lithography 55 #.# micron node 55 Dektak 55 oxide nanoparticles 55 conventional photolithography 55 polylactide 55 lenses prisms 55 Sigma fxP 55 photopolymers 55 wafer thinning 55 inkjet printing systems 55 SnPb 55 SMD LEDs 55 passive matrix 55 Tungsten carbide 55 conductively cooled 55 primer sealer 55 indium phosphide 55 LTPS LCD 55 diodes LEDs 55 oxide particles 55 PenTile 55 paperlike 55 Kuan Yin Taiwan 55 multilayer ceramic capacitors MLCC 55 IGBT Insulated Gate 55 conduction cooling 55 optical coatings 55 micrometer scale 55 airgap 55 particle sizing 55 nanoporous 55 CMOS wafer 55 rigid substrate 55 calcined kaolin 55 Aera2 55 TEGA ovens 55 inkjet printers UV 55 polyimide 55 4 x 4mm 55 micron thickness 55 cuvettes 55 thermoset rubber 55 inorganic semiconductors 55 CMOS imager 55 TDFN packages 55 Epitaxial 55 crystalline silicon wafers 55 polymer composite 55 X ray microscopy 55 compressive stresses 55 micro fluidic 55 microchannel plate 55 BrightLase 55 eutectic alloy 55 Complementary Metal Oxide Semiconductor 55 AlN substrates 55 argon ion 55 3cm thick 55 chromated 55 2Gb DDR2 55 microbolometer 55 heterojunction bipolar transistor HBT 55 Fortron PPS 55 microcapillary 55 Schottky Diodes 55 CdS 55 filament winding 55 Powder coating 55 melted beeswax 55 hermetic packaging 55 polyimides 55 electrospray 55 epitaxy 55 electrophoretic 54 biohybrid 54 metallization 54 aluminum arsenide 54 nano coating 54 BiFET 54 scintillator 54 MESFET 54 Ion Mask 54 Metamaterial 54 absorbs photon 54 Joule heating 54 vinyl esters 54 wettable 54 gate dielectrics 54 DPSS lasers 54 TrueStore 54 inorganic compounds 54 multichip 54 Arria GX FPGAs 54 Laser diodes 54 dielectrics 54 fluorescence quenching 54 ULTEM 54 deep silicon etch 54 composite laminates 54 polishing pads 54 microtubes 54 laser diode modules 54 ZrO 2 54 electron emitters 54 Aixtron MOCVD 54 Nanocrystals 54 Focused Ion Beam 54 thixotropic 54 taggant 54 carbon nanotube arrays 54 nanofluidic devices 54 k gate dielectric 54 Cycoloy 54 AIX #G# 54 prebaked 54 flexible substrates 54 mono crystalline 54 micrometre scale 54 squeegee blades 54 CMOS logic 54 polybutylene terephthalate 54 linewidths 54 infrared emitters 54 photonic crystal fibers 54 multicrystalline silicon 54 String Ribbon solar 54 transparent electrodes 54 semiconductor nanocrystals 54 CIGS panels 54 CIGS solar panels 54 flex circuits 54 #nm RF CMOS 54 Nanometer 54 micromirrors 54 submicrometer 54 UV NIL 54 Czochralski 54 functional prototypes 54 QFN packaging 54 reflow oven 54 conductive inks 54 UNCD 54 thermosets 54 extruded profiles 54 microgel 54 PolyJet 54 Plasmonic 54 GaN substrates 54 thermoplastic polyurethane TPU 54 tuner demodulator 54 pore sizes 54 heterojunction 54 barium ferrite 54 epoxy prepreg 54 corrosion resistant materials 54 quantum cascade 54 aluminum gallium arsenide 54 INTRINSIC 54 Tessera Licenses 54 GaP 54 dielectrophoresis 54 transistor HEMT 54 lenticular lens 54 CVD diamond 54 CMOS processes 54 Sequans SQN# 54 CMP polishing 54 crosslinking 54 nanocrystalline diamond 54 Silicon carbide 54 Photonic crystals 54 InGaP HBT 54 CRIUS II 54 polymethyl methacrylate PMMA 54 electroluminescence 54 pin BGA package 54 porous membrane 54 edge roughness LER 54 aspherical lens 54 silicon germanium SiGe BiCMOS 54 phosphide 54 #.#μm [002] 54 indium tin oxide 54 metallic alloys 54 x 7cm 54 integrated passives 54 nm wavelengths 54 nanosprings 54 thermoplastic injection molding 54 millimeter silicon wafers 54 femtosecond lasers 54 thulium 54 copper nanorods 54 FBGs 54 microdevice 54 ADMP# 54 tin Sn 54 silicon Mach Zehnder 54 crystalline silicon c 54 Strained silicon 54 dampens vibrations 54 quartz plates 54 MoS2 54 LDLS 54 ablates 54 ion implanters 54 GaN HEMTs 54 passivated 54 AquiVia 54 autoclavable 54 microelectronic devices 54 superparamagnetic 54 subwavelength 54 Nova NanoSEM 54 molecular sieve 54 silicon nitride 54 '# patent relates 54 copper electroplating 54 viscous fluids 54 silica nanoparticles 54 PVC CPVC 54 CMOS oscillators 54 polycarbonate resins 54 Cold Cathode Fluorescent Lamps 54 Control LACC 54 monodisperse 54 UV absorbance 54 thermochromic 54 Plexcore 54 millisecond annealing 54 CMOS circuitry 54 diffractive 54 HTS wires 54 xenon lamps 54 overmold 54 pipette tips 54 crosslinked 54 PCR PET 54 leadless 54 PIN diodes 54 birefringent 54 nanometer lithography 54 LightScribe discs 54 wire bondable 54 Soitec produces 54 planarity 54 CMOS RF CMOS 54 cadmium telluride CdTe 54 Epoxy resin 54 QuickCap NX 54 catalytic oxidation 54 InN 54 electrolyte salts 54 frits 54 transmissive 54 VGA TFT LCD 54 Ultem 54 Serdes 54 cell culturing 54 CCD detector 54 GaAs InP 54 Printhead 54 monolithic microwave integrated 54 resin impregnated 54 GaAs AlGaAs 54 nanochannel 54 sq. mm 54 polymer matrices 54 iCoupler 54 silicon oxynitride SiON 54 packaging WLP 54 Thulium 54 #nm #nm #nm 54 autofluorescence 54 #x# mm [004] 54 EUV masks 54 semipermeable 54 QFN packages 54 bilayers 54 VCSELs 54 ceramic substrate 54 aspheric optics 54 particle morphology 54 titania 54 UV ultraviolet 54 scanning electron microscope SEM 54 EVG# 54 EDXRF 54 laser scribing 54 aluminosilicate 54 HVOF 54 thermo plastic 54 hexagonal lattice 54 bistable 54 micromirror 54 peening 54 capacitive sensor 54 Gallium nitride 54 fluoropolymer tubing 54 photocatalyst 54 gallium nitride 54 Corporation Nasdaq KOPN 54 thermal decomposition 54 hydroxyapatite crystals 54 polymerized 54 sol gel 54 PolyMax 54 microcontact printing 54 intermetallic 54 indexable inserts 54 amorphous silicon TFT 54 Chromatic aberration 54 TMOS display 54 OP# [003] 54 quartz oscillators 54 TSMC #.#um 54 passivation 54 acrylic polymer 54 FBGA package 54 selective emitter 54 #nm lithography [002] 54 uPD# [001] 54 electron tunneling