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(Click for frequent words.) 72 mount inductors 70 C0G 68 solderable 68 SMT LEDs 67 surface mountable 66 QSOP 66 8mm x 8mm 66 radial leaded 65 pin SOIC package 64 4mm x 4mm QFN 64 overmolded 64 #.#mm x [003] 64 advanced leadframe 64 multilayer ceramic 64 BGA packages 64 vertical cavity 64 leadframe 63 subminiature 63 DFN# 63 TDFN 63 pin TDFN package 63 solder mask 63 2mm x 63 5mm x 5mm QFN 63 conductive epoxy 63 wire bondable 63 LQFP 63 wirewound resistors 63 3mm DFN 63 overmolding 63 cored wire 63 8 pin MSOP 63 QFN packages 63 4 x 4mm 63 pin TQFP 63 electroless nickel 63 SOIC package 63 capacitive touch sensors 63 resistive element 62 multilayer ceramic capacitors 62 solder reflow 62 mm BGA 62 3mm x 62 rigid substrate 62 TSSOP package 62 solder bumps 62 SOIC 8 62 microstrip 62 X7R 62 pin LQFP 62 ferrite core 62 5μm 62 pin SOIC 62 measuring #.#mm x [001] 62 #.#x#.#mm 62 hardcoat 62 thermally conductive 62 SO8 62 TSSOP# 62 tiny 3mm x 62 #.#in [004] 62 thermoform 62 6mm x 6mm 62 8 pin SOIC 62 PQFP 62 micromachined 62 photoconductive 62 emitting lasers VCSELs 62 PQFN 62 4mm x 4mm 62 TQFP packages 61 conductive coating 61 2mm x 3mm DFN 61 #.#um [001] 61 ZMD# 61 microlens array 61 mm diameters 61 leadframes 61 MLPQ package 61 #x# mm [003] 61 thermoplastic elastomer 61 wirewound 61 capacitive touch sensor 61 pin BGA 61 RoHs compliant 61 3 x 3mm 61 DFN packages 61 4mm thick 61 #μm [002] 61 LiNbO3 61 reflow soldering 61 pin TSSOP package 61 x 3mm 61 Silicon Nitride 61 extruded profiles 61 TSSOP 61 #.#mm x #.#mm [003] 61 TQFP 61 Scratch resistant 61 cordsets 61 feedthroughs 61 #L stainless steel 61 x 9mm 61 X7R dielectric 61 Ball Grid Array 61 pre preg 61 #x# mm QFN 60 5mm x 5mm 60 DIN rail mounting 60 fused quartz 60 QFPs 60 reflow oven 60 CONNECTORS 60 Flip Chip 60 5mm x 6mm 60 pin QFN 60 TGA# SL 60 AlGaAs 60 2μm 60 singlemode 60 UV VIS 60 reed switches 60 5mm x 60 x 6mm 60 stripline 60 PQFN package 60 silicone elastomers 60 pin 3mm x 60 flangeless 60 magnetostrictive 60 capacitance values 60 membrane switches 60 DIN rail mount 60 SSOP packages 60 MSOP package 60 TCXOs 60 TQFN package 60 crystal resonator 60 LFCSP 60 eutectic solder 60 APTIV film 60 mounting flange 60 VESA mounting 60 thermowell 60 SiGe bipolar 60 pin LQFP package 60 thermoelectric coolers 60 pin DIP 60 #x# mm [004] 59 pin BGA package 59 MSOP packages 59 PBGA 59 leadless package 59 UHMW 59 7 x 7mm 59 emitting lasers 59 axial leaded 59 #-#,# mm 59 AFM probes 59 wirebond 59 #AWG 59 QFN# 59 3mm x 3mm 59 photolithographic 59 photomultipliers 59 magnetically coupled 59 aluminum housings 59 dowel pins 59 nickel hydroxide 59 ferrite beads 59 #.#uF 59 8 pin TDFN 59 WL CSP package 59 backplane connectors 59 emitting laser VCSEL 59 reflow solder 59 varistors 59 2mm x 2mm 59 leadless 59 stainless steel housings 59 TQFP package 59 #/#-inch thick [001] 59 μm diameter 59 Sn Pb 59 weldable 59 selective soldering 59 anodised aluminum 59 piezo actuators 59 alumina ceramic 59 die bonders 59 AEC Q# qualified 59 metalized 59 x 5mm 59 conformal coating 59 RJ# connector 59 3mm x 3mm DFN 59 directional couplers 59 FCBGA package 59 SPDT switch 59 flex circuits 59 Schottky rectifiers 59 AlSiC 59 chipscale 59 epi wafers 59 pin TQFN 59 wave SAW 59 cermet 59 membrane keypads 59 injection molded polypropylene 59 SOT# package [001] 59 #x#mm [002] 59 TQFN 59 conductive adhesives 59 wafer dicing 59 laser diode modules 59 static dissipative 59 W mK 59 reflowed 59 PVD coating 59 capacitors inductors 59 pH electrode 59 TDFN package 59 thermo plastic 59 EXTreme 59 linear encoder 59 package SiP 59 poly crystalline 59 pin 4mm x 59 thermally enhanced 59 aluminum nitride 58 toolholders 58 SOT# [002] 58 density fiberboard 58 NEMA 4X enclosure 58 Vor ink 58 Elastomeric 58 wafer probing 58 Follow Vishay 58 TQFP# 58 carbide insert 58 PBGA package 58 absolute rotary encoders 58 subwavelength 58 mm dia 58 DFN package 58 thermoset composite 58 opto electrical 58 #μ 58 connectorized 58 5mm QFN package 58 conductive ink 58 Datamate 58 recessed downlight 58 QFN 58 rotary encoders 58 voltage divider 58 pin SOIC packages 58 UL#V 0 rated 58 LTPS TFT 58 fusion splice 58 6mm x 58 QFNs 58 LMX# 58 pH electrodes 58 #/#-in [001] 58 thermoplastic materials 58 ISL#M 58 polymer matrices 58 phototransistor 58 DIN rails 58 eutectic 58 piezoelectric ceramic 58 UV stabilized 58 across tantalum ceramic 58 indium phosphide InP 58 YAG lasers 58 Polyimide 58 aluminum heatsink 58 monolithically integrated 58 TO #AB 58 thermally enhanced TSSOP 58 SMA connectors 58 × #mm [002] 58 pin MLF 58 Z Foil 58 wetted parts 58 wafer bumping 58 mechanically fastened 58 OP# [003] 58 gallium indium arsenide 58 7mm x 7mm 58 #.#mm x #.#mm [002] 58 feedthrough 58 PWBs 58 pin PDIP 58 x 1mm 58 DirectFET MOSFET 58 Lynx2 58 1mm thick 58 3mm thick 58 UTP cables 58 variable resistor 58 TDFN packages 58 pin SOT 58 Thermocouple 58 resistive touch panels 58 matte tin 58 nanofilm 58 #x#mm [005] 58 interposer 58 fluorosilicone 58 Si substrate 58 3mm DFN package 58 nonpolar GaN 58 Co2 laser 58 injection moldable 58 7mm x 58 flange mount 58 GaAs MMIC 58 capacitances 58 QFN packaging 58 copper metallization 58 PolySwitch 58 #.#μm [001] 58 subrack 58 LQFP package 58 diecast aluminum 58 phototransistors 57 ultrasonic transducers 57 molded silicone 57 ADMP# 57 varying thicknesses 57 neodymium magnet 57 polyisocyanurate insulation 57 #.#mm diameter [002] 57 nonconductive 57 TiN 57 5kV 57 thermocouple 57 Powerful debug 57 di selenide CIGS 57 heat shrinkable tubing 57 reactive ion 57 pin TSSOP 57 inkjet printhead 57 diode arrays 57 Kalrez ® 57 rigid substrates 57 M# connectors 57 integrated circuits IC 57 solder alloys 57 ROHS compliant 57 chamfering 57 DIN rail mounted 57 pcb 57 #mm x #mm [005] 57 polysiloxane 57 #.#mm x #.#mm x [002] 57 planetary gearbox 57 ceramic substrate 57 #.#pF 57 sintered metal 57 MI #XM 57 piezoelectric actuators 57 #x#mm QFN 57 microcavity 57 thermally enhanced MSOP 57 stencil printer 57 #um [002] 57 TCXO 57 polymer coated 57 vibratory feeder 57 excellent solderability 57 metallization 57 #mm x #mm [002] 57 tiny 2mm x 57 triplexer 57 x #.#mm [005] 57 GaAs pHEMT 57 resists abrasion 57 dielectric strength 57 pushbutton switches 57 thermoelectric cooler 57 pin TQFN package 57 FD# [001] 57 radiused 57 cuvette 57 cone woofers 57 insert molding 57 solder bumping 57 thermoplastic elastomer TPE 57 Indium Tin Oxide 57 laminate substrate 57 pyrometer 57 beamsplitters 57 CAN transceiver 57 HV# [001] 57 Solamet ® 57 servo amplifier 57 metallurgically bonded 57 Signal Conditioner 57 SOI CMOS 57 InSb 57 VectorGuard 57 cordierite 57 LVDS interfaces 57 flexible screw conveyors 57 #μF [002] 57 indium gallium phosphide 57 compression molded 57 piezoresistive 57 passivation layer 57 Hastelloy C 57 reflow ovens 57 brazed 57 metallisation 57 aluminized steel 57 piezo actuator 57 thermowells 57 planar magnetics 57 chip resistors 57 Valox 57 heat shrinkable 57 ENIG 57 baseplate 57 aluminum electrolytic 57 TSSOP packages 57 OPTEK 57 bimetal 57 6 pin SOT 57 hardness testers 57 MR# [001] 57 silicon oxynitride 57 thermocouples 57 electroless copper 57 EMI RFI shielding 57 3mm x 3mm QFN 57 #.#μm CMOS 57 GaAs MESFET 57 spherical roller bearings 57 backside metallization 57 microvia 57 AVR microcontrollers 57 dielectric layer 57 chemically resistant 57 Kynar 57 3mm x 3mm x 57 Leadframe 57 optical comparators 57 CIGS Copper Indium 57 thicknesses ranging 57 HPLC columns 57 #mm diameter [001] 57 chip resistor 57 WL CSP 57 GaAs InP 57 multichip modules 57 circular connectors 57 3U rack mount 57 SnPb 57 photopolymer 57 underfill 56 liquid crystal polymer 56 #.#mm ² 56 multichip 56 axis CNC 56 SiT# 56 Lithium ions 56 pin MSOP 56 MLCCs 56 atomically smooth 56 Lightly flour 56 splined 56 accuracy repeatability 56 circuit MMIC 56 polyvinylidene fluoride PVDF 56 EPDM rubber 56 solder pastes 56 monolithic CMOS 56 gear reducers 56 oxide semiconductor 56 powerline modem 56 multipin 56 PIN photodiode 56 #.#x#.# 56 multilayer printed 56 shaft collars 56 ferrite bead 56 Land Grid Array 56 embedded passives 56 optically coupled 56 pin QFP 56 1μm 56 pin QFN package 56 pin TQFP packages 56 aluminum electrolytic capacitors 56 monolithic microwave integrated 56 cemented carbide 56 #.#kV [001] 56 #nm #nm [002] 56 6mm diameter 56 heat sealable 56 BJTs 56 nanoimprint lithography NIL 56 transparent conductive coatings 56 #.#um CMOS 56 QT# [001] 56 membrane keypad 56 pin PBGA 56 MwT 56 photoelectric sensor 56 decorative laminate 56 AirMax VS 56 diecutting 56 IR#S 56 Schottky diodes 56 etching DRIE 56 Electrovert 56 amorphous silicon Si 56 enhanced Raman scattering 56 micrometre scale 56 reflow temperatures 56 MicroFET 56 mux demux 56 anodising 56 inductive proximity 56 Pt# 56 inkjet inks 56 interchangeable modules 56 silicone gasket 56 inkjet printer cutters 56 Picogiga delivers advanced 56 Reflow 56 MICRO FOOT 56 electro galvanized 56 nano patterning 56 autoclavable 56 backshells 56 1W LED 56 electrically insulating 56 UL #V 0 56 #Ω [002] 56 aluminum fins 56 silicide 56 solder alloy 56 PEEK OPTIMA 56 passivating 56 conduction cooling 56 photocouplers 56 coated polyester 56 nanoporous 56 hafnium oxide 56 heat spreaders 56 shaft diameters 56 SMA connector 56 wave soldering 56 laminations 56 desoldering 56 micro machined 56 mating connector 56 leadless chip 56 inkjet printable 56 photodiode arrays 56 2mm x #.#mm 56 ferrites 56 4mm x 56 OptoCooler HV# 56 nickel plating 56 Coriolis meters 56 DDR3 DIMMs 56 μm thick 56 bandpass 56 microstructured 56 silicon nitride 56 Delrin ® 56 rollstock 56 TLP# 56 microfine 56 transistor arrays 56 encapsulant sheets 56 piezo ceramic 56 PEX tubing 56 EMIF# 56 brushless DC motors 56 XLR connectors 56 DIN rail mountable 56 #mm# [002] 56 knurled 56 PE# [001] 56 countersunk 56 low capacitance ESD 56 butyl rubber surround 56 tantalum capacitors 56 Thermally Conductive 56 magnetic encoders 56 tin Sn 56 optical encoder 56 ultraviolet curable 56 molybdenum disulfide 56 wave SAW filters 56 Ultra Miniature 56 mounting flanges 56 laser interferometer 56 #nm CMOS [002] 56 wave SAW filter 56 electro luminescent 56 PaxScan 56 S#E [001] 56 SOP Advance 56 fusion splicing 56 tantalum capacitor 56 UV curable ink 56 #mm x 56 MAX# MAX# [001] 56 enhanced Raman spectroscopy 56 gasketed 56 microvias 56 QFP package 56 EVG# 56 tantalum nitride 56 GaN wafers 56 copper heatpipes 56 Mosfets 56 titanium nitride 56 BNC connectors 56 Heatsink 56 antireflection 56 submerged arc welding 56 indium gallium 56 external EEPROM 56 coplanar 56 infrared emitters 56 NEMA Type 56 SMD LED 56 meltblown 56 Autodesk Alias Design 56 impedance matching 56 semiconductive 56 inch tweeter 56 iSPAN 56 LQFP# [001] 56 bonder 56 OPTIMASS 56 PIN diodes 56 LQFP# [002] 56 magnetic encoder 56 modular jacks 56 photoelectric sensors 56 inductive sensors 56 digitally programmable 56 machinable 56 UV coatings 56 nanostructured silicon 56 micron particle 56 solder paste printing 56 Leadless 55 Magnesium alloy 55 transmissive 55 strain gage 55 intake plenum 55 model A# 55 pin 5mm x 55 SiPs 55 piezo electric 55 PIN diode 55 density interconnect HDI 55 dual damascene 55 SN#C 55 stencil printing 55 micro fluidic 55 underlayments 55 conductive inks 55 ceramic capacitor 55 rugged IP# 55 InGaP HBT 55 injection molded parts 55 conductive adhesive 55 CMP polishing 55 NTC thermistor 55 handheld DMMs 55 D2PAK 55 μTCA 55 #μF [001] 55 microswitch 55 receptacle connectors 55 piezoelectric sensors 55 Zytel ® 55 DirectFET ® 55 through silicon vias 55 TVS Diodes 55 thermal dissipation 55 VGA TFT LCD 55 UV curing 55 reflow solderable 55 BGA CSP 55 emission wavelength 55 sensor actuator 55 6mm thick 55 extruded shapes 55 thermistor 55 magnetron sputtering 55 rotary actuators 55 cone woofer 55 ZnS 55 plate heat exchanger 55 capillary tube 55 varactors 55 SMD LEDs 55 fiberglass reinforced 55 coaxially 55 RF connectors 55 dielectric layers 55 Hastelloy ® 55 5V CMOS 55 XR#M# 55 PIR mile oval 55 TSOT 55 capacitive sensor 55 photodiode array 55 DirectFET 55 zirconium nitride 55 #pin [001] 55 BGA packaging 55 Stanyl ® 55 coextruded 55 #mm ² [001] 55 vibrating membrane 55 Resistive 55 conductively cooled 55 AdvancedMC module 55 countersink 55 liquid crystal polymers 55 glass frit 55 pinouts 55 nanopositioning stages 55 SiGe C 55 RF amplifier 55 micromirror 55 #.#μm CMOS process 55 polyethylene PEN 55 toroids 55 beryllium copper 55 busbar 55 multipole 55 prepreg materials 55 VCXO 55 AWG wires 55 shaft encoder 55 Cable Assemblies 55 NiPdAu 55 particle sizing 55 plasma etching 55 transmissivity 55 rotary actuator 55 laser annealing 55 polytetrafluoroethylene PTFE 55 Si TFT 55 silicon waveguide 55 monochromator 55 AST# 55 wafer prober 55 WLCSP 55 Schottky 55 RO# laminates 55 piezoceramic 55 electroplated 55 #mm diameter [002] 55 voltage dividers 55 singulated 55 lead LFCSP 55 ferritic 55 ballscrew 55 titanium carbide 55 IP# sealing 55 ultrasonic welding 55 SOT# [001] 55 PowerDI TM 55 KC# [002] 55 transparent conductive 55 Akulon 55 threaded fasteners 55 milliohm 55 thermal impedance 55 Rastek UV wide 55 nm CMOS process 55 indium gallium phosphide InGaP 55 thermally bonded 55 XLPE 55 ruggedly constructed 55 mm LFCSP 55 ferrite 55 mechanical polishing CMP 55 Serial EEPROMs 55 electrodeposition 55 dsPIC#F# 55 indium tin oxide ITO 55 SOIC packages 55 thinset mortar 55 microcapillary 55 2U rackmount 55 aspheric lenses 55 #/#-volt 55 displays TFT LCDs 55 ESD diodes 55 BGA package 55 mandrels 55 optical waveguides 55 thermally optimized 55 #.#mm x [002] 55 lightweight aluminum alloy 55 nitride semiconductor 55 servo amplifiers 55 plastic laminate 55 LED UV curing 55 silicon carbide ceramic 55 TDA# [001] 55 8mm diameter 55 flexo plates 55 1RU rack 55 MTP MPO 55 GaAs substrates 55 micromachining 55 thermoplastic rubber 55 syntactic foam 55 dielectrics 55 metallization pastes 55 CMOS transistors 55 chip inductors 55 triaxial 55 #m@#.# % [002] 55 ATtiny# 55 SMT 55 inductive sensor 55 DIN rail 55 HEMTs 55 BNC connector 55 substrate 55 cylinder bores 55 ± #V [001] 55 #um [001] 55 ohm cm 55 thermoformable 55 Laser VCSEL 55 stainless steel tubular 55 Linear Actuators 55 micron diameter 55 IP# waterproof 55 NiSi 55 #.#mm [002] 55 tensile modulus 55 heat spreader 55 polymer composite 55 urethane coated 55 varistor 55 HepcoMotion 55 hardfacing 55 linear encoders 55 lithium niobate 55 gearmotor 55 silicon oxynitride SiON 55 heatproof 55 Mountable 55 thermistors 55 transparent electrode 55 solder spheres 55 soleplate 55 polysulfone 55 Thermo Plastic 55 pin XLR 55 IP# NEMA 55 Rilsan ® 55 AUIRS#S 55 electroless nickel immersion 55 gallium arsenide gallium nitride 55 downlight 55 #VDC input 55 RF coaxial 55 polymer nanocomposite 55 soft dome tweeters 55 synchronous buck controller 55 Capacitive 55 overmold 55 PIN photodiodes 55 #x#x# mm [001] 55 polyvinyl butyral PVB 55 SAW resonator 55 coating thickness 55 multilayers 55 thyristor 55 #x#mm QFN package 55 MLCC capacitors 55 RapidRun 55 stereolithography SLA 55 fiber optic transceivers 55 amplifier modules 55 SOIC 55 nanocrystalline 55 XTreme Power ® XPH 55 Stocking distributor 55 ultrafiltration membrane 55 TB# [001] 55 rigid foam insulation 55 roofing shingle 55 QMEMS 55 OSTAR Compact 55 silicon substrates 55 antireflective coatings 55 SFP transceiver 55 braided stainless steel 55 micro electromechanical 55 HASL 55 silicon etch 55 polymer nanocomposites 55 nanotube arrays 55 organic TFTs 55 +# degrees Celsius [001] 55 flexographic plates 55 Position Sensors 55 picosecond lasers 55 #A #V [002] 54 hollow fiber 54 integrated passives 54 SOI substrates 54 sintered 54 chamfer 54 tack welded 54 latex caulk 54 electroless 54 coiler 54 Micrometer 54 Cree GaN 54 potentiometers 54 silanes 54 borosilicate 54 SOI MEMS 54 prepregs 54 SOT# package [002] 54 HMC# [001] 54 CNC machined aluminum 54 Attenuator 54 #x#mm [003] 54 GaAs PHEMT 54 Satin Nickel 54 thermoformed packaging 54 serdes 54 threaded inserts 54 ultrahigh purity 54 Inductors 54 thermoplastic biocomposite compounds 54 polyurethane adhesive 54 fluoropolymer 54 silicon photonic 54 linewidths 54 alloyed steel 54 Metrology System 54 pin TQFP package 54 PF# [002] 54 nanocubes 54 LED emitter 54 EMI shielding 54 zirconium oxide 54 Particulate Reactor TM 54 Stylistic ST# Tablet PC 54 #.#V 5V #V 54 precise tolerances 54 polydimethylsiloxane PDMS 54 extruded rubber 54 instrumentation amplifier 54 thermo mechanical 54 silicon germanium SiGe BiCMOS 54 RS# serial port 54 tweeter midrange 54 ADXL# 54 honeycomb pattern 54 polyurethane resin 54 3 mm DFN 54 pin QFN packages 54 Sitrans 54 collimators 54 electroluminescence EL 54 corrosion resistant stainless steel 54 solventless 54 nm VCSEL 54 x 2mm 54 photocoupler 54 joist girders 54 Anapurna M 54 liquid silicone rubbers 54 EMI Filters 54 Inductor 54 TOSA ROSA 54 metallizing 54 deflashing 54 austenitic stainless steel 54 #Vdc [003] 54 weatherable 54 weld bead 54 nonporous stain scratch 54 substrates