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(Click for frequent words.) 83 etching DRIE 71 silicon etching 65 LiNbO3 65 plasma etching 65 epi wafers 64 silicon etch 64 DRIE 63 micromachining 63 Novellus SABRE 63 submicron 63 deep silicon etch 63 photolithographic 63 electrodeposition 63 aluminum nitride 63 mask aligner 62 Deep Reactive Ion Etching 62 optical waveguides 62 indium phosphide InP 62 insulator wafers 62 silicon substrates 62 electron optics 62 overmolding 62 millisecond annealing 62 millisecond anneal 62 EVG# 62 ferrite core 62 wafer bonder 62 nano patterning 62 e beam lithography 62 microstructured 62 plasma etch 62 metallisation 61 nanofilm 61 sub micron 61 CMOS fabrication 61 sol gel 61 mask aligners 61 photoresist strip 61 Photolithography 61 DSi etch 61 conductive epoxy 61 #.#um [001] 61 focused ion beam 61 #nm #nm [002] 61 through silicon vias 61 micro machining 61 silicon waveguide 61 nanolithography 60 SiGe bipolar 60 fxP 60 AlGaAs 60 di selenide CIGS 60 C0G 60 electrochemically 60 piezo actuators 60 SOI CMOS 60 heterostructure 60 silicon germanium SiGe 60 furnaceware 60 Si substrates 60 titanium nitride 60 NiSi 60 silicide 60 Silicon Germanium 60 nanotube arrays 60 CdSe 60 microstrip 60 Si substrate 60 photoresists 60 sapphire substrate 60 epitaxially grown 60 silicon photonic 60 quantum cascade 60 thermo mechanical 60 silicon Si 60 dielectric layer 60 Deep Reactive Ion Etch 60 gate dielectrics 60 VUV 60 DEV DA TOMAR NEXT 60 EDXRF 60 CIGS solar cells 60 transparent conductive 60 Carbon nanotube 60 III nitride 60 microcavity 60 microchannels 59 CMOS transistors 59 SOI substrates 59 dielectric materials 59 electron beam lithography 59 hydride vapor phase 59 epitaxy HVPE 59 Micromorph 59 electron beam welding 59 epitaxy 59 high voltage BCDMOS 59 wafer bonding 59 DPN ® 59 nanoimprint 59 photolithography 59 Tetra Reticle Clean 59 silicon oxynitride 59 Airborne Particle Sensor 59 UV VIS 59 electrochemical deposition 59 AlGaN 59 microcavities 59 ellipsometry 59 polymer membrane 59 CMOS wafer 59 micromachined 59 GaN layers 59 layer deposition ALD 59 micromechanical 59 subwavelength 59 transparent conductive coatings 59 deep ultraviolet DUV 59 epiwafers 59 manganite 59 emitting lasers 59 silicate glass 59 atomic spectroscopy 59 Nova NanoSEM 59 metallization 59 magnetostrictive 59 YAG lasers 59 polymer matrices 59 magnetically coupled 59 transparent electrode 59 nanoimprint lithography NIL 59 phototransistors 59 carbide inserts 59 elastomeric seals 59 photoresist stripping 59 computational lithography 59 ceramic substrate 59 epitaxial deposition 59 semiconductive 59 piezoceramic 59 wafer metrology 59 eutectic 59 microcapillary 59 wafer thinning 59 #nm CMOS [002] 59 anodic 59 passivation 58 InGaN 58 mechanical polishing CMP 58 nanofabricated 58 collimators 58 nm CMOS process 58 dielectric etch 58 wafer dicing 58 rigid substrate 58 wirewound 58 Powerful debug 58 k dielectric 58 piezoelectric transducer 58 photodetectors 58 silica substrate 58 microfabrication techniques 58 X ray microanalysis 58 IGBT Insulated Gate 58 micro vias 58 indium gallium nitride InGaN 58 heterostructures 58 indium arsenide 58 CIGS solar cell 58 APTIV film 58 ZnS 58 triplexer 58 diffusion furnaces 58 optical metrology 58 colloidal silica 58 x ray optics 58 polymeric membrane 58 aligned carbon nanotubes 58 epitaxial 58 FEOL 58 pMOS 58 microchannel 58 WS CRDS 58 ultraviolet lasers 58 photonic bandgap 58 cuvette 58 solder reflow 58 electrically insulating 58 indium gallium arsenide InGaAs 58 conductive inks 58 magnetic bead 58 tunable optical 58 passivation layer 58 laser micromachining 58 semiconductor wafer 58 microwell plates 58 AFM cantilever 58 monolithically integrated 58 reed switches 58 CMOS IC 58 silicon micromachining 58 piezo actuator 58 electrospray 58 hollow fiber 58 low k dielectrics 58 extreme ultraviolet lithography 58 JENOPTIK GmbH 58 magnetron sputtering 58 micro fluidic 58 nanocrystalline 58 gallium selenide 58 DPSS laser 58 CIGS Copper Indium 58 overlay metrology 58 CRIUS 58 nanocubes 58 hermetic packaging 58 Oxide Silicon 58 GaN wafers 57 pipette tips 57 deflashing 57 transistor arrays 57 directional couplers 57 piezoelectric actuator 57 physical vapor deposition 57 dielectric layers 57 nanoporous 57 spiral inductors 57 RO membrane 57 Polycrystalline 57 solder bumps 57 mount SMT 57 Indium Phosphide 57 Transparent Conductive Oxide TCO 57 GaN wafer 57 #nm silicon 57 ultrafiltration membrane 57 carbon nanotube CNT 57 SWIR cameras 57 emission wavelength 57 ECPR 57 Hastelloy C 57 BiCMOS 57 NdFeB 57 optical coatings 57 GaAs GaN 57 GMAW 57 BEOL 57 resistive element 57 nitride semiconductor 57 copper metallization 57 pultrusion 57 Fiber Bragg Grating 57 indium gallium phosphide 57 PVD coating 57 silicon substrate 57 insert molding 57 opto electrical 57 organic TFTs 57 ultrafiltration membranes 57 electroless copper 57 carbide insert 57 TEM STEM 57 wafer probing 57 wafer uniformity 57 capillary electrophoresis 57 multilayers 57 solder bumping 57 nanotubes nanowires 57 OPTIMASS 57 electroformed 57 microlithography 57 AlGaN GaN 57 High Voltage CMOS 57 UV LEDs 57 NOxOUT 57 microfabrication 57 indium tin oxide ITO 57 submerged arc welding 57 porous membranes 57 5μm 57 indium phosphide 57 nanometric 57 #nm lithography [001] 57 cermet 57 microfabricated 57 Particulate Reactor TM 57 Insulator SOI 57 argon fluoride 57 insulator substrate 57 DPSS lasers 57 PolyMax 57 CMP slurries 57 cemented carbide 57 zinc selenide 57 nanopowder 57 photoresist 57 #nm laser [002] 57 Nd YAG 57 conductive polymer 57 toroid 57 oxide layer 57 macroporous 57 Nd YAG laser 57 nickel silicide 57 crystalline silicon c 57 SOI wafer 57 scintillator 57 CMOS circuits 57 dual damascene 57 polyvinyl butyral PVB 57 polymer electrolyte 57 nanowire arrays 57 amorphous silicon Si 57 doped silicon 57 Silicon Nitride 57 film transistors TFTs 57 nano porous 57 MEMS fabrication 57 TiN 57 Ziegler Natta 57 copper electroplating 57 nanoflow 57 imprint lithography 57 die bonders 57 DS DBR 57 pre preg 57 CIGS copper indium 57 zinc oxide ZnO 57 ZMD AG 57 MOS transistors 57 Solamet 57 PEDOT PSS 57 #.#um CMOS 57 Control LACC 57 RFCMOS 57 polymer membranes 57 QMEMS 57 Stanyl ® 57 chamfering 57 k gate dielectrics 57 mixed signal RFCMOS 57 nanostructured silicon 57 mesoporous 57 vapor deposition 57 nanometer silicon 57 X ray diffraction XRD 57 ultraviolet LEDs 57 gate electrode 56 antireflective coatings 56 cordierite 56 microstructures 56 monochromators 56 manufactures integrated circuits 56 UV NIL 56 ownership CoO 56 Absorption Spectroscopy 56 silicon nanowire 56 yttrium barium copper 56 tunable filters 56 insulating substrate 56 titania 56 Cavity Ring Down 56 nano imprint lithography 56 solder mask 56 transparent conductive oxide 56 ultrasonic vibration 56 MEMS resonators 56 femtosecond lasers 56 Solamet ® 56 polymeric membranes 56 across tantalum ceramic 56 MAX# integrates 56 thermoplastic polyester 56 thermally conductive 56 agarose 56 dielectrics 56 volume dielectric etch 56 Indium Phosphide InP 56 nanoparticle characterization 56 leadframe 56 gear reducers 56 optically pumped 56 multilayer ceramic 56 microfocus 56 electro static 56 micromorph 56 nanopores 56 BinOptics 56 supercritical fluid 56 ferrites 56 MOS transistor 56 Apogee Photonics 56 CMOS logic 56 nitriding 56 cored wire 56 quantum metrology 56 micromirror 56 zirconium oxide 56 voltage CMOS 56 rheometer 56 Bipolar CMOS DMOS BCD 56 polymer matrix 56 thermoplastic polyurethane TPU 56 Embedded Array 56 PIN photodiode 56 particle sizing 56 microlens array 56 laser diode module 56 cadmium zinc telluride 56 piezoelectric ceramic 56 bipolar transistors 56 InGaAs 56 epitaxial layer 56 nanoscale patterning 56 line BEOL 56 cone woofers 56 nm lithography 56 SOI MEMS 56 Gallium arsenide 56 microvia 56 Schottky barrier 56 SOI wafers 56 Nanofiltration 56 nanoimprinting 56 TDK EPC 56 metallization pastes 56 copper interconnects 56 #μm [002] 56 oxide semiconductor 56 planarization 56 silicon nitride 56 liquid crystal polymers 56 InSb 56 epitaxial wafers 56 pyrolytic 56 DongbuAnam 56 nMOS 56 photomultipliers 56 #.#μm CMOS process 56 vias 56 piezo ceramic 56 hardcoat 56 k dielectrics 56 #.#μm [002] 56 feedthroughs 56 SIMOX 56 polymer nanofibers 56 Solibro 56 pH electrode 56 ferrite beads 56 aqueous dispersion 56 CRIUS II 56 porous silicon 56 laser scribing 56 nanochannel 56 Vor ink 56 capacitive touch sensor 56 Czochralski 56 athermal 56 downconverter 56 electrochemical separations 56 μm diameter 56 silicon waveguides 56 thermoplastic elastomer 56 microtubes 56 bismuth telluride 56 integrated passives 56 Sigma fxP 56 nanostructuring 56 laser diode modules 56 thermoelectric coolers 56 optically coupled 56 rheology modifier 56 laminations 56 Mass Spectrometry MS 56 wafer bumping 56 engineered substrates 56 polymer substrates 56 photodetector 56 Jetrion R 56 darkfield 56 GaAs MESFET 56 ZnSe 56 X ray microscopy 56 microfluidic chips 56 Metrology System 56 photodiode 56 eWLB technology 56 1μm 56 nonpolar GaN 56 embedded nonvolatile memory 56 SiC substrates 56 HVPE 56 Silicon wafers 56 MI #XM 56 Victrex PEEK 56 interposers 56 sputter deposition 56 extrusion molding 56 AlN 56 microelectronic packaging 55 GaN LEDs 55 magnetic separators 55 GaAs substrates 55 MALDI TOF 55 defect densities 55 polymer fibers 55 HV CMOS 55 insulator SOI technology 55 thinner wafers 55 isobaric 55 linewidths 55 ultrathin layer 55 dopant 55 nanochannels 55 polyethylene fiber 55 Dip Pen Nanolithography ® 55 syntactic foam 55 NMR spectra 55 CVD etch 55 dielectrophoresis 55 nucleation layer 55 stripline 55 solder bump 55 pHEMT 55 brightfield 55 #μm thick [002] 55 conformal coatings 55 photonic components 55 microfluidic channels 55 tin Sn 55 polyvinylidene fluoride PVDF 55 GaN transistor 55 germanium substrates 55 Silicon Germanium SiGe 55 Gallium Nitride 55 #nm wavelength [001] 55 ultrashort pulse laser 55 Gallium Arsenide GaAs 55 planar magnetics 55 lamella 55 metallic nanostructures 55 BGA packaging 55 electroless 55 CMOS compatible 55 filtration reverse osmosis 55 Strained silicon 55 Planetary Reactor 55 CIGSe 55 sintered metal 55 capacitors inductors 55 #.# micron node 55 corrosive fluids 55 AquiVia 55 QCLs 55 2μm 55 FinFET 55 GxT 55 nano crystals 55 String Ribbon 55 hardfacing 55 substrate 55 industrial inkjet printing 55 fused quartz 55 monolithic CMOS 55 photoluminescence 55 Dektak 55 lithium niobate 55 UVTP 55 microporous 55 efficiency monocrystalline silicon 55 embedded DRAM eDRAM 55 infrared emitters 55 nano fabrication 55 Selective Laser Sintering SLS 55 coated polyester 55 CMOS oscillators 55 crystalline PV modules 55 photopolymer 55 Applied Baccini 55 geogrids 55 Orbitrap 55 diode laser 55 crossflow 55 passivating 55 diffractive optical elements 55 polymer composite 55 circuit MMIC 55 Alanod Solar 55 reverse osmosis membrane 55 CMP consumables 55 laser welding 55 multijunction solar cells 55 screw compressors 55 nucleic acid purification 55 strontium titanate 55 thermosetting resins 55 thermoelectric cooler 55 photomasks 55 TSMC #.#um 55 electroless nickel 55 monochromator 55 silicon wafer 55 hafnium oxide 55 Lithium ions 55 EUV masks 55 nanoliter 55 anneal 55 barium titanate 55 surface passivation 55 conformal coating 55 InGaP 55 carbon nanotubes CNT 55 Bragg grating 55 nonlinear optical 55 micrometer scale 55 Scanning Probe Microscopes 55 nanowire transistors 55 laser optics 55 CMOS processes 55 opto mechanical 55 extruded profiles 55 organic photovoltaics OPV 55 monocrystalline silicon wafers 55 polishing pads 55 resin infusion 55 indium gallium phosphide InGaP 55 bicomponent 55 CBT resin 55 nanoribbon 55 RO membranes 55 provides rewriteable NVM 55 microwires 55 AlN layer 55 Peregrine UltraCMOS 55 electro deposition 55 epitaxial layers 55 selective emitter 55 conductivities 55 #nm DRAM 55 perfluoroelastomer 55 CdTe Si 55 bipolar CMOS DMOS 55 5kV 55 gasketing 55 glass frit 55 MB#R# 55 Silicon Via 55 EDAX 55 amine scrubbing 55 Epitaxial 55 functionalizing 55 epitaxially 55 cadmium sulphide 55 Flip Chip 55 transformers inductors 55 MEMS resonator 55 GaP 55 ArF immersion lithography 55 Josephson junctions 55 absorption spectroscopy 55 transparent conductive electrodes 55 micro optics 55 intermetallic 55 SABRE 3D 55 Vistec Semiconductor Systems 55 microporous membranes 55 cryogenically cooled 55 MEMS microelectromechanical systems 55 semiconducting polymer 55 InGaP HBT 55 Surface Acoustic Wave 55 nanocages 55 photocatalysts 55 Calibre DFM 55 fluoropolymer 55 multilayer ceramic capacitors MLCC 55 picoliter droplets 55 etch deposition 55 gelation 55 gallium indium arsenide 55 PEDOT 55 monocrystalline silicon 55 electrochemical sensor 55 indium gallium arsenide 55 deburring 55 ceramic membranes 55 filament winding 54 sintered 54 Porvair Sciences 54 PIN photodiodes 54 fused silica 54 ion implantation 54 micromechanics 54 compressive stress 54 AIX #G# 54 molecular spectroscopy 54 degasser 54 micrometer sized 54 Chemical Vapor Deposition 54 XLPE 54 Schottky 54 thermal conduction 54 ultraviolet curable 54 surface texturing 54 nanoindentation 54 HEMT 54 laser ablation 54 conductive adhesive 54 biocompatible polymers 54 polysulfone 54 logic CMOS 54 ArF 54 hollow cylinders 54 radial leaded 54 PVD CVD 54 PANalytical 54 PIN diodes 54 zirconium nitride 54 HfO2 54 nanometer lithography 54 quantum cascade lasers 54 silicon PV modules 54 sub #nm CMOS 54 weldability 54 micropores 54 QRC Extraction 54 pipette tip 54 toolholder 54 Gallium Arsenide 54 VLSI circuits 54 aluminum gallium arsenide 54 microelectromechanical 54 silicon germanium 54 electrowinning 54 TSVs 54 conductive ink 54 frits 54 aluminum gallium nitride 54 Netzsch 54 Richard Brilla CNSE 54 heat shrinkable tubing 54 CIGS cells 54 strain gage 54 differential impedance 54 laser interferometer 54 JFET 54 HTS wires 54 #.# micron CMOS 54 XT #i 54 spectral imaging 54 inkjet printhead 54 underfill 54 Fourier transform infrared 54 nano coating 54 gas chromatographs 54 electrokinetic 54 Santur Corporation 54 eG ViaCoat 54 optical transceiver modules 54 Grätzel cells 54 pyroelectric 54 Nanorods 54 extruded sheet 54 NOxOUT SCR ® 54 piezo electric 54 plasma torches 54 iCoupler 54 polymerized 54 rigid substrates 54 wirebond 54 Joule heating 54 ultrasonic welding 54 deep submicron CMOS 54 pn junctions 54 #.#μm [001] 54 nanopatterning 54 parasitic extraction 54 ionomer 54 GaAs MMIC 54 interdigitated 54 metallic interconnects 54 Vistec Electron Beam 54 Cree GaN 54 PEX tubing 54 #.#μ 54 temporary wafer bonding 54 bond aligner 54 vapor compression 54 inkjet printing systems 54 liquid crystal polymer 54 block copolymer 54 electrospinning technique 54 polydimethylsiloxane PDMS 54 microreactor 54 agarose gel 54 triple quadrupole 54 Ultem 54 SAW oscillators 54 Ascentis Express 54 Tritan ™ 54 SOI silicon 54 flux cored wire 54 thermoset composites 54 molecular sieve 54 planar lightwave circuits 54 liquid chromatographs 54 microcrystalline 54 semiconducting materials 54 transmission electron microscopes 54 GTAW 54 bandgaps 54 Coriolis meters 54 polyphenylsulfone 54 SOI Silicon 54 vibrational spectroscopy 54 HDP CVD 54 Tracit Technologies Bernin 54 PECVD 54 5V CMOS 54 zinc sulfide 54 glacial acetic acid 54 crystalline Si 54 ChemetriQ 54 planar waveguide 54 CMOS circuitry 54 graphite furnace 54 ultrasonics 54 K dielectrics 54 polymerisation 54 ion beam 54 compression molding 54 optical spectroscopy 54 microwave integrated circuits 54 microelectronic components 54 CCD detector 54 ViSmart viscosity sensor 54 #nm #nm [005] 54 GaN layer 54 Wafer Level Camera 54 adhesive bonding 54 UV absorbance 54 emitting lasers VCSELs 54 scanning tunneling microscope STM 54 Structured eASIC 54 pin BGA packages 54 indium gallium 54 glass substrate 54 Diamon Fusion ® 54 PIN diode 54 Force Microscopy 54 #nm immersion 54 die bonder 54 conductive adhesives 54 aspheric optics 54 μm thick 54 immersion lithography 54 Silicon Oxide Nitride 54 Imec performs world 54 Raman spectrometer 54 Picogiga 54 copper indium diselenide 54 #nm immersion lithography 54 peristaltic pumps 54 picosecond lasers 54 microvias 54 micro electromechanical 54 diodes LEDs 54 microelectromechanical system 54 nanofilms 54 FE SEM 54 inorganic nanostructures 54 polariton 54 SiT# 54 VICTREX PEEK polymer 54 Imprio 54 chalcogenide glass 54 encapsulant 54 spectroscopic methods 54 advanced leadframe 54 stencil printing 54 emitting laser VCSEL 54 UV lasers 54 carbon adsorption 54 graphite oxide 54 Complementary Metal Oxide Semiconductor 54 voltage divider 54 microreactors 54 silica spheres 54 ultrasonic transducers 54 bioelectronic 54 Sensonor 54 multijunction 54 multicrystalline solar cells 54 Alchimer 54 carbides 54 stereolithography SLA 54 polymer nanocomposite 54 nanomechanical devices 54 maskless lithography 54 optical waveguide 54 ultrapure 54 supercritical fluids 54 cathodic 54 thermoelectric cooling 54 LPCVD 54 Valox 54 EO polymer 54 laterally diffused metal 54 UHPLC 54 spectroscopic techniques 54 wavelength ultraviolet 54 aluminum arsenide 54 Aixtron MOCVD 54 gallium arsenide gallium nitride 54 HPLC columns 54 heterojunction 54 FineSim Pro 54 DualBeam 54 thermally activated 54 RFID inlay 54 solder spheres 54 nanofluidic 54 piezoresistive 54 GaN HEMTs 54 dielectric 54 oxynitride 54 polycrystalline 54 micron 54 de ionized 54 interfacial layer 54 self assembled monolayer 54 silicon germanium SiGe BiCMOS 54 microelectromechanical systems MEMS 54 HfSiON 54 MgB2 54 liquid chromatography LC 54 diffractive 54 vacuum furnace 54 nanometal 54 INTRINSIC 54 ultrasonic vibrations 54 solution processible 54 polyamides 54 capacitive touch sensing 54 optofluidic 54 Focused Ion Beam 54 hetero junction 54 laser scanning confocal 54 micropumps 54 singulation 54 #/#-in [001] 54 low k dielectric 54 electrically conducting 54 workcell 54 vertical cavity 54 VECTOR Express 54 #.#μm CMOS 54 carbon nanomaterial 54 UV LED 54 cuvettes 54 electrolyte membranes 54 EUV mask 54 lithography 54 superconducting qubit 54 emission spectrometry 53 millimeter silicon wafers 53 StarRC Custom 53 nano structured 53 Immersion Lithography 53 thermoplastic TPV 53 microscopy techniques 53 cadmium chloride 53 mount inductors 53 CyberDisplay #K 53 titanium carbide 53 CMOS RF CMOS 53 GaAs InP 53 photovoltaic PV module 53 MALDI 53 Aluminum Nitride 53 nonmagnetic 53 micrometre 53 MWNT 53 DiCon 53 BGA packages 53 diffraction gratings 53 flexible substrates 53 polycrystalline diamond 53 filter housings 53 GaAs substrate 53 thinned wafers 53 infrared laser beams 53 wirewound resistors 53 Sequans SQN# 53 millimeter mm 53 silicon nitride ceramic 53 GaAs solar