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(Click for frequent words.) 63 SiC substrates 62 hafnium oxide 61 dielectric materials 60 wafer dicing 60 Laser diodes 59 mechanical polishing CMP 59 antireflective coatings 59 indium tin oxide ITO 59 micro machining 59 magnetron sputtering 59 metallization 58 thermo mechanical 58 AquiVia 58 metallisation 58 Si substrates 58 #μm [002] 58 photoresists 58 CIGS solar cells 58 sapphire substrate 58 epitaxial layer 58 epiwafers 58 UVTP 58 nitride semiconductor 58 silicone elastomers 58 planarization 58 Opti Probe 58 epitaxy HVPE 58 gate dielectrics 57 UNCD 57 CMOS silicon 57 AlN 57 epitaxial 57 silicon substrates 57 AFM probes 57 overmolding 57 subwavelength 57 epitaxial deposition 57 nanometric 57 #.# micron node 57 silicide 57 GaN wafer 57 laser diode modules 57 PEEK OPTIMA 57 K dielectrics 57 k gate dielectrics 57 dopant 57 SiC wafers 57 DSSCs 57 HVPE 57 optical coatings 57 nitride 57 nanostructuring 57 thermal conduction 57 monodisperse 57 CMP consumables 57 nanopowders 57 monocrystalline silicon 57 LiNbO3 57 PEALD 57 CMOS fabrication 57 inkjet inks 57 aluminum nitride 57 plasma etching 57 PVD coating 57 DPSS lasers 57 x ray optics 57 Schottky 57 monolithically integrated 57 InGaN 57 optical waveguides 56 nano imprint 56 nonlinear optical 56 plasma etch 56 GaN LEDs 56 nanocrystalline 56 Aerosol Jet 56 epi wafers 56 wafer bonder 56 GaN wafers 56 Cadmium Telluride CdTe 56 dielectrics 56 photolithographic techniques 56 epitaxy 56 GaAs MESFET 56 electroless nickel 56 k dielectric 56 quantum cascade 56 transparent electrode 56 nano crystals 56 UNCD Horizon 56 UV lasers 56 layer deposition ALD 56 MESFET 56 Micromorph 56 APTIV film 56 SOI substrates 56 femtosecond lasers 56 FD SOI 56 CMOS transistors 56 HfO2 56 planar transistors 56 inkjet printhead 56 III nitride 56 patented etch 56 linewidths 56 nanotube arrays 56 thinner wafers 56 solder bumping 55 composite resins 55 film transistors TFTs 55 silicon nitride 55 WLCSP 55 SOI CMOS 55 nano coatings 55 metallic nanostructures 55 SiC 55 antireflective coating 55 sp3 Diamond Technologies 55 nanoimprinting 55 YAG lasers 55 carbon nanotube CNT 55 nanoporous 55 MOS transistor 55 nickel silicide 55 millisecond anneal 55 MOS transistors 55 microcavities 55 ZnSe 55 nanofilm 55 Buried Wordline technology 55 piezo ceramic 55 threshold voltages 55 selective emitter 55 crystallinity 55 ferrite core 55 Lumiramic phosphor technology 55 conductive pastes 55 hydride vapor phase 55 fused quartz 55 Dektak 55 thermally activated 55 SWIR cameras 55 reed switches 55 micromachining 55 tunable filters 55 transparent conductive coatings 55 lithographic techniques 55 RF transistors 55 copper metallization 55 AlSiC 55 SOI wafers 55 amorphous silicon Si 55 epitaxial silicon 55 Gallium Arsenide GaAs 55 MEMS resonators 55 silicon PV modules 55 Gallium Arsenide 55 defectivity 55 QMEMS 55 #nm CMOS [002] 55 deep sub micron 55 photomultipliers 55 CRIUS 55 extruded profiles 55 indium gallium phosphide InGaP 55 #um [002] 55 AlGaAs 55 phototransistors 55 crystalline silicon c 55 insulator substrate 55 nanoimprint 55 SiON 55 HBLEDs 55 Gallium arsenide 55 amorphous silicon solar panels 55 wafer thickness 55 nanotubes nanowires 55 low k dielectrics 55 ZnS 55 TFTs 55 CIGS solar panels 54 tantalum capacitors 54 nanoparticle inks 54 CIGS photovoltaic 54 ZnO nanowires 54 silicon germanium SiGe 54 patterning technique 54 epitaxial structures 54 polymer electrolyte 54 encapsulants 54 Chemical Vapor Deposition CVD 54 crystalline semiconductors 54 semiconductor nanocrystal 54 InnerArmor 54 wirewound 54 SMS NIL 54 electrically insulating 54 dielectric layers 54 photoresist 54 FUSI 54 Rapid prototyping 54 Silicon Carbide SiC 54 SiTime 54 furnaceware 54 nanometers nm 54 zinc oxide ZnO 54 Si substrate 54 mono crystalline 54 #.#μm [002] 54 laser micromachining 54 extreme ultraviolet lithography 54 silicon germanium SiGe BiCMOS 54 NiSi 54 laser annealing 54 photolithography 54 silicon dioxide SiO2 54 PHEMT 54 GaN substrates 54 .# micron 54 multicrystalline solar cells 54 photoconductive 54 Aixtron MOCVD 54 manganite 54 #.#um [001] 54 HBLED 54 Transparent Conductive Oxide TCO 54 AlGaInP 54 Copper Indium Gallium Selenide 54 CellMath IP 54 SOI wafer 54 Epitaxial 54 microstructured 54 mask aligners 54 inorganic semiconductors 54 electron optics 54 polycrystalline diamond 54 e beam lithography 54 organic photovoltaic OPV 54 GaN layers 54 photocatalysts 54 encapsulant 54 nonpolar GaN 54 copper interconnects 54 microfabrication 54 LTPS 54 dielectric etch 54 gate electrode 54 JFET 54 SWCNT 54 nanocomposite material 54 CdSe 54 micro optics 54 Silicon Germanium 54 SOFC stacks 54 CIGS solar cell 54 pHEMT 54 #nm #nm [002] 54 SOI MEMS 54 imprint lithography 54 nMOS 54 silicon nitride ceramic 54 BEOL 54 Photolithography 54 gate dielectric 54 Day4 Electrode 54 microcavity 54 ultrasonic spray 54 multicrystalline 54 polymer membrane 54 silicon nanoparticles 54 C0G 54 nanometer node 54 microfocus 54 heterostructures 54 organic TFTs 54 Silicon Nitride 54 nanocoatings 54 Raman lasers 54 X ray microscopy 53 semiconducting properties 53 defoaming 53 epiwafer 53 polishing pads 53 ultrananocrystalline diamond 53 gallium nitride 53 UV NIL 53 electron beam welding 53 TFT backplanes 53 dual damascene 53 #.#μ 53 #nm #nm [005] 53 dielectric layer 53 solder bump 53 nanoelectronic devices 53 reactive ion 53 ceramic membranes 53 THz frequencies 53 AlGaN 53 nanofilms 53 TFPV 53 photolithographic 53 BrightLase 53 aspheric lens 53 tunable optical 53 Microfluidic devices 53 PEDOT PSS 53 SiT# 53 Grätzel cells 53 Tungsten carbide 53 Vertical Cavity Surface Emitting 53 Gallium Nitride 53 Nd YAG 53 polymer OLEDs 53 surface functionalization 53 electrodeposition 53 OptoCooler 53 ellipsometry 53 CIGS solar 53 bistable 53 ion implanters 53 silicon Si 53 Si wafers 53 heterogeneous catalysts 53 gasketing 53 LSA#A 53 outcoupling 53 transistor arrays 53 submicron 53 silicon oxynitride SiON 53 inkjet printing systems 53 transparent conductive 53 AFMs 53 laser diode module 53 hardfacing 53 mesoporous 53 NaDiaProbes 53 Amorphous Silicon 53 picoliter 53 line BEOL 53 semiconductor nanocrystals 53 pyrogenic silica 53 silicon carbide substrates 53 carbon nanotubes CNT 53 crystalline Si 53 ion milling 53 subnanometer 53 metallizing 53 silicon etch 53 GaAs substrates 53 superabrasive 53 semiconductive 53 nanocages 53 conformal coatings 53 SiC Schottky diodes 53 VCSELs 53 ferrite 53 Synopsys DFM 53 InN 53 CIGS cells 53 nanocrystalline diamond 53 tin Sn 53 LTPS TFT 53 transparent electrodes 53 nanostructured silicon 53 chemical vapor deposition 53 zinc selenide 53 poly crystalline 53 Evergreen Solar panels 53 colloidal silica 53 lithium niobate 53 organic photovoltaics 53 bicomponent 53 ALTUS Max 53 millimeter silicon wafers 53 CMOS compatible 53 #nm lithography [001] 53 conductive inks 53 VUV 53 pore sizes 53 calcium fluoride 53 tin oxide 53 JFETs 53 magnetostrictive 53 glass frit 53 solution processible 53 aspheric lenses 53 FEOL 53 conductive plastics 53 conductivities 53 gallium nitride GaN 53 nm wavelengths 53 polycrystalline 53 dielectric 53 Silicon wafers 53 sapphire wafers 53 piezo actuators 53 DPSS laser 52 photonic devices 52 SiO 2 52 mono crystalline silicon 52 PolyJet Matrix TM 52 ultrafast laser 52 pMOS 52 polymer substrate 52 ceramic capacitor 52 conductive coatings 52 photonic crystal fibers 52 Indium Tin Oxide 52 SkyTrough 52 centrotherm 52 ferro electric 52 3Xnm 52 #nm silicon 52 String Ribbon 52 UV curable ink 52 planarity 52 silicon carbide wafers 52 vapor deposition 52 2Xnm 52 GaAs GaN 52 indium gallium nitride InGaN 52 monosilane 52 SiC MOSFET 52 X7R 52 solar PV module 52 nanostructured surfaces 52 micrometer thick 52 TrenchFET 52 1μm 52 photonic lattice 52 nanofabrication techniques 52 transparent conductive electrodes 52 micromachined 52 aligned carbon nanotubes 52 copper indium gallium diselenide 52 emission wavelength 52 etch deposition 52 wafer bonding 52 Thin Film Transistor 52 Strained silicon 52 silicon waveguide 52 CyberDisplay #K 52 Alchimer 52 ZnO 52 barium titanate 52 picosecond lasers 52 poly Si 52 indium phosphide 52 millisecond annealing 52 germanium substrates 52 Indium Phosphide 52 silicon photovoltaics 52 HfSiON 52 leakage currents 52 mask aligner 52 PECVD 52 CIS CIGS 52 transmissivity 52 UHMW PE 52 CMOS imager 52 Cadmium Telluride 52 argon fluoride 52 amorphous silicon alloy 52 passivating 52 GaN 52 Powerful debug 52 CdTe Si 52 MAX# integrates 52 OTFT 52 amorphous silicon TFT 52 through silicon vias 52 microporous 52 varactors 52 flexible substrates 52 Solamet 52 computational lithography 52 CMOS wafer 52 nano patterning 52 nanowire transistors 52 photopolymers 52 GaN transistors 52 electroformed 52 liquid crystalline 52 Selective Laser Sintering SLS 52 PaxScan 52 ArF immersion lithography 52 CdTe PV 52 Esatto Technology 52 light emitting diodes LED 52 nanometric films 52 ownership CoO 52 crystalline silicon wafers 52 deep silicon etch 52 QCLs 52 μm 52 Electrografting 52 CMP slurries 52 silicon nanowire 52 boron nitride 52 backsheet component 52 k gate dielectric 52 Photoresist 52 EO polymer 52 VECTOR Express 52 #um [001] 52 microtubes 52 epitaxial layers 52 physical vapor deposition 52 MicroLens 52 Victrex PEEK 52 bismuth telluride 52 inorganic LEDs 52 photovoltaic module 52 capacitances 52 PVD CVD 52 ArF 52 photoluminescence 52 NdFeB 52 EUV masks 52 planar CMOS 52 projected capacitive touch 52 ECPR 52 oxide semiconductor 52 #nm wavelengths 52 LPCVD 52 MEMS oscillator 52 high-k/metal-gate 52 indium phosphide InP 52 particle sizing 52 sputter deposition 52 AlN substrates 52 DongbuAnam 52 Imec performs world 52 polymer substrates 52 xenon lamp 52 indium tin oxide 52 collimating 52 metallization pastes 52 Silicon Carbide 52 CIGSe 52 GaN HEMTs 52 Laser MicroJet 52 CIGS copper indium 52 toroids 52 Solamet ® 52 electron emitters 52 Amorphous silicon 52 Inkjet printing 52 CMOS RF CMOS 51 cadmium telluride thin 51 #nm geometries 51 SFP + transceivers 51 carbon nanofibers 51 semiconducting nanowires 51 GaN LED 51 2G HTS wire 51 microelectronic components 51 CIGS panels 51 DiCon 51 PLED 51 electroforming 51 HEMTs 51 Ge substrates 51 SiGen 51 micromirror 51 fxP 51 SAW oscillators 51 Schottky diode 51 manufactures integrated circuits 51 XT #i 51 Bipolar CMOS DMOS BCD 51 doped silicon 51 Nova NanoSEM 51 laminating adhesives 51 cadmium telluride semiconductor 51 embedded SerDes 51 cathode materials 51 singlemode 51 UV curable inks 51 NGPs 51 pin TSSOP package 51 Stratasys FDM 51 epitaxial wafers 51 polymeric membranes 51 deep submicron 51 MEMS oscillators 51 #nm node [001] 51 HEMT 51 fused silica 51 porous membranes 51 InGaP 51 AIX #G# 51 pulsed laser deposition 51 nanofluidics 51 PV laminates 51 microlithography 51 deep ultraviolet DUV 51 multijunction solar cells 51 pre preg 51 scintillator 51 multimode fibers 51 heterostructure 51 purity silicon 51 dopants 51 ZMDI 51 diffraction gratings 51 thermally conductive 51 nanosilicon 51 AlGaN GaN 51 sub micron 51 #.#μm [001] 51 photomask inspection 51 TMOS display 51 parasitic capacitance 51 metallic foils 51 zirconium oxide 51 color CMYK 51 HKMG technology 51 SiGe bipolar 51 thermoplastic elastomers 51 accuracy repeatability 51 Gallium nitride 51 backside metallization 51 antireflection 51 LED emitter 51 optically transparent 51 QFN packaging 51 crystalline PV modules 51 conformal coating 51 titanium carbide 51 UltraCMOS 51 nano composites 51 nanocrystal 51 #nm immersion 51 microelectronic packaging 51 Tungsten Carbide 51 carbides 51 Co2 laser 51 TiN 51 microstrip 51 UV LEDs 51 rheology modifier 51 DFM DFY 51 laser scribing 51 stripline 51 ion implantation 51 DEV DA TOMAR NEXT 51 laser diodes 51 picoliter droplets 51 photoelectrochemical 51 polyamides 51 nanochannels 51 sol gel 51 microfabrication techniques 51 FinFET 51 phosphors 51 spectral imaging 51 THz radiation 51 semiconductor fabs 51 bipolar CMOS DMOS 51 specialty surfactants 51 photoresist stripping 51 superabrasives 51 W mK 51 GaAs substrate 51 etching DRIE 51 passivation 51 nanopatterns 51 nanoantenna 51 ultrasonic welding 51 laser welding 51 boron carbide 51 ACPL K# 51 Semiconducting 51 metalcutting 51 Light Emitting Diodes LEDs 51 inertial MEMS 51 PBGA package 51 gallium selenide 51 wirebond 51 substrate 51 diffractive optical elements 51 micromorph ® 51 On Insulator SOI 51 passivation layers 51 diode laser 51 upon CIGS thin 51 xenon lamps 51 Boron Nitride 51 photopolymer 51 ThermaVolt II 51 dielectric constant 51 emitting lasers 51 tunable RF 51 Field Effect Transistors 51 tribological 51 Aera2 51 Plasmonic 51 silicone elastomer 51 advanced leadframe 51 atomically smooth 51 mount inductors 51 indium gallium arsenide 51 #nm DRAM 51 collimators 51 QFN packages 51 Photonic crystals 51 nanometal 51 Airborne Particle Sensor 51 ultraviolet lasers 51 nanosize 51 wavelength lasers 51 TGA# SL 51 breakdown voltages 51 Gildas Sorin CEO 51 aspheric 51 #nm laser [002] 51 nanometer lithography 51 silanes 51 brightness LED 51 pin TDFN package 51 optically coupled 51 silicon photovoltaic modules 51 patented BEMA 51 MI #XM 51 graphene transistors 51 aqueous dispersion 51 OLED microdisplay 51 cuprous oxide 51 bismuth ferrite 51 conductive polymer 51 Parylene 51 laminations 51 ion traps 51 quantum dot lasers 51 Novaled PIN OLED 51 ProFire Excel 51 2μm 51 crystalline solar panels 51 coplanar 51 silica spheres 51 semiconducting materials 51 photonic bandgap 51 quantum cascade lasers 51 parasitic inductance 51 solder pastes 51 5μm 51 FeRAM 51 High Voltage CMOS 51 Micromorph ® 51 CdTe thin film 50 crystal resonator 50 microcrystalline silicon 50 Laser VCSEL 50 CIGS PV 50 borosilicate glass 50 MWNT 50 PEDOT 50 dimensional nanostructures 50 CIGS CdTe 50 photodetectors 50 #μm thick [002] 50 thermal conductivities 50 GaN substrate 50 deflashing 50 copper electroplating 50 micron 50 crystalline silicon photovoltaic 50 di selenide CIGS 50 metallic inks 50 chipscale 50 #nm #nm #nm 50 extreme ultra violet 50 bipolar transistors 50 custom ASICs 50 bandgaps 50 lattice mismatch 50 TSV metallization 50 gallium arsenide gallium nitride 50 rigid polyurethane foam 50 multilayers 50 #.# micron CMOS 50 OptiChem 50 Macrotron 50 PolyMax 50 #.#μm CMOS process 50 Mosfets 50 low k dielectric 50 Silicon CMOS Photonics 50 nanoarrays 50 SO8 50 rigid substrate 50 PIN diodes 50 immersion lithography 50 capacitance values 50 parabolic trough solar 50 PIN diode 50 underfill 50 organic photovoltaics OPV 50 wavelength tunability 50 Zenasis 50 surface texturing 50 toner adhesion 50 WiCkeD 50 5mm x 6mm 50 ViSmart viscosity sensor 50 CMP slurry 50 BGA packages 50 CMOS MEMS 50 hermetic packaging 50 silicon carbide 50 μm diameter 50 linearization 50 analog ICs 50 metallic interconnects 50 microscopy techniques 50 Double Patterning 50 dielectric breakdown 50 metallic nanoparticles 50 #nm/#nm 50 leadframes 50 engineered substrates 50 PenTile 50 ferroelectricity 50 silicon 50 VCSEL 50 titania 50 Carbon nanotube 50 Control LACC 50 transparent conductive films 50 Thin Film Transistors 50 epitaxial graphene 50 laser diode 50 FinFETs 50 #nm nodes 50 flexo printing 50 nanostructure 50 nanocrystalline silicon 50 violet laser 50 optical spectroscopy 50 solution processable 50 nanomembranes 50 mount SMT 50 eG ViaCoat 50 ion implant 50 microchannel plate 50 OptiMOS 50 μm thick 50 Flex OneNAND 50 AMOLEDs 50 NanoBridge 50 wafer metrology 50 zirconia 50 microtechnologies 50 GaAs gallium arsenide 50 GaAs HBT 50 nanofibre 50 cubic boron nitride 50 silicon oxynitride 50 diffractive optics 50 EVG# 50 ultraviolet LEDs 50 EMCCD 50 indium gallium nitride 50 InGaP HBT 50 Elpida #nm 50 5V CMOS 50 CMOS logic 50 nm CMOS process 50 optical lithography 50 micrometre scale 50 wide bandgap 50 UV LED 50 AlN layer 50 diodes LEDs 50 GaN HEMT 50 copper indium gallium selenide 50 XLR #i 50 microfluidic devices 50 nanodiamond 50 Strained Silicon 50 SOI silicon 50 CIGS Copper Indium 50 FineSim SPICE 50 polariton 50 moldability 50 nanochannel 50 amorphous Si 50 bandgap 50 titanium sapphire 50 photon beams 50 nanoimprint lithography NIL 50 sSOI 50 stereolithography 50 sintering 50 pulsed lasers 50 photonic crystal fiber 50 GaAs pHEMT 50 glass substrates 50 micropores 50 semiconductor nanostructures 50 #nm laser [001] 50 quantum capacitance 50 biaxial 50 sintered 50 metal oxide nanoparticles 50 microelectromechanical 50 fluorescence excitation 50 #μm [001] 50 3mm x 50 CIGSolar ™ 50 silicon microdisplays 50 #nm immersion lithography 50 finely dispersed 50 brightfield 50 extrusion coating 50 UV VIS 50 smaller geometries 50 #nm wavelength [002] 50 nanocomposite materials 50 Uni Solar Ovonic 50 dichroic 50 self assembled monolayers 50 JENOPTIK GmbH 50 nickel hydroxide 50 stereolithography SLA 50 monocrystalline polycrystalline 50 Josephson junction 50 M3D 50 conductive epoxy 50 copper indium diselenide 50 nanobelts 50 oxynitride 50 backside illumination BSI 50 Flip Chip 50 industrial inkjet printing 50 TDFN package 50 fused deposition 50 silicone carbide 50 Schottky diodes 50 photothermal 50 carbon nanotube arrays 50 #.#x#.#mm 50 #.#um [002] 50 lithographic processes 50 serdes 50 PMOLED 50 TrueFocus 50 thermal inkjet 50 UCC# 50 MB#R# 50 passive matrix OLEDs 50 Structured ASICs 50 monocrystalline wafers 50 Stanyl ® 50 undoped 50 diameter wafers 50 thermoplastic TPV 50 pellicle 50 nanowire arrays 50 HgCdTe 50 electrowetting displays 50 brightness light emitting 50 Kilopass XPM 50 hollow fiber 49 Beamline #.#.# 49 SiO2 49 electroless copper 49 UV absorbance 49 volume dielectric etch 49 transistor HEMT 49 multicrystalline silicon 49 interdigitated 49 slurries 49 GNRs 49 Josephson junctions 49 antimonide 49 Osram Opto 49 #nm SoC 49 nematic 49 polycrystalline solar 49 kerf 49 electroluminescence EL 49 Aerogels 49 silicon carbide SiC 49 BCDMOS 49 silane gas 49 CVD etch 49 #.#u 49 vertical cavity 49 HTPS panels 49 silicon MEMS 49 multilayer 49 antireflective 49 rectifier diode 49 lenticular printing 49 spectroscopic methods 49 solder bumps 49 amorphous silicon