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(Click for frequent words.) 71 solder bumping 69 copper metallization 67 conductive epoxy 66 metallisation 65 wirebond 65 magnesium fluoride 65 zirconium oxide 64 dielectric layers 64 silicide 64 silica spheres 64 solder bumps 64 oxide nanoparticles 64 dual damascene 64 leadframes 64 integrated passives 63 Powerful debug 63 low k dielectrics 63 electroless copper 63 Si substrate 63 Tungsten carbide 63 #.#um [001] 62 wafer dicing 62 phototransistors 62 #nm CMOS [002] 62 BEOL 62 planarization 61 5μm 61 rigid substrate 61 metallization 61 electroless 61 SiC substrates 61 silicon substrates 61 eutectic 61 Sigma fxP 61 planarity 61 epi wafers 61 ownership CoO 61 TiN 61 k dielectric 61 nanometric 61 microcrystalline 60 solderable 60 CMOS silicon 60 ENIG 60 intermetallic 60 sapphire substrate 60 LiNbO3 60 hafnium oxide 60 LSA#A 60 palladium Pd 60 #nm immersion lithography 60 niobium oxide 60 crystallinity 60 1μm 60 electroplated 60 photomultipliers 60 zinc selenide 60 fused quartz 60 ZnS 60 .# micron 60 backside metallization 60 wafer thickness 60 laser annealing 60 insulator SOI technology 60 microvia 60 mechanical polishing CMP 59 5V CMOS 59 imprint lithography 59 aluminum nitride 59 k gate dielectric 59 through silicon vias 59 FinFET 59 K dielectrics 59 piezo ceramic 59 package SiP 59 photolithographic 59 silicon oxynitride 59 electrodeposition 59 ZrO 2 59 QMEMS 59 oxide semiconductor 59 SOI CMOS 59 defect densities 59 #.# micron node 59 epitaxial wafers 59 electro deposition 59 cadmium sulfide 59 QFPs 59 reticles 59 #um [002] 59 microcavity 59 micromachined 59 coplanarity 59 GaAs substrates 59 CMOS wafers 59 copper interconnects 59 electroless nickel 59 dielectric etch 59 nanocrystalline 59 gate dielectrics 59 SAW oscillators 59 wafer bumping 59 2Xnm 59 heterostructure 59 VECTOR Express 59 wire bonder 59 silicon 59 passivation layers 59 PVD coated 59 gallium phosphide 59 SiC wafers 59 UV lasers 59 ferritic 59 PEEK OPTIMA 59 3Xnm 59 #.#μm CMOS 59 conductive adhesives 59 optical waveguides 59 semiconductive 58 dielectrics 58 SiO 2 58 Photolithography 58 x 9mm 58 #.# micron CMOS 58 calcium fluoride 58 nitride 58 WLCSP 58 nano patterning 58 eWLB 58 Silicon carbide 58 InGaN 58 nanoimprint lithography NIL 58 SOI wafer 58 low k dielectric 58 monolithically integrated 58 chipscale 58 #.#μm CMOS process 58 MEMS resonators 58 heat spreaders 58 magnetron sputtering 58 k dielectrics 58 Through Silicon Vias 58 μm thick 58 thermal conduction 58 wafer bonder 58 wire bonders 58 furnaceware 58 sintered 58 ceramic dielectric 58 #nm DRAM 58 magnetostrictive 58 indium gallium phosphide 58 Organic Chemical Vapor 58 Aluminum Nitride 58 parasitic extraction 58 nanoparticle coated 58 Gallium Arsenide GaAs 58 YAG lasers 58 tin oxide 58 nm immersion 58 CMOS fabrication 58 cordierite 58 cored wire 58 MOS transistors 58 ArF 58 CMOS transistors 58 transparent electrode 58 tin Sn 58 DFM DFY 58 AlGaInP 58 thermo mechanical 58 diffractive optical elements 58 #.#μm [001] 58 cemented carbides 58 antimonide 58 barium titanate 58 2μm 58 nanostructured silicon 58 AlN 58 AlGaN 58 fused silica 58 SOI MEMS 58 laminate substrate 58 microvias 58 submicron 58 NiSi 58 SN#C 58 BGA packaging 58 Flip Chip 58 W mK 58 uranophane 58 die bonders 58 nanoparticle inks 58 chrome diopside 58 electroless plating 58 microstructured 58 photonic bandgap 58 nickel silicide 58 #nm silicon 58 PVD coating 57 Esatto Technology 57 sapphire wafer 57 GaAs substrate 57 microstrip 57 Alternating fibers 57 sub micron 57 #.#um CMOS 57 recrystallized 57 bearing sulphides 57 insulator wafers 57 EUV mask 57 ferro electric 57 plasma etching 57 AlGaAs 57 Imprio 57 silicon carbide substrates 57 CdSe 57 scintillator 57 AFM probes 57 multielement 57 nickel chromium 57 indium gallium 57 wirebonding 57 silicon nitride 57 conductive pastes 57 defectivity 57 copper damascene 57 carbon nanotube CNT 57 Gallium Arsenide 57 tellurium selenium iridium 57 dielectric materials 57 k gate dielectrics 57 III nitride 57 μm diameter 57 extrudate 57 Z Foil 57 CMOS circuits 57 martensitic 57 PIN diodes 57 nm DRAM 57 SiGe C 57 laser micromachining 57 MESFET 57 carbon nanotube interconnects 57 SiON 57 pulsed laser deposition 57 fiber optic transceivers 57 #nm immersion 57 Si wafers 57 Nd YAG 57 metallic interconnects 57 cemented carbide 57 indium gallium arsenide 57 lanthanum oxide 57 wafer thinning 57 superlattice 57 copper electroplating 57 compressive stress 57 nm CMOS 57 reagent consumption 57 cadmium selenide 57 7mm x 57 PIN diode 57 Elpida #nm 57 nanofabricated 57 resistive element 57 coating thickness 57 CMOS RF CMOS 57 polycrystalline 57 wire bondable 57 CMP slurries 57 subwavelength 57 lithographic processes 57 nanotubes nanowires 57 paperboard tubes 57 dopant 57 VIISta 57 ferrite core 57 leadframe 57 nm CMOS process 57 radiopacity 57 Gallium arsenide 57 electroforming 57 cited krypton strontium 57 UV VIS 57 atomically smooth 57 Schottky 57 #μm [002] 56 magnetite pyrite 56 nano composites 56 #.#in [004] 56 MWNT 56 NdFeB 56 electrically insulating 56 ellipsometry 56 vapor deposition 56 EUV masks 56 PowerDI TM 56 silicon photonic 56 bimetallic 56 TSMC #.#um 56 SAC# 56 bearing sulphide mineralization 56 weldable 56 resists corrosion 56 fiducials 56 GaAs InP 56 nitride semiconductor 56 opto electrical 56 ZnO nanowires 56 SWCNT 56 insulating substrate 56 UVTP 56 overlay metrology 56 Nastia deserved 56 microfabricated 56 Bragg grating 56 eutectic alloy 56 TSVs 56 absorber layers 56 CMP consumables 56 transparent conductive coatings 56 pentacene 56 millimeter mm 56 nanosized 56 #μm [001] 56 Silicon Nitride 56 thermomechanical 56 optically transparent 56 XRT#L# 56 Raman lasers 56 nanometer silicon 56 AlSiC 56 tensile modulus 56 dielectric layer 56 Soitec produces 56 pMOS 56 C0G 56 Metrology System 56 titanium carbide 56 indium gallium arsenide InGaAs 56 pyrite marcasite 56 weldability 56 VCSELs 56 PEALD 56 nanopowders 56 niobium titanium 56 electroless nickel plating 56 EOSINT M 56 nanometal 56 planar magnetics 56 nanotube arrays 56 solder mask 56 polishing pads 56 gallium indium arsenide 56 InAs 56 Silicon dioxide 56 Co2 laser 56 Czochralski 56 amorphous silicon Si 56 AlGaN GaN 56 planar 56 dielectric constants 56 e beam lithography 56 reflow solder 56 nano imprint 56 micromachining 56 SAC alloys 56 thermally conductive 56 HRTEM 56 uniaxial 56 Germanium 56 mask ROM 56 CaF2 56 crystallites 56 carbides 56 Physical Vapor Deposition 56 gate electrode 56 indium tin oxide ITO 56 nano imprint lithography 56 IC substrates 56 germanium antimony 56 epitaxial structures 56 MP# processor 56 thermally activated 56 GT Solar DSS 56 indium phosphide InP 56 nanoporous 56 doped silicon 56 epiwafer 56 epiwafers 56 InGaP 56 #mm silicon wafers 56 CdTe Si 56 CMOS circuitry 56 measuring #.#mm x [001] 56 parasitic capacitance 56 BGA packages 56 crystalline Si 56 #.#μm [002] 56 aluminosilicate clay 56 indium phosphide 56 CIGS solar cell 56 metal matrix composites 56 Micromorph 56 electroformed 56 CMOS logic 56 wafer metrology 56 multilayers 56 oxide thickness 56 SWIR cameras 56 nanoantenna 56 biologically inert 56 HfSiON 55 dimensional tolerances 55 #nm RF CMOS 55 nm wavelength 55 Follow Vishay 55 bismuth telluride 55 DongbuAnam 55 microfocus 55 singulation 55 overmolded 55 #nm #nm [005] 55 Laser VCSEL 55 indium gallium nitride InGaN 55 EasyTube ™ 55 yttrium barium copper 55 QFNs 55 '# patent relates 55 Hastelloy ® 55 packaging WLP 55 Arria GX FPGAs 55 metallic sieve 55 HTS wires 55 PIN photodiode 55 reactive ion 55 UNCD 55 eG ViaCoat 55 interposers 55 micronization 55 di selenide CIGS 55 microcrystals 55 MetaPULSE 55 conductive coating 55 conductivities 55 fxP 55 anneal 55 microbolometers 55 nitrided 55 germanium substrates 55 underfill 55 predrilled holes 55 Vor ink 55 Indium phosphide 55 Rastek UV wide 55 QFN packaging 55 anisotropic 55 platinum Pt 55 MoS2 55 GaN wafers 55 film transistors TFTs 55 millisecond annealing 55 reflowed 55 martensitic stainless steel 55 equivalent CuEQ 55 cubic boron nitride 55 millimeter silicon wafers 55 silicon etch 55 SOI wafers 55 nanoimprint 55 4H SiC 55 micrometer scale 55 ion milling 55 ohmic contacts 55 gate transistors 55 etch deposition 55 lithography 55 Pseudo SRAM 55 HEMTs 55 electrical resistivity 55 quartz lode 55 4mm thick 55 thinner wafers 55 indium gallium phosphide InGaP 55 Deposition MOCVD systems 55 #.#u 55 silicon germanium SiGe 55 #x# mm [003] 55 antireflective coatings 55 aluminosilicate 55 zirconium oxide ZrO2 55 extendibility 55 ferrites 55 micromirror 55 sputter deposition 55 nanometers nm 55 #nm lithography [001] 55 Ge substrates 55 mafic intrusives 55 magnetic particle 55 Structured eASIC 55 alloys titanium 55 Silicon Germanium 55 #nm node [002] 55 mixed signal RFCMOS 55 wafer bonding 55 XT #i 55 ITRS roadmap 55 #.#mm thick [002] 55 layer deposition ALD 55 nm SRAM 55 epitaxial layer 55 Carbon nanotube 55 polymer substrate 55 cuprous oxide 55 vertical cavity 55 nm lithography 55 ChemetriQ 55 Stratix II FPGAs 55 reinforced thermoplastic 55 optomechanical 55 IQ Aligner 55 GaN substrate 55 radiopaque 55 AlInGaP 55 highly conformal 55 NiPdAu 55 nm wavelengths 55 ethylene tetrafluoroethylene 55 polyphenylsulfone 55 bioleach plants 55 GaP 55 birefringence 55 eutectic solder 55 midplane 55 nanoimprinting 55 gallium arsenide gallium nitride 55 molybdenum disulfide 55 CMOS wafer 55 #.#μ 55 Helios XP 55 cadmium selenium 55 X ray microscopy 55 overmolding 55 zinc indium 55 × #mm [002] 55 GAIN HBT 55 planar lightwave circuits 55 PaxScan 55 Au Pt 55 micrometre scale 55 tensile stress 55 mask aligners 55 PbS 55 sulphide stringers 55 zirconium hafnium 55 epitaxially 55 Oxide Silicon 55 iCoupler 55 varactors 55 nanofilm 55 epitaxial wafer 55 cathodic 55 numerical aperture NA 55 stripline 55 micron thick 55 Acari mill produces 55 rich orogenic quartz 55 photothermal 55 LPCVD 55 silicon oxide 55 GaAs GaN 55 copper molybdenum zinc 55 silicon Si 55 photolithography 55 FinFETs 55 transistor arrays 55 MEMS oscillators 55 FEOL 55 silicon substrate 55 EVG# 55 #nm wavelength [001] 55 Epitaxial 55 electron mobility 54 nMOS 54 thermal conductivities 54 silicon nanowire 54 ultrahigh purity 54 nanorod 54 #cm x 54 chromium alloy 54 mask aligner 54 systems substrate bonders 54 plasma etch 54 nanometer CMOS 54 Cerium oxide 54 nanochannel 54 linewidths 54 accuracy repeatability 54 Nd YAG laser 54 capacitances 54 #μm thick [002] 54 Chemical Vapor Deposition CVD 54 laterally diffused metal 54 pellicle 54 argon fluoride 54 radiolucent 54 Stratix III FPGAs 54 photoresist strip 54 EP#S# 54 Physical Vapor Deposition PVD 54 phthalocyanine 54 Palladium Pd 54 SOI substrates 54 UHMW 54 GaN LEDs 54 CMP polishing 54 lattice mismatch 54 transmissivity 54 micron diameter 54 aspheric 54 graphitic carbon 54 sol gel 54 Novellus SABRE 54 MLCCs 54 nanoholes 54 shot peening 54 bicomponent 54 alloying element 54 selective emitter 54 aluminum electrolytic 54 bipolar transistors 54 elastic modulus 54 X ray diffraction XRD 54 LTPS TFT 54 singulated 54 PQFP 54 #mm ² [001] 54 #.#nm [002] 54 #.#x#.# 54 Semiconducting 54 lithographic techniques 54 Nova NanoSEM 54 passivating 54 epitaxial layers 54 ITO indium tin 54 polydimethylsiloxane PDMS 54 etching DRIE 54 HVPE 54 focused ion beam 54 leadless package 54 MEMS sensor 54 density interconnect HDI 54 IGBT Insulated Gate 54 resharpening 54 MI #XM 54 ultrasonic transducers 54 x ray optics 54 holmium 54 Gallium Nitride GaN 54 ion implanters 54 Dektak 54 computational lithography 54 tantalum pentoxide 54 collimators 54 nanoparticle catalysts 54 nanocoatings 54 nano crystalline 54 GaAs gallium arsenide 54 epitaxy HVPE 54 thermal impedance 54 molten solder 54 rotary potentiometer 54 ARM#EJ processor 54 x #.#mm [005] 54 electroplate 54 MOS transistor 54 flux cored wires 54 TSV etch 54 micromechanical 54 aluminum gallium nitride 54 QRC Extraction 54 palladium nanoparticles 54 manufactures integrated circuits 54 nanocubes 54 #.#x#.#mm 54 electroless nickel immersion 54 coincident anomalous 54 amorphous alloy transformer 54 microfabrication techniques 54 compressive stresses 54 laser spike anneal 54 atomically thin 54 cored wires 54 antifuse 54 flex circuits 54 Lumiramic phosphor technology 54 GTAW 54 #x# mm [004] 54 Synopsys PrimeTime 54 LTPS LCD 54 molybdenite MoS2 54 nonpolar GaN 54 nanocages 54 PEDOT PSS 54 #.#mm x [003] 54 CMOS oscillators 54 emitting lasers VCSELs 54 ultraviolet lasers 54 BGAs 54 submicrometer 54 microchannel plate 54 ZnO nanowire 54 nickel hydroxide 54 optical metrology 54 triaxial 54 laser interferometer 54 #nm ArF 54 integrated circuits IC 54 graphene layers 54 Si substrates 54 schistose 54 photolithographic techniques 54 superabrasives 54 Polycrystalline 54 zinc sulphide 54 cobalt chrome 54 #um [001] 54 nucleation layer 54 metallic foils 54 quartz adularia veins 54 chemical inertness 54 ferrite 54 solar PV module 54 Indium Phosphide InP 54 toric lens 54 pre preg 54 magnetite alteration 54 Terbium 54 SOI silicon 54 biaxial 54 Lunguya 54 OptoCooler 54 solder alloy 54 HSLA steels 54 cancellous 54 microtubes 54 ceramic matrix composites 54 platinum monolayer 54 pseudomorphic 54 line BEOL 54 #nm FPGAs 54 millisecond anneal 54 organic TFTs 54 electron optics 54 Alanod Solar 54 trabecular 54 bearing breccias 54 serializer deserializer SerDes 54 gallium indium 54 thermodynamically stable 54 Solamet 54 Chalcopyrite 54 outcoupling 54 tungsten antimony 54 HSPICE R 54 MWCNTs 54 antireflection coatings 54 PIN photodiodes 54 DEV DA TOMAR NEXT 54 EDXRF 54 Lithium ions 54 Leachwell 54 micro machining 54 QFN packages 54 micro optics 54 garnet skarn 54 wafer probing 54 quartz crystal oscillator 54 Ball Grid Array 54 mm ² 54 intergranular 54 Ti TiN 54 JENOPTIK GmbH 54 expanded polytetrafluoroethylene 54 laser resonator 54 indium nitride 54 nitride layer 54 piezoelectric transducer 54 boron carbide 54 finely disseminated 54 darkfield 54 QuickCap NX 54 VICTREX PEEK polymer 54 Hastelloy C 54 Europium 54 axial loading 54 InN 54 TGA# SL 54 CVD etch 54 lamella 54 nano particle 53 transparent conductive 53 ceramic substrate 53 solid carbide 53 neodymium praseodymium 53 CMOS IC 53 Star RCXT TM 53 1Gbit DDR2 53 photomultiplier tubes 53 warpage 53 sapphire crystals 53 #nm #nm [002] 53 pin BGA package 53 CyberDisplay #K 53 amorphous silicon alloy 53 cermet 53 SiGe bipolar 53 laser scribing 53 NdFeB magnets 53 epitaxy 53 thermally stable 53 SiC substrate 53 RFID inlay 53 thermoplastic urethane 53 solder paste 53 pyrophyllite 53 clad laminates 53 PEEK OPTIMA polymer 53 backside illumination 53 conductive adhesive 53 CIGS solar 53 dielectric 53 Stratix II FPGA 53 5mm x 5mm 53 DS DBR 53 thermoset composite 53 #nm laser [001] 53 extruded profiles 53 bi metallic 53 GxT 53 ablates 53 quartz veins breccias 53 CVD diamond 53 #μ 53 exotic alloys 53 microfocus X ray 53 PWBs 53 bimetal 53 Mask Aligner 53 thermoplastic rubber 53 toolholder 53 InGaAs 53 damascene 53 immersion lithography 53 InSb 53 nanopowder 53 polyethylene fiber 53 chamfering 53 MEMS MOEMS 53 multilayer PCBs 53 x 3cm 53 wirewound 53 tantalum oxide 53 sulphide concentrate 53 automated wafer bonding 53 micrometer thick 53 ballscrew 53 vias 53 silicon etching 53 monochromator 53 quantum cascade 53 polymer substrates 53 SiPs 53 #nm #nm #nm 53 wedge bonder 53 inkjet printhead 53 anomalous dispersion 53 solder alloys 53 La Parrilla mill 53 electromigration 53 pin BGA 53 aspheric lenses 53 stencil printing 53 metallic nanostructures 53 injection molding extrusion 53 AIX #G# 53 ISL#M 53 XLR #i 53 expandable foam 53 alloyed steel 53 comminution 53 monolithic CMOS 53 customizable dataplane processor 53 leadless 53 RRa TM 53 metalorganic chemical vapor deposition 53 inkjet printer cutters 53 3g t 53 chalcedonic quartz 53 micro fluidic 53 BiFET 53 piezo actuators 53 massive sulphide horizons 53 AlN layer 53 SO8 53 voltage CMOS 53 bending radii 53 micron 53 titanium oxides 53 femtosecond pulse 53 BrightLase 53 ASML TWINSCAN 53 iron sulphides 53 tungsten electrode 53 bipolar CMOS DMOS 53 calcium magnesium phosphorus 53 ZnSe 53 CMP slurry 53 surface texturing 53 multi walled nanotubes 53 Schematic representation 53 TQFP packages 53 nonmagnetic 53 zinc cobalt 53 composite laminate 53 metallurgically bonded 53 deep ultraviolet DUV 53 polyimides 53 austenitic 53 Opti Probe 53 interposer 53 solder spheres 53 polybutadiene 53 metal oxide nanoparticles 53 borosilicate 53 skarn alteration 53 prolific Val d'Or 53 wafer scribing 53 chrome alloy 53 sapphire wafers 53 kaolin bauxite alumina 53 EO polymer 53 polyimide 53 crystalline silicon wafers 53 emitting lasers 53 polymer composite 53 nickel plating 53 Titanate 53 insert molding 53 Au AA# 53 plasmon 53 zirconia 53 Type IIA 53 surface roughness 53 On Insulator SOI 53 stamping fabricating 53 NWs 53 1g t 53 platinum rhodium 53 LDMOS RF power 53 Powder coating 53 coplanar 53 3mm thick 53 nonvolatile memories 53 selenide 53 Aera2 53 Beiya Gold Mine 53 nm geometries 53 photonic crystal 53 nematic 53 CIGS cells 53 metal zonation 53 photorefractive 53 dichromate 53 ferric oxide 53 XFP module 53 1mm thick 53 lithium alloy 53 4 x 4mm 53 wettability 53 electrochemical sensor 53 electrocatalysts 53 barium carbonate 53 phosphor coated 53 triplexer 53 #nm laser [002] 53 UV NIL 53 crystal resonator 53 diopside 53 colloidal silica 53 superparamagnetic 53 multilayer ceramic capacitors 53 nanomesh 53 CRIUS 53 conductive polymer 53 femtosecond lasers 53 tantalum nitride