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(Click for frequent words.) 71 solder bump 69 copper metallization 66 leadframes 65 low k dielectrics 65 electroless 65 metallisation 65 dual damascene 65 planarization 64 integrated passives 64 electroless nickel 64 solder bumps 64 silicide 64 eutectic 64 CuFlip 63 dielectric layers 63 QFN packaging 63 WLCSP 63 aluminum nitride 63 superabrasives 63 5V CMOS 62 wafer bumping 62 wafer thinning 62 GaAs substrate 62 metallization 62 wafer dicing 62 conductive epoxy 62 1μm 62 k dielectric 62 backside metallization 62 wirebond 62 SiC substrates 62 low k dielectric 62 silicon substrates 62 multilayers 62 SOI CMOS 62 gate dielectrics 61 #.#um [001] 61 sapphire substrate 61 epi wafers 61 wafer bonder 61 dielectrics 61 solderable 61 #μm [002] 61 wire bonders 61 cermet 61 flex circuits 61 #nm CMOS [002] 61 5μm 61 rigid substrate 61 Silicon Nitride 61 LiNbO3 61 MLCCs 60 Powerful debug 60 electrodeposition 60 #nm immersion lithography 60 BEOL 60 TiN 60 di selenide CIGS 60 SOI wafer 60 silicon 60 overmolding 60 SOI substrates 60 CMP consumables 60 insert molding 60 electroforming 60 resistive element 60 CIGS solar 60 microcrystalline 60 toolholders 60 PVD coating 60 electroplated 60 amorphous silicon Si 60 magnetron sputtering 60 transparent conductive oxide 60 electro deposition 60 coplanarity 60 linewidths 60 photoresists 60 epiwafers 59 eWLB technology 59 #μm thick [002] 59 ferritic 59 GaN wafer 59 Flip Chip 59 nickel silicide 59 CMOS fabrication 59 zirconium oxide 59 Si substrate 59 PIN diode 59 epitaxial wafer 59 nanoparticle inks 59 cemented carbide 59 CMOS transistors 59 SAC alloys 59 GaAs MESFET 59 k gate dielectrics 59 GaN wafers 59 .# micron 59 silicon photonic 59 SiON 59 AlN 59 silicate glass 59 SOI wafers 59 under bump metallization 59 electroformed 59 VECTOR Express 59 #.# micron node 59 wafer metrology 59 NiSi 59 eWLB 59 MOS transistors 59 copper interconnects 59 polyimide 59 Gallium Arsenide 59 2Xnm 59 tin oxide 59 planarity 59 extruded profiles 59 poly crystalline 59 insulator SOI technology 59 wafer thickness 58 3Xnm 58 cordierite 58 AlGaAs 58 through silicon vias 58 aluminum electrolytic 58 SN#C 58 HfSiON 58 imprint lithography 58 pMOS 58 pHEMT 58 wirewound 58 CMOS logic 58 thermoplastic polyurethane TPU 58 ferrite core 58 gate electrode 58 ceramic substrate 58 indium tin oxide ITO 58 #nm DRAM 58 toolholder 58 magnesium fluoride 58 Sn Pb 58 CMP slurry 58 nitride semiconductor 58 #.#μ 58 ZnS 58 cubic boron nitride 58 BGA packaging 58 Physical Vapor Deposition 58 diffractive optical elements 58 transparent conductive 58 dielectric materials 58 ENIG 58 metallization paste 58 monolithically integrated 58 silicon nitride 58 epitaxial wafers 58 k gate dielectric 58 film transistors TFTs 58 Silicon Germanium 58 AlSiC 58 Gallium Arsenide GaAs 58 bonder 58 mask aligners 58 Amorphous silicon 58 mechanical polishing CMP 58 oxide thickness 58 silicon etch 58 silicon oxynitride 58 integrated circuits IC 58 SAW oscillators 58 microcrystalline silicon 58 LTPS TFT 58 SiGe bipolar 58 cored wire 58 PIN photodiode 58 oxide nanoparticles 58 intermetallic 58 thermally conductive 57 AlN layer 57 silicon substrate 57 Sigma fxP 57 dielectric etch 57 monolithic microwave integrated 57 x ray optics 57 bicomponent 57 #nm lithography [001] 57 planar lightwave circuits 57 laminations 57 wire bonder 57 NiPdAu 57 crystallinity 57 underfill 57 thermosets 57 deflashing 57 InGaP 57 germanium substrates 57 ferrite 57 selective emitter 57 Epitaxial 57 indium phosphide InP 57 CMOS RF CMOS 57 Aluminum Nitride 57 IGBT Insulated Gate 57 silicon germanium SiGe BiCMOS 57 electroless copper 57 density interconnect HDI 57 mount SMT 57 #.# micron CMOS 57 polycrystalline silicon poly Si 57 NdFeB 57 GaAs gallium arsenide 57 epitaxial layer 57 wafer bonding 57 reactive ion 57 leadframe 57 polishing pads 57 μm thick 57 nitride 57 barium titanate 57 solid carbide 57 nanopowder 57 rigid flex 57 MEMS resonators 57 inkjet printhead 57 monocrystalline polycrystalline 57 superabrasive 57 wire bondable 57 nanoimprint 57 laminate substrate 57 CMP slurries 57 copper damascene 57 transparent conductive coatings 57 optical transceiver modules 57 QMEMS 57 multilayer ceramic capacitors MLCC 57 #um [001] 57 leadless package 57 epitaxial silicon 57 DongbuAnam 57 CMOS wafer 57 defect densities 57 silicon germanium SiGe 57 ceramic dielectric 57 SiGe C 57 dielectric layer 57 microvia 57 SAC# 57 electrically insulating 57 piezo actuators 57 multilayer ceramic capacitors 57 C4NP 57 etch deposition 57 line BEOL 57 multilayer ceramic 57 wirebonding 57 hafnium oxide 56 ZrO 2 56 silicon PV modules 56 #mm silicon wafers 56 flux cored wire 56 InGaP HBT 56 nm CMOS process 56 #.#um CMOS 56 threaded fasteners 56 XFP module 56 aluminum electrolytic capacitors 56 Micromorph 56 wafer 56 UHMW PE 56 triplexer 56 weldability 56 sintered 56 chip resistors 56 reflow solder 56 SiO 2 56 Ti TiN 56 Soitec produces 56 calcium fluoride 56 UMC #nm 56 Silicon carbide 56 epitaxy 56 Solamet 56 poly Si 56 gallium phosphide 56 solder mask 56 solar PV module 56 tighter tolerances 56 nm CMOS 56 Gallium arsenide 56 thinner wafers 56 nano composites 56 Indium Tin Oxide 56 Cadmium Telluride CdTe 56 projected capacitive touch 56 substrates 56 PIN diodes 56 epitaxial substrates 56 multichip 56 sapphire wafers 56 thermal conduction 56 transparent electrode 56 titanium carbide 56 carbides 56 alloying element 56 x 9mm 56 passivation layers 56 PWBs 56 clad laminates 56 microchannel plate 56 cemented carbides 56 transceiver IC 56 weldable 56 mask aligner 56 GaAs substrates 56 passivation layer 56 UV lasers 56 SMA connectors 56 MEMS gyroscope 56 QFPs 56 transistor arrays 56 oxide layer 56 X5R 56 nanocrystalline 56 silica substrate 56 fused quartz 56 MOS transistor 56 substrate 56 heat spreaders 56 thermo mechanical 56 atomically smooth 56 indium gallium 56 silicon oxynitride SiON 56 nanotube arrays 56 2μm 56 planar waveguide 56 CIS CIGS 56 EUV masks 56 BGA packages 56 dimensionally stable 56 4mm thick 56 polycrystalline 56 laser annealing 56 kraft liner 56 ZnO nanowires 56 parasitic capacitance 56 semiconductive 56 thermoset composites 56 ferrite beads 56 FEOL 56 crystalline silicon wafers 56 anodising 56 capacitive touch panels 56 micrometer thick 56 heterostructure 56 carbon nanotube CNT 56 conductive adhesives 56 overmolded 56 CMOS wafers 56 silicon modulators 56 CNC milling machines 56 CMOS circuits 56 CVD diamond 55 gasketing 55 ultrathin layer 55 dopant 55 furnaceware 55 conductive coating 55 QFN packages 55 CMOS silicon 55 silicon photovoltaic modules 55 GaAs pHEMT 55 wafer uniformity 55 dielectric deposition 55 brazing alloys 55 surface mountable 55 carbide insert 55 flux cored wires 55 Ge substrates 55 multilayer PCBs 55 magnetostrictive 55 carbon steels 55 #nm RF CMOS 55 microcavity 55 BGAs 55 IC substrates 55 threshold voltages 55 dielectric constant 55 Electrofill 55 boron nitride 55 FinFET 55 anneal 55 titanium nitride 55 numerical aperture 55 heatspreader 55 photomultiplier 55 Si substrates 55 fusion splice 55 VectorGuard 55 austenitic stainless steel 55 damascene 55 chamfering 55 varactors 55 plasma etching 55 TFTs 55 piezo ceramic 55 Mach Zehnder modulator 55 oxide semiconductor 55 TSV etch 55 EVG# 55 RFCMOS 55 etching DRIE 55 lithographic techniques 55 finer geometries 55 C0G 55 GaAs foundry 55 tin Sn 55 Si wafers 55 photolithography 55 GaN layers 55 #.#mm thick [002] 55 CIGS solar cells 55 MAX# integrates 55 submicron 55 Ball Grid Array 55 photomask inspection 55 #.#u 55 K dielectrics 55 #nm node [002] 55 #um [002] 55 MESFET 55 phototransistors 55 palladium nanoparticles 55 DDR3 DIMMs 55 sputter deposition 55 extendibility 55 nickel chromium 55 immersion litho 55 nano imprint lithography 55 optical coatings 55 SFP + transceivers 55 multijunction solar cells 55 CIGS copper indium 55 PIN photodiodes 55 dome tweeter 55 #.#μm CMOS 55 solder alloy 55 ownership CoO 55 pseudo SRAM 55 HfO2 55 EUV mask 55 BiCMOS 55 passivating 55 CMOS IC 55 tantalum capacitors 55 Transparent Conductive Oxide TCO 55 die bonders 55 MTP NVM 55 Bragg grating 55 silanes 55 Germanium 55 high-k/metal-gate 55 outcoupling 55 #nm silicon 55 advanced leadframe 55 SiC wafers 55 Si TFT 55 backplane connectors 55 crystalline silicon c 55 TSMC #.#um 55 copper indium diselenide 55 ferritic grades 55 stencil printing 55 compressive stress 55 #nm/#nm 55 solder pastes 55 piezoelectric ceramic 55 molten solder 55 mandrels 55 #μm [001] 55 tin plating 55 layer deposition ALD 55 silicon CMOS 55 CdSe 55 conductive polymer 55 GaN substrate 55 stainless alloys 55 HEMTs 55 computational lithography 55 tensile modulus 55 Silicon Via TSV 55 holemaking 55 Polycrystalline 55 ferrites 55 TSVs 55 eG ViaCoat 55 #nm #nm [005] 55 UVTP 55 solder paste 55 CIGS cells 55 micron wafers 55 RFID inlay 55 dielectric 55 ArF immersion lithography 55 micrometre scale 55 #G CFP 55 Photolithography 55 tuner demodulator 55 Czochralski 55 crystalline Si 55 Solamet ® 55 transparent electrodes 55 Gallium nitride GaN 55 vapor deposition 55 exotic alloys 55 photonic bandgap 55 nanoimprinting 55 #.#μm [001] 55 conductive adhesive 55 micro machining 55 defectivity 55 PMOS transistors 54 indium gallium phosphide 54 BiFET 54 wafers 54 ion implanters 54 cadmium sulfide 54 dielectric constants 54 toolholding 54 fused silica 54 polybutadiene 54 heat spreader 54 microtubes 54 tunable optical 54 measuring #.#mm x [001] 54 ceramic capacitor 54 pluggable transceiver 54 compressive stresses 54 nm nodes 54 selenide 54 nanocubes 54 nm NAND 54 phototransistor 54 MEMS oscillators 54 cone woofers 54 epiwafer 54 DDR2 DRAM 54 organic TFTs 54 GaAs InP 54 lithographic processes 54 HV CMOS 54 DS DBR 54 micron pixels 54 Elpida #nm 54 tool steels 54 AlGaN 54 microvias 54 conductive pastes 54 sapphire wafer 54 insulator SOI innovation 54 nickel plating 54 wafer probing 54 DFM DFY 54 Leadless 54 wafer bonders 54 X7R 54 logic NVM 54 InGaN 54 polycrystalline diamond 54 pn junctions 54 circuit MMIC 54 sq. mm 54 thermoplastic materials 54 fiber optic transceivers 54 photoresist 54 toroids 54 passivation 54 Schottky diodes 54 rigid substrates 54 #GBase T PHY 54 GaAs wafers 54 tunable transponder 54 silica spheres 54 metallization pastes 54 silicon Si 54 indium phosphide 54 3mm thick 54 #μ 54 Pseudo SRAM 54 SiC substrate 54 nickel hydroxide 54 superlattice 54 Tungsten carbide 54 nanopowders 54 pentacene 54 wafer prober 54 interfacial layer 54 package SiP 54 nano imprint 54 nanoantenna 54 epitaxial 54 AlGaInP 54 TQFP packages 54 micromirror 54 electrochemical deposition 54 silicon etching 54 sub micron 54 optically transparent 54 micromachined 54 indium gallium phosphide InGaP 54 solderability 54 nanoimprint lithography NIL 54 Ruthenium 54 Stanyl 54 nanometer silicon 54 interposer 54 Schottky 54 #mm# [002] 54 Microfluidizer 54 nm DRAM 54 plasma etch 54 RF transistors 54 line FEOL 54 multicrystalline silicon 54 #.#μm CMOS process 54 ceramic powders 54 Crystalline silicon 54 Through Silicon Vias 54 UHMW 54 MB#K# 54 GaAs IC 54 subwavelength 54 MoS2 54 molybdenum disulfide 54 BOPP films 54 #.#μm [002] 54 stripline 54 Strained silicon 54 nMOS 54 glass frit 54 QFNs 54 PQFP 54 SMS NIL 54 RF Microwave 54 chip resistor 54 graphene layers 54 silicon waveguides 54 nm lithography 54 nanometer node 54 inkjet inks 54 III nitride 54 martensite 54 foundries IDMs 54 PHEMT 54 MLCC capacitors 54 TOSAs 54 multicrystalline 54 Wafer Level Packaging 54 doped silicon 54 NXT #i 54 FinFETs 54 Cu interconnects 54 nanometric 54 Tetra Reticle Clean 54 DPSK 54 semi insulating GaAs 54 #.#x#.#mm 54 PVD coated 54 amorphous silicon modules 54 varistors 54 LTPS LCD 54 × #mm [002] 54 Tungsten Carbide 54 #GBASE CX4 54 encapsulants 53 OptoCooler 53 BJTs 53 piezoceramic 53 Qspeed diodes 53 silicon epitaxial 53 chalcogenide 53 #nm laser [001] 53 thermoplastic elastomer TPE 53 wave soldering 53 HDI PCBs 53 coated abrasives 53 polymer substrates 53 linecards 53 nm SOI 53 RJ# connector 53 oxynitride 53 Mask Aligner 53 crystallites 53 aluminosilicate 53 SnPb 53 k dielectrics 53 thermally activated 53 solder spheres 53 photolithographic 53 meltblown 53 phthalocyanine 53 fxP 53 Opti Probe 53 downgauging 53 hermetic packaging 53 layer ceramic capacitors 53 ZnSe 53 nm immersion 53 mixed signal RFCMOS 53 PECVD 53 Mach Zehnder 53 SOI MEMS 53 germanium substrate 53 InAs 53 thermoplastic elastomer 53 VCSELs 53 MPEG decoding 53 insulator wafers 53 dimensional tolerances 53 eutectic solder 53 CIGS Copper Indium 53 LSA#A 53 junction amorphous silicon 53 wafer processing 53 photomultipliers 53 inkjet printer cutters 53 epitaxial deposition 53 tantalum capacitor 53 1mm thick 53 reticles 53 Esatto Technology 53 glass substrate 53 sSOI 53 analog ICs 53 machinability 53 Santoprene TM 53 X ray microscopy 53 tensile stress 53 silicon wafer 53 tantalum nitride 53 micron thick 53 immersion lithography 53 SOI silicon 53 breakdown voltages 53 concentricity 53 insulating substrate 53 monolithic CMOS 53 AFM probes 53 PV# [002] 53 Lithium Niobate 53 CMOS processes 53 ceria 53 purity cobalt 53 splined 53 #nm immersion 53 UV NIL 53 Indium phosphide 53 JFET 53 conductivities 53 zinc cobalt 53 Copper Indium Gallium Selenide 53 coextruded 53 epitaxially 53 transceiver modules 53 #.#um [002] 53 micrometre 53 encapsulant sheets 53 opto electrical 53 SiPs 53 capacitances 53 Integrated Circuits ICs 53 Mbit MRAM 53 packaging WLP 53 Horizon #i 53 YAG lasers 53 Complementary Metal Oxide Semiconductor 53 PVD CVD 53 GaAs HBT 53 PEEK OPTIMA 53 Cree GaN 53 thermoform 53 reflowed 53 nanometer CMOS 53 MWNT 53 Organic Chemical Vapor 53 SnO2 53 polymer composite 53 borosilicate 53 x 6mm 53 solder flux 53 injection molded parts 53 borosilicate glass 53 pellicle 53 ferritic stainless steel 53 Vor ink 53 ASICs FPGAs 53 tunable transponders 53 TGA# SL 53 gallium indium arsenide 53 axial radial 53 Si Ge 53 SOI substrate 53 deep silicon etch 53 aluminum gallium nitride 53 antireflective coatings 53 CMOS MEMS 53 mandrel 53 photopolymer 53 amorphous alloy transformers 53 manufactures integrated circuits 53 Chipbond 53 gallium selenide 53 ultraviolet curable 53 indium arsenide 53 nonmagnetic 53 tunable filters 53 nano patterning 53 AMLCD 53 diecasting 53 ohmic contacts 53 photolithographic techniques 53 inkjet printing systems 53 deep ultraviolet DUV 53 millimeter silicon wafers 53 copper electroplating 53 micro optics 53 imagesetter 53 Novellus SABRE 53 ion implanter 53 #GB RDIMM 53 bipolar transistor 53 elastic modulus 53 VIISta HC 53 bipolar CMOS DMOS 53 Cerium oxide 53 micromorph ® 53 ballscrew 53 c Si 53 metallic interconnects 53 x 5mm 53 microstrip 53 nm wavelengths 53 layer ceramic capacitor 53 EO polymer 53 nanocluster 53 LPCVD 53 physical vapor deposition 53 conductively cooled 53 quartz crystal oscillator 53 oxide thickness EOT 53 MEMS resonator 53 carbon nanotube interconnects 53 bandgaps 53 Laser VCSEL 53 extrudate 53 alloyed steel 53 injection molding extrusion 53 8bit MCU 53 lamella 53 2Gb DDR3 53 Vertical Cavity Surface Emitting 53 #G DPSK 53 VCOs 53 optical waveguides 53 solder alloys 53 matrix composites 53 GaAs PHEMT 53 monocrystalline silicon wafers 53 flexible monolithically integrated 53 monocrystalline silicon 53 HBLEDs 53 FR4 53 micromachining 53 TiO 2 53 photodiode 53 OCD metrology 53 amorphous alloy transformer 53 InP 53 compression molded 53 silicone elastomers 53 Silicon Germanium SiGe 53 MEMS gyro 53 serdes 53 metal insulator 53 heterojunction 53 nanometer NAND 53 interlayer 53 optical metrology 53 Applied Endura 53 Silicon Carbide SiC 53 polymeric composites 52 planetary gearbox 52 polymer extrusion 52 Ti 4V 52 crystal resonator 52 Selenide 52 geometries 52 laser diode modules 52 Nd YAG 52 SO8 52 cadmium selenide 52 density fiberboard 52 Imprio 52 thermoset composite 52 diameter wafers 52 nucleation layer 52 dampens vibrations 52 semiconductor wafer 52 UV VIS 52 HSLA steels 52 hardcoat 52 crystal lattices 52 mono crystalline solar 52 nanometal 52 matte tin 52 FUSI 52 monocrystalline ingots 52 5nm 52 metalcutting 52 indium gallium nitride InGaN 52 InP substrates 52 thermoplastic polyester 52 electron optics 52 martensitic stainless steel 52 Solido Variation Designer 52 mask reconfigurable 52 excellent solderability 52 gate transistors 52 #nm lithography [002] 52 CVD etch 52 alloys titanium 52 silicon crystals 52 microcavities 52 #x# mm [004] 52 millimeter mm 52 Metrology System 52 inertial sensor 52 aramid fibers 52 copper nanorods 52 intergranular 52 hardfacing 52 thermosetting resins 52 lanthanum aluminate 52 pyrogenic silica 52 GTAW 52 bipolar transistors 52 CIGS photovoltaic PV 52 synthesizable IP 52 high voltage BCDMOS 52 #Base TX 52 CIGS solar cell 52 CAN transceiver 52 APTIV film 52 Indium Phosphide InP 52 biaxially oriented polypropylene 52 QFP package 52 MI #XM 52 #nm #nm [002] 52 etch selectivity 52 photoluminescence 52 nanodots 52 Micromorph ® 52 DDR3 DRAM 52 passivated 52 micron 52 neodymium magnet 52 QuickCap NX 52 aramid fiber 52 blowmolding 52 HPLC columns 52 liquid crystal polymer 52 thermoplastic injection molding 52 aspheric 52 millisecond annealing 52 film transistor TFT 52 VICTREX PEEK polymer 52 tungsten carbide 52 metallic nanostructures 52 ITRS roadmap 52 ZMD# 52 Particulate Reactor TM 52 photoresist stripping 52 Si TFT LCD 52 MOCVD reactor 52 TCXO 52 Indium Phosphide 52 output capacitors 52 AlGaN GaN 52 ARM#EJ processor 52 fluxing 52 composite laminate 52 extrusion coating 52 GAIN HBT 52 silicone gasket 52 ARM#EJ S processor 52 monocrystalline wafers 52 polyphenylsulfone 52 baseband IC 52 leaded solder