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(Click for frequent words.) 62 ownership CoO 62 defectivity 59 AlN 58 SiON 58 dielectric etch 58 wafer thickness 58 LPCVD 57 parasitic capacitance 56 imprint lithography 56 extendibility 56 planarization 56 SiO2 56 defect densities 55 LSA#A 55 gate dielectrics 55 thickness uniformity 55 dual damascene 55 weldability 55 planarity 55 EUV mask 55 thinner wafers 55 hafnium oxide 55 SiO 2 55 1μm 55 k dielectric 55 #nm silicon 55 CRIUS 55 leakage currents 54 Stratix II FPGAs 54 multichip 54 thermal dissipation 54 laser scribing 54 silicon substrates 54 jitter measurement 54 line BEOL 54 crystallinity 54 CMOS logic 54 Silicon Nitride 54 nano imprint 54 Microfluidizer 54 numerical aperture NA 54 AIX #G# 54 photon detection 53 copper metallization 53 polishing pads 53 #.# micron node 53 Si substrate 53 metallisation 53 nanoimprint 53 parametric yield 53 5mm x 6mm 53 numerical aperture 53 SiGe bipolar 53 pMOS 53 solderability 53 CMOS transistors 53 K dielectrics 53 sapphire substrate 53 microchannel plate 53 UVTP 53 output capacitance 53 antireflective coatings 53 crystalline Si 53 cm ² 53 SiC substrates 53 Stratix III FPGAs 53 solder reflow 53 threshold voltages 53 #nm lithography [001] 53 #nm immersion lithography 53 DFM DFY 53 SOT# package [001] 53 CMOS fabrication 52 electroless copper 52 silicon Si 52 #.#μ 52 CIGS solar cells 52 wirewound 52 conductivities 52 Vdd 52 Sn Pb 52 Amorphous silicon 52 coplanarity 52 PVD CVD 52 dielectric constant 52 Z Foil 52 parasitic inductance 52 martensitic 52 SiC substrate 52 deep silicon etch 52 MLCCs 52 UMC #nm 52 eutectic 52 oxide thickness 52 epi wafers 52 accuracy repeatability 52 x ray optics 52 wirebond 52 solder bumping 52 ArF 52 silicide 52 SWCNT 52 capacitances 52 NiPdAu 52 reagent consumption 52 solder bump 52 cordierite 52 k gate dielectric 52 SFP + transceivers 52 laser annealing 52 BGA packaging 52 ZnSe 52 InGaN 52 SiT# 52 immersion litho 52 oxide semiconductor 52 epitaxial layer 52 layer deposition ALD 52 Schottky diodes 52 3Xnm 52 HfSiON 52 melt viscosity 51 2μm 51 noise ratio SNR 51 results QoR 51 monochromator 51 TiN 51 plasma etch 51 BEOL 51 thermal coefficient 51 microvia 51 electrochemical deposition 51 wafer bonder 51 VCSEL driver 51 selective emitter 51 8bit MCU 51 tin Sn 51 mask ROM 51 poly Si 51 extractables 51 ENIG 51 monolithically integrated 51 #nm wavelength [001] 51 Mosfets 51 dielectric constants 51 coating thickness 51 metallization 51 Schottky diode 51 MESFET 51 power dissipation 51 millisecond anneal 51 Sigma fxP 51 OptiMOS 51 crystalline silicon c 51 nm wavelengths 51 EUV masks 51 reflow profiles 51 #nm CMOS [001] 51 processability 51 aluminum nitride 51 MOCVD 51 thermal impedance 51 SIMOX 51 thermal conductivity 51 wafer dicing 51 oxidative stability 51 GaN layer 51 absorbance 51 particulate contamination 51 #.# micron CMOS 51 etch selectivity 51 flowability 51 QFN packaging 51 .# micron 51 PIN diodes 51 ArF immersion lithography 51 #.#um [001] 51 silicon 51 transistor leakage 51 nMOS 51 CRIUS II 51 flame retardancy 51 MEMS resonators 51 nm nodes 51 silicon DRIE 51 silicon oxynitride 51 #um [002] 51 5μm 51 nano imprint lithography 51 #.#μm [002] 51 FinFETs 51 flexural strength 51 nonpolar GaN 51 AlGaAs 51 tantalum capacitors 51 intermetallic 51 PCI SIG compliant 51 nitride semiconductor 51 high-k/metal gate 50 mechanical polishing CMP 50 zirconium oxide 50 RDS ON 50 LiNbO3 50 VUV 50 MAX# integrates 50 HEMT 50 nm immersion 50 electroless 50 DongbuAnam 50 silicon etch 50 Gbps transceiver 50 PEALD 50 computational lithography 50 μm thick 50 pHEMT 50 epitaxial silicon 50 epitaxy 50 RO membrane 50 transparent conductive oxide 50 tighter tolerances 50 CdSe 50 ceramic capacitor 50 Stratix III 50 Esatto Technology 50 uniformities 50 #V MOSFETs [002] 50 Schottky 50 electromigration 50 SMIC #.#um 50 HEMTs 50 conductive epoxy 50 k gate dielectrics 50 Repeatability 50 surface passivation 50 mask aligners 50 ISL#M 50 overmolding 50 W mK 50 GaN wafers 50 TSVs 50 SO8 package 50 CMP consumables 50 moisture absorption 50 photoresist strip 50 photoresist stripping 50 geometries shrink 50 dielectrics 50 TQFP packages 50 insulator SOI technology 50 ZXLD# 50 hydride vapor phase 50 CIS CIGS 50 reflow soldering 50 sub micron 50 SpyGlass ® 50 C0G 50 low k dielectrics 50 #.#u 50 amorphous silicon Si 50 SOI CMOS 50 InGaAs InP 50 tensile modulus 50 AlGaN 50 silicon oscillators 50 voltage MOSFET 50 nitride 50 CIGS solar cell 50 OM4 50 voltage CMOS 50 UV VIS 50 #nm SOI 50 capacitance 50 MOS transistors 49 line FEOL 49 micro machining 49 UV LED 49 FastSPICE 49 Zener diodes 49 sSOI 49 chipscale 49 SOI wafer 49 SiliconSmart ACE 49 chip resistors 49 ASTM C# [002] 49 5V CMOS 49 NanoBridge 49 #μm thick [002] 49 AlN layer 49 passivation 49 isotropic 49 Arria GX FPGAs 49 singulation 49 OptoCooler 49 multicrystalline module 49 #nm DRAM 49 TCXOs 49 SAW oscillators 49 #nm FPGA 49 #nm RF CMOS 49 ALTUS Max 49 bipolar transistors 49 voltage MOSFETs 49 QMEMS 49 k1 49 wafer bonding 49 Alien Crosstalk 49 deep submicron 49 varistor 49 TCXO 49 germanium wafers 49 XLR #i 49 EVG# 49 SiC 49 #ns [002] 49 clamping voltages 49 debonding 49 sub Angstrom 49 warpage 49 microelectronic device 49 intrinsic jitter 49 Aerosol Jet 49 #.#um [002] 49 immersion lithography 49 #mm ² [001] 49 thermo mechanical 49 dielectric layers 49 mask aligner 49 copper damascene 49 Photolithography 49 epitaxy HVPE 49 respins 49 PBGA package 49 furnaceware 49 mW/cm2 49 highly conformal 49 embedded EEPROM 49 k dielectrics 49 cored wire 49 input capacitance 49 Fractional N 49 #GBASE T PHY 49 elastic modulus 49 wafer probing 49 #nm CMOS [002] 49 catalytic oxidation 49 Ascentis Express 49 GaAs MESFET 49 design kits PDKs 49 FD SOI 49 Gallium Nitride 49 reflow temperatures 49 MOCVD reactor 49 reflow oven 49 QFNs 49 GaN HEMTs 49 #nm nodes 49 copper interconnects 49 epitaxially grown 49 Optima HDx 49 WLCSP 49 ductility 49 wettability 49 VCSELs 49 JESD# [002] 49 InGaAs 49 photoresists 49 PCB layout 49 electrodeposition 49 micronization 49 wph 49 ArF immersion 49 sputter deposition 49 #.#VI O 49 sensing resistors 49 wafer prober 49 di dt 49 repeatability 49 transparent electrode 49 Lumiramic phosphor technology 49 BJTs 49 F3D 49 Aixtron MOCVD 49 solder paste 49 SAC alloys 49 nm lithography 48 5mm x 5mm 48 cm -2 48 AlGaInP 48 Chemical Vapor Deposition CVD 48 TrenchFET 48 printability 48 epiwafers 48 MOS transistor 48 mosfet 48 Intersil ISL# 48 SAR ADC 48 magnetron sputtering 48 RBOM 48 photolithographic 48 ChemetriQ 48 ceramic dielectric 48 sintering 48 Si substrates 48 #.#nm [002] 48 MTCMOS 48 nanopowders 48 UHPLC 48 linewidths 48 overlay metrology 48 Aera2 48 1W LED 48 PIN photodiodes 48 parasitic extraction 48 SPICE simulator 48 deep submicron CMOS 48 SiC Schottky diodes 48 QCLs 48 mono crystalline 48 HfO2 48 ppm ° C 48 low k dielectric 48 Gb DDR3 48 NiSi 48 snubber circuits 48 DNIe 48 wafer metrology 48 dc dc controller 48 JFETs 48 MICRO FOOT 48 #MSPS 48 #LP [002] 48 temperature coefficients 48 lithographic techniques 48 outcoupling 48 QFN packages 48 transmittance 48 microbolometers 48 layer ceramic capacitor 48 X7R 48 photolysis 48 vapor deposition 48 transistor arrays 48 manufacturability 48 nm CMOS process 48 thermal conductivities 48 Qspeed diodes 48 Micromorph 48 multimode baseband 48 √ Hz 48 Insulator SOI 48 lithography 48 TetraMAX ATPG 48 #Gb MLC NAND 48 elastic moduli 48 daughtercards 48 high voltage BCDMOS 48 DFB lasers 48 MirrorBit Quad 48 LatticeECP3 ™ 48 kraft liner 48 nm CMOS 48 FWHM 48 solventless 48 copper electroplating 48 #.#dB [003] 48 Indium phosphide 48 wafer 48 aqueous dispersion 48 thermal conduction 48 HDP CVD 48 AlInGaP 48 transconductance 48 routability 48 ultrapure water 48 reflow solder 48 TGA# SM 48 SOI wafers 48 jitter tolerance 48 tribological 48 bonder 48 nanopowder 48 multicrystalline 48 VISIONPAD 48 epitaxial 48 #.# mW MHz 48 ion implanter 48 #.#um CMOS 48 nanometer integrated circuits 48 machinability 48 photon flux 48 #nm immersion 48 milliohm 48 nanoparticle inks 48 photoresist 48 QoR 48 electrical resistivity 48 HKMG 48 SnPb 48 YAG lasers 48 flux residues 48 PECVD 48 DPAK 48 SiGe C 48 MicroFET 48 reactive ion 48 2mm x 2mm 48 nanometer node 48 DPSS lasers 48 NanoCD 48 millisecond annealing 48 transmissivity 48 absorption coefficient 48 FEOL 48 aluminum gallium nitride 48 MIC#/# 48 c Si 48 #ppm ° C 48 solder pastes 48 electron optics 48 coupling capacitors 48 MirrorBit NOR 48 carbon nanotubes CNT 48 CMOS circuits 48 AquiVia 48 electromagnetic interference EMI 48 UNCD 48 EUV resists 48 nanotubes nanowires 48 3D TSV 48 ballast resistors 48 CIGS cells 48 wave soldering 48 elastomeric seals 48 complex SoC designs 48 Power MOSFETs 48 thermal oxidation 48 impedance matching 48 6T SRAM 48 Wafer Level 48 TSV metallization 48 Cymbet EnerChip 48 GaN LED 48 ultrasonic flowmeters 48 sapphire substrates 48 synchronous buck converter 48 deep sub micron 48 hydrolytic stability 48 laminations 48 SHELLCASE 48 amorphous alloy transformer 48 throughput 48 spectroscopic ellipsometry 48 foil resistor 48 nm geometries 48 BrightLase 47 package SiP 47 FinFET 47 deep ultraviolet DUV 47 Copper Indium Gallium Selenide 47 EUVL 47 AQ# [001] 47 capacitive loading 47 backside metallization 47 voltage #.#V 47 solder alloy 47 ferrite beads 47 silicon oxynitride SiON 47 micrometer scale 47 ionizing dose 47 temperature coefficient 47 capacitance values 47 laminate substrate 47 SiC wafers 47 phototransistors 47 clamping voltage 47 Optical Profiler 47 monocrystalline ingots 47 #mm# [002] 47 multijunction solar cells 47 MALDI 47 Intel XMP 47 diameter wafers 47 OCXO 47 #pF [001] 47 Photoresist 47 AlSiC 47 TSMC #.#um 47 Capacitance 47 UV NIL 47 reaction kinetics 47 SOI substrate 47 numerical apertures 47 #nm/#nm 47 UCC# 47 ZnS 47 #.#uF 47 GaAs FETs 47 plasma etching 47 filament winding 47 integrated passives 47 electroluminescence EL 47 #nm FPGAs 47 silane gas 47 anneal 47 tetrahydrofuran THF 47 monocrystalline wafers 47 rectifier diode 47 flexo printing 47 crystalline silicon modules 47 RF transistors 47 wafer uniformity 47 4H SiC 47 Atrenta SpyGlass 47 Stratix II 47 wafer ASPs 47 JFET 47 photoluminescence 47 electron mobility 47 channel MOSFET 47 thermal EMF 47 HBLED 47 photodetector 47 thermomechanical 47 AFM probes 47 flexural modulus 47 optocoupler 47 solder bumps 47 NDIR 47 selectivities 47 PowerPAK SO 8 47 Mercury5e 47 Nd YAG 47 #.#μm [001] 47 planar lightwave circuits 47 smaller geometries 47 Racerunner 47 absorption spectroscopy 47 leach recoveries 47 electrochemical capacitors 47 micromorph 47 electron beam welding 47 corrosion inhibition 47 SiC epitaxial wafers 47 Gallium nitride 47 Cu interconnects 47 Flex OneNAND 47 spectral purity 47 discrete resistors 47 MCP# AFE 47 DPSS laser 47 double patterning lithography 47 modulus 47 conductive adhesives 47 resistive element 47 thermally activated 47 MΩ 47 Chemical Vapor Deposition 47 Planetary Reactor 47 CoolMOS 47 #GB RDIMM 47 CMOS compatible 47 Cpk 47 VectorGuard 47 poly silicon 47 crystal resonator 47 EBDW 47 mosfets 47 #:# LVDS 47 SOFC stacks 47 Bulk Metal 47 monolithic microwave integrated 47 InGaP HBT 47 dielectric strength 47 low capacitance ESD 47 UMG silicon 47 #nm node [002] 47 #nm laser [001] 47 micron pixels 47 Encounter Conformal Constraint Designer 47 sapphire wafers 47 UMC #.#um 47 Tetra Reticle Clean 47 calcined kaolin 47 ARPES 47 flexo plates 47 SPICE accurate 47 ZMDI 47 EMIF# 47 Amorphous Silicon 47 APTIV film 47 PoE PD 47 #nm SRAM 47 PCIe specification 47 multicrystalline silicon 47 integrated circuits IC 47 decoupling capacitance 47 PIN diode 47 4x oversampling 47 ProASIC3 devices 47 nanometer nm CMOS 47 pn junctions 47 TestKompress 47 #nm [002] 47 SEM TEM 47 singlemode 47 EUV 47 Thermal Oxidation 47 UV absorbance 47 water vapor permeability 47 microreactors 47 P3HT 47 crosspoint switch 47 epitaxial deposition 47 Cadence QRC Extraction 47 Rdson 47 density interconnect HDI 47 4Gb DDR3 47 resin infusion 47 FineSim Pro 47 undoped 47 TEMs 47 output impedance 47 CBT resin 47 Actel Fusion 47 output capacitors 47 TSMC #nm process 47 tensile stress 47 PIN photodiode 47 pin MLF 47 dielectric breakdown 47 substrates 47 RFMD GaN 47 photobleaching 47 cathode catalysts 47 selenide 47 micron 47 polyacrylonitrile 47 #lm [002] 47 lumen maintenance 47 #nm HKMG 47 High Voltage CMOS 47 transparent conductive 47 reticle inspection 47 gallium selenide 47 silane 47 #nm #nm [005] 47 ANTARES 47 dopant 47 Organic Chemical Vapor 47 PowerPAK 47 DFN package 47 electrolytic 47 Applied Endura 47 DDR3 modules 46 eutectic solder 46 m 46 degumming 46 solution processible 46 lasing threshold 46 SiR#DP 46 EUV lithography 46 nickel silicide 46 CMOS wafers 46 Metrology System 46 leadframes 46 SMARTi 46 TiO 2 46 #μm [002] 46 Flexfet 46 SNR signal 46 intermodulation distortion 46 germanium substrates 46 compute density 46 Gigaphoton 46 Czochralski 46 lithographic processes 46 rms jitter 46 Vapor Phase 46 Structured ASICs 46 nanoimprinting 46 W/cm2 46 Lattice FPGAs 46 axial radial 46 silanes 46 diffractive optical elements 46 Stratix IV FPGA 46 #.#mm x [003] 46 #.#ns 46 XRD 46 GLOBALFOUNDRIES #nm 46 wafer thinning 46 Mach Zehnder modulator 46 planar CMOS 46 e beam lithography 46 3mm x 46 Next Generation Lithography 46 fxP 46 Horizon #i 46 mono crystalline solar 46 encapsulants 46 AMD Geode LX #@#.#W 46 CarbonPower R 46 Enable mPE 46 VOC emission 46 ultrasonic welding 46 mrad 46 laser diode modules 46 wafer bumping 46 electro deposition 46 metallic substrates 46 #x# mm [004] 46 LED printheads 46 holemaking 46 SPICE accuracy 46 oxynitride 46 PROLITH 46 ferrite 46 Impinj AEON 46 membrane electrode assembly 46 SOI substrates 46 #.#μm CMOS process 46 VoluMill 46 MB#R# 46 moldability 46 Complementary Metal Oxide Semiconductor 46 magnetic separator 46 CdTe PV 46 ASICs FPGAs 46 TOF TOF 46 nanoimprint lithography NIL 46 MEMS oscillators 46 nanoflow 46 microampere 46 Flexar 46 cathodic 46 ultrasonic spray 46 #x#mm [002] 46 demagnetization 46 BiCMOS 46 mono crystalline silicon 46 Young modulus 46 DDR3 DRAM 46 GaP 46 SMD LEDs 46 CMOS silicon 46 microcavity 46 lasing wavelength 46 CIGS copper indium 46 #nm MirrorBit 46 Gallium Arsenide GaAs 46 transparent conductive coatings 46 high-k/metal-gate 46 Dektak 46 2ppm 46 reflow soldering processes 46 embedded NVM 46 #.#Ω 46 purity silicon 46 bypass capacitor 46 RO membranes 46 ARM#EJ processor 46 random copolymers 46 #pF [002] 46 Oxide Silicon 46 CAPEX OPEX 46 VISIONPAD ™ 46 radial leaded 46 external EEPROM 46 5GT s 46 leadframe 46 interfacial layer 46 photomasks 46 PV module manufacturers 46 sunlight readability 46 reconfigurability 46 formability 46 wafer diameters 46 integral nonlinearity INL 46 Helios XP 46 1W LEDs 46 coplanar 46 MaxEdge 46 Zener diode 46 4mA 46 #/#nm 46 solar PV module 46 HardCopy IV ASICs 46 Gb NAND 46 silicon CMOS 46 varactors 46 #x#mm package 46 MAX# MAX# [001] 46 discharge ESD protection 46 chemical inertness 46 strain gage 46 PowerPro MG 46 1Gbit DDR2 46 hermeticity 46 6mm x 6mm 46 XFP module 46 photolithography 46 x 9mm 46 5x #x 46 heat spreader 46 etching DRIE 46 #nm wavelengths 46 #nm 1Gb 46 ohmic 46 VIISta 46 QSOP 46 MOCVD tools 46 1ns 46 quiescent currents 46 PXI module 46 PbS 46 GaN LEDs 46 SiP 46 crossflow 46 photoemission 46 electroformed 46 ECPR 46 #oC [001] 46 Cortex M0 processor 46 GaAs substrate 46 pre preg 46 TFTs 46 NMOS 46 gasketing 46 Gallium Arsenide 46 Configurable Logic 46 GaN wafer 46 NovaMARS 46 deconvolution 46 AMS RF 46 2Xnm 46 downconverting 46 Powerful debug 46 PeakView 46 Extreme Ultraviolet EUV 46 SOPC Builder 46 Inductance 46 solderable 46 nanometric 46 sapphire wafer 46 submicron 46 Calibre LFD 46 nanometer CMOS 46 dimensionally stable 46 PolyMax 46 #ns [001] 46 photocurrent 46 Heterojunction 46 thermoplastic polyurethane TPU 46 alloying 46 tensile strengths 46 GX# [003] 46 GaAs HBT 46 dv dt 46 XT #i 46 IGBT modules 46 InfiniBand DDR 46 emulsion PCR 46 RedHawk SDL 46 TWINSCAN XT 46 SMT LEDs 46 nucleation layer 46 ECSM 46 interfacial 46 Solamet ® 46 Transparent Conductive Oxide TCO 46 magnetic permeability 46 CyberDisplay #K 46 density NOR flash 46 athermal 46 edge roughness LER 46 ionization mass spectrometry 46 layer ceramic capacitors 46 VIISta HC 46 #.#pF 46 FusionQuad 46 CIGS PV 46 PHY# [001] 46 Lexan sheet 46 responsivity 46 JPEG compression 46 SN#C 46 table LUT 46 singulated 46 Aluminum Nitride 46 TSMC #nm [001] 46 temporary wafer bonding 46 VCOs 46 flyback converter 46 AlGaN GaN 46 dropout voltage 46 IGBT Insulated Gate 46 #.#uA 46 dB insertion loss 46 #nm MLC